Hbm Advanced Package Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview｜職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM（High Bandwidth Memory）製造與營運團隊 ，此 evergreen 職缺用於建立長期人才庫，將依業務需求媒合合適職務。 Potential Roles｜涵蓋職務方向（不限於） Manufacturing / Process 製造／製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證／品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造／測試產線主任 Assembly Equipment Engineer / Process Engineer 設備／製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do｜工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI and advanced analytics tools to identify process variation, uncover hidden KPIVs, and accelerate root cause analysis. • Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models to improve process stability, yield, and equipment performance. • Utilize digital solutions (Copilot, Power BI, AI Agents, dashboards, etc.) to automate routine engineering analysis, reporting, and decision-making workflows. • Drive data-driven process optimization through machine learning, pattern recognition, and large-scale manufacturing data analysis. • Partner with Automation, IT, and Data Science teams to implement smart manufacturing solutions and AI-enabled process control methodologies. • Establish and maintain digital twins, predictive maintenance models, and AI-based early warning systems for process and equipment health monitoring. • Identify opportunities to reduce engineering cycle time through AI-assisted experiment design, data mining, and knowledge management platforms. • Lead AI adoption initiatives within the manufacturing organization to improve productivity, quality, cost, and operational efficiency. AI in Job Requirements: •Baseline digital fluency, with the ability to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI and advanced analytics tools to identify process variation, uncover hidden KPIVs, and accelerate root cause analysis. • Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models to improve process stability, yield, and equipment performance. • Utilize digital solutions (Copilot, Power BI, AI Agents, dashboards, etc.) to automate routine engineering analysis, reporting, and decision-making workflows. • Drive data-driven process optimization through machine learning, pattern recognition, and large-scale manufacturing data analysis. • Partner with Automation, IT, and Data Science teams to implement smart manufacturing solutions and AI-enabled process control methodologies. • Establish and maintain digital twins, predictive maintenance models, and AI-based early warning systems for process and equipment health monitoring. • Identify opportunities to reduce engineering cycle time through AI-assisted experiment design, data mining, and knowledge management platforms. • Lead AI adoption initiatives within the manufacturing organization to improve productivity, quality, cost, and operational efficiency. AI in Job Requirements: •Baseline digital fluency, with the ability to use AI-assisted tools to support research, analysis, content creation, problem-solving, or operational tasks relevant to the role. Basic Qualifications M

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming the ways people around the globe engage with information to improve life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Guadalajara, Mexico. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Responsibilities: Design and development of analog, mixed-signal, custom digital block and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Will bee leading planning, area/time estimation, scheduling, delegation and execution to meet project schedule/breakthroughs in multiple project environment. Effectively communicating with Global engineering teams to assure the success of layout project. Minimum Qualification: 5&#43; years of experience in analog/custom layout design in advanced CMOS process, in various

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Develop and optimize HBM assembly and packaging processes to achieve manufacturing targets. Analyze process data and identify improvement opportunities using statistical and data-driven methodologies. Utilize AI-enabled tools and advanced analytics to improve troubleshooting efficiency and accelerate root cause identification. Drive yield improvement, defect reduction, and process capability enhancement initiatives. Support failure analysis activities and implement corrective and preventive actions. Collaborate with cross-functional teams to resolve technical challenges and support new product ramp. Apply digital and AI-assisted workflows to improve operational effectiveness and engineering productivity. Maintain process documentation and ensure compliance with manufacturing standards. Education Bachelor's or Master's degree in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, or related disciplines. Experience 0–2 years of experience for New College Graduates (NCG). Semiconductor manufacturing, packaging, or process engineering experience is a plus. Skills Strong analytical thinking and problem-solving capability. Ability to interpret and analyze large datasets to support engineering decisions. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI and advanced analytics tools to identify process variation, uncover hidden KPIVs, and accelerate root cause analysis. • Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models to improve process stability, yield, and equipment performance. • Utilize digital solutions (Copilot, Power BI, AI Agents, dashboards, etc.) to automate routine engineering analysis, reporting, and decision-making workflows. • Drive data-driven process optimization through machine learning, pattern recognition, and large-scale manufacturing data analysis. • Partner with Automation, IT, and Data Science teams to implement smart manufacturing solutions and AI-enabled process control methodologies. • Establish and maintain digital twins, predictive maintenance models, and AI-based early warning systems for process and equipment health monitoring. • Identify opportunities to reduce engineering cycle time through AI-assisted experiment design, data mining, and knowledge management platforms. • Lead AI adoption initiatives within the manufacturing organization to improve productivity, quality, cost, and operational efficiency. AI in Job Requirements: •Baseline digital fluency, with the ability to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High Bandwidth Memory (HBM) organization develops industry-leading memory solutions that power artificial intelligence, high-performance computing, graphics, and data center applications. The team brings together experts across architecture, design, verification, physical design, product engineering, and validation to deliver advanced memory products that enable the world's most demanding computing workloads. As an HBM Design Development Technical Leadership (DDTL) Intern, you will support the planning, execution, and coordination of next-generation HBM product development programs. You will work closely with technical leaders and engineering teams to track project execution, manage risks, analyze program data, and improve engineering productivity through automation, analytics, and AI-enabled workflows. This role offers exposure to both the technical and leadership aspects of semiconductor product development. Responsibilities Support HBM product execution by tracking schedules, achievements, dependencies, technical risks, and design readiness throughout the development lifecycle. Collaborate with multi-functional engineering teams to monitor project status, coordinate deliverables, and support successful achievement completion. Develop dashboards, reports, data analytics solutions, and executive summaries to provide transparency into program health and key performance indicators. Create automation tools, workflow improvements, and AI-assisted solutions that improve engineering productivity, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within Micron’s Heterogeneous Integration Group (HIG), we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI, high-performance computing, and data-centric applications. Our team collaborates across design, product, manufacturing, and ecosystem partners to deliver innovative memory technologies with exceptional quality and execution excellence. The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule. Responsibilities: Lead tapeout execution and release coordination for HBM builds, managing schedules, DBR achievements, and release readiness Drive preparation, review, and completion of tapeout collateral, including TOAST, RCDB, TWIT, and related release documentation Coordinate signoff readiness across timing, power, physical verification, integration, and other release-critical activities Ensure database quality, completeness, traceability, and signoff evidence are in place prior to tapeout Manage release risks, waivers, open items, and governance processes while maintaining strong r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology has delivered world‑leading memory and semiconductor solutions. As an HBM Memory Design Engineer on the HBM Architecture Team, you will design, simulate, optimize, and floorplan advanced DRAM circuits for next‑generation High Bandwidth Memory products. You will work across digital, analog, and mixed-signal domains to ensure functional correctness, performance, and power efficiency. Your role includes collaborating with globally distributed teams developing modern HBM solutions for AI and ML applications. Responsibilities • Design, simulate, and optimize DRAM memory arrays, data paths, ECC, command/control logic, and high‑speed interface circuits • Evaluate block‑level and full‑chip functionality and propose solutions to ensure functional correctness • Analyze timing, area, power, and complexity trade‑offs in high‑speed DRAM and mixed‑signal designs • Perform pathfinding and feasibility studies for new architectures and future HBM products • Contribute to the design, layout, and optimization of memory, logic, and analog circuits • Support large‑scale verification, debug, and silicon validation activities • Collaborate across multi-functional teams involved in TSV‑based 3D stacking and vertical integration • Participate in design reviews and drive continuous improvement of design methodologies Minimum Qualifications • BSEE with 7&#43; years or MSEE with 5&#43; years of relevant engineering experience • Strong knowledge of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts Experience with wafer probe and fin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications. Responsibilities Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products. Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits. Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy. Conduct pathfinding and feasibility studies for next‑generation HBM architectures. Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs. Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits. Collaborate with global engineering teams to drive innovation and support vertical integration across design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction At Micron's High Bandwidth Memory (HBM) team, we develop advanced memory solutions that enable next-generation artificial intelligence and high-performance computing applications. We collaborate across global engineering teams to deliver innovative semiconductor technologies that help transform how the world uses information. Join us and help build the future of memory innovation! Position Overview As a Layout Build Engineer within the HBM organization in Guadalajara, Mexico, you will develop and integrate analog, mixed-signal, and custom digital layouts for advanced memory solutions. You will support physical build implementation, verification, and project execution while collaborating with global engineering teams to deliver high-quality layouts on schedule. This role contributes directly to AI-enabled and high-performance computing products through efficient and reliable layout development. Responsibilities Develop analog, mixed-signal, custom digital block layouts, and support full-chip integration activities. Perform layout verification activities, including Build Rule Check (DRC), Layout Versus Schematic (LVS), antenna checks, quality reviews, and documentation. Deliver block-level layout builds on schedule while meeting established quality requirements. Lead layout planning, area and schedule estimation, task delegation, and execution across multiple concurrent projects. Work together with international engineering groups to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic