Hbm 3d Power Delivery Network Engineer Jobs

Engineer, HIG HBM Product & System Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) — MSB, Singapore. Apply via Workday.

Product Yield Enhancement Engineer, HBM — Boise, ID - Main Site. Apply via Workday.

MTS, HIG-HBM Layout — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Senior Engineer, HIG HBM Media Health — Taichung - Fab 16, Taiwan. Apply via Workday.

Engineer, HIG HBM, Product Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Principal DFT Engineer, HBM — 2 Locations. Apply via Workday.

ENGINEER, PDE HBM NPI — Taichung - Fab 16, Taiwan. Apply via Workday.

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness, performance, power efficiency, and product quality. Develop comprehensive verification plans from architecture and functional specifications in collaboration with architecture and design teams. Create, enhance, and maintain verification environments, UVM testbenches, test suites, and automated regression infrastructures. Define and execute coverage-driven verification strategies to achieve functional, assertion, and code coverage goals. Lead debug and root-cause analysis of complex design issues, drive bug resolution, and ensure verification closure. Apply advanced digital and mixed-signal verification methodologies using industry-standard simulation and verification tools. Drive continuous improvements in verification methodologies, automation, regression efficiency, and AI-assisted verification workflows. Collaborate closely with global design, architecture, product engineering, and system engineering teams to ensure successful project execution. Lead verification efforts for major HBM development programs and mentor engineers through technical leadership and knowledge sharing. Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience. 10+ years of experience in digital and/or mixed-signal design verification with a proven record of deli

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in area/time estimation, scheduling, and execution to meet project schedule/milestones in multiple project environments. • Ability to guide Peer team-members in their execution of Sub block-level layouts & review critical items. • Effectively communicating with Local engineering teams to assure the success of layout project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL development, verification, and delivery of high‑performance digital logic blocks for advanced HBM memory products. In this role, you will translate specifications into robust Verilog/SystemVerilog RTL, evaluate design tradeoffs across power, performance, and area, and apply strong fundamentals in digital logic, computer architecture, and low‑power methodologies. You will collaborate closely with verification, physical design, DFT, CAD, and system architecture teams to deliver high‑quality well‑documented digital designs. Success in this role requires strong technical communication skills, a proactive approach, and the ability to excel in a fast‑paced, highly collaborative engineering environment. Responsibilities: Drive all stages of the digital design flow, including concept definition, specification, RTL implementation, verification support, documentation, and post‑silicon debug. Develop high‑quality RTL in Verilog/SystemVerilog using scalable, parameterized design techniques aligned to architectural specifications. Define and refine micro‑architecture for digital logic blocks, including FSMs, datapath, FIFOs, pipelines, and arbitration logic. Analyze tradeoffs across area, power, latency, and throughput, providing clear documentation and communication of design decisions. Perform CDC/RDC analysis, apply sound clocking and reset strategies, and ide