Hbm Advanced Package Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in area/time estimation, scheduling, and execution to meet project schedule/milestones in multiple project environments. • Ability to guide Peer team-members in their execution of Sub block-level layouts & review critical items. • Effectively communicating with Local engineering teams to assure the success of layout project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Technical Leadership Plrogram - Member Of Technical Staff – HBM Verification Location: Hyderabad, India Experience : 12+ years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor and guide verification engineers on guidelines and advanced methodologies. Evaluate and integrate AMS Co-Simulation techniques for mixed-signal IP verification. Work closely with EDA vendors to adopt the l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As a DLT Shift Engineer within Advanced Packaging Technology Development Manufacturing Development Engineering (APTD MDE), you will provide shift-based execution support for Die Level Technology development activities in Taiwan. You will sustain development lot movement, respond to process and equipment abnormalities, support issue containment and escalation, and help maintain safe, efficient development execution across rotating day and night shifts. You will collaborate with Process Development, Process Integration, Manufacturing, Equipment Engineering, and other cross-functional teams to support HBM technology development. This role provides hands-on experience in advanced packaging processes, new equipment and material evaluations, Statistical Process Control (SPC), redundancy tool deployment, structured problem solving, and data-driven execution improvement. Key Responsibilities Shift-Based Development Execution l Support DLT technology development in a rotating day- and night-shift environment, including development lot execution, abnormal lot response, and shift-to-shift communication. l Monitor assigned development devices and DLT process levels, execute approved process activities, and maintain accurate records in accordance with established procedures. l Provide clear and timely shift handoffs, including current lot status, process risks, open issues, containment actions, and required follow-up. l Support continuous developmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, Generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency . • Utilize AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime. • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms. • Familiar with TCB/DB process and possesses a minimum of 5 years of semiconductor equipment engineering experience . • Identify, diagnose, and resolve assembly equipment related issues utilizing data-driven and AI-supported methodologies. • Coordi nate and execute process, equipment, and material evaluations, leveraging AI insights to optimize manufacturing performance and quality. • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies. • Validate and qualify new processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production. We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production. Responsibilities will include, but are not limited to: Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the d esign and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Design Engineer, you will build the future of memory by architecting and delivering high‑performance DRAM circuit compositions for advanced technology nodes. In this highly visible technical leadership role, you’ll develop innovation across building, layout, verification, and silicon validation. You will collaborate closely with multi-functional teams to deliver scalable, manufacturable solutions for next-generation memory products. Your work will directly influence performance, power, reliability, and time‑to‑market for Micron’s groundbreaking memory technologies. Responsibilities Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet aggressive power, performance, and reliability targets Develop and refine floorplans, routing strategies, power delivery networks, sense margins, timings, and die‑size tradeoffs Perform advanced circuit simulations using FINESIM, HSPICE, and VERILOG, analyzing speed, power, noise, and long‑term reliability Model parasitics, verify power and signal integrity, and support validation, reticle experiments, and tape‑out revisions Drive simulation‑to‑silicon correlation, identify gaps, and recommend schematic and layout improvements Lead technical reviews, documentation, and best‑practice standardization across design and layout teams Coordinate and manage layout and build resources, tracking breakthroughs and resolving critical path issues S

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in area/time estimation, scheduling, and execution to meet project schedule/milestones in multiple project environments. • Ability to guide Peer team-members in their execution of Sub block-level layouts & review critical items. • Effectively communicating with Local engineering teams to assure the success of layout project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact the future of memory technology! You will be working in an ambitious environment with a team of world-class engineers to build and analyze digital, analog, and mixed-signal circuits for advanced memory products. Our collaborative approach ensures flawless solutions and innovation, driving the success of future memory generations. Responsibilities Contribute to the development, optimization, and layout of Memory, Logic, and Analog circuits for next-generation memory products. Perform parasitic modeling and support build validation, reticle experiments, and required tape-out revisions. Coordinate and guide the layout process including floor-planning, placement, routing, and physical integration. Conduct circuit modeling and simulation using industry-standard tools to verify timing, functionality, and reliability. Collaborate across CAD, modeling, standards, and verification groups to align with best-known-methods and improve build quality. Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ensure accurate manufacturability and product readiness. Support cross-team communication to promote standardization, consistency, and shared engineering success. Propel innovation through contributions to methodologies, architectures, and technologies for upcoming memory generations. Minimum Qualifications Bach

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu