Hbm Assembly Capacity Ie Manager Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HBM Design Architecture — Principal Engineer Role Overview We are seeking a highly motivated HBM Design Architecture Engineer (Principal Engineer) to drive exploration and definition of next‑generation AI memory and system environments. In this role, you will analyze emerging infrastructure trends, build performance models, and develop/extend tooling that informs HBM architecture decisions and system‑level trade‑offs. You will work closely with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable memory subsystem and architectural intercept strategies. Key Responsibilities You will own and contribute to projects such as: Research and synthesize emerging trends in compute, networking, and storage infrastructure to anticipate how future AI systems will evolve. Lead HBM architecture analysis by defining bandwidth/latency targets, identifying constraints, and translating workload and system data into actionable memory requirements. Develop and maintain simulation frameworks to model AI cluster performance and memory subsystem behavior; validate models against internal and external benchmarks. Build and apply first‑order performance models spanning HBM bandwidth/latency, GPU/CPU interactions, and memory hierarchy trade‑offs to guide architectural decisions. Create and curate trend dashboards using CSP benchmar

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron’s industry leading dynamic random access memory products. The team drives process R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. We work across architecture, engineering, and business teams to evaluate innovative memory solutions and influence product direction. If you’re excited about solving complex challenges in DDR and emerging memory technologies, you’ll find strong impact and collaboration here! We are seeking an experienced Distinguished Member of Technical Staff (DMTS) Design Engineer to join the DRAM System team. This role is at the center of memory innovation. You will analyze current and next-generation memory technologies, identify performance and design gaps, and guide teams on future memory direction. Your work will directly influence architecture, product strategy, and competitive positioning, making it both highly visible and technically rewarding. This position is intended to be part of the Technical Leadership Program at Micron. This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Location: Boise, ID or San Jose, CA Responsibilities:

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we believe in encouraging a culture of innovation and excellence. The PDE Process Integration (PI) Senior Manager role offers an outstanding chance to lead a distributed team in defining, standardizing, and driving High Bandwidth Memory (HBM) New Product Introduction (NPI) success across several locations. This position blends strategic leadership, scaling of operations, and coordination across sites. It aims to ensure consistent PI readiness, faster yield ramp, and strong risk management from development through High Volume Manufacturing (HVM). Job Responsibilities Define and drive PI strategy, standards, and guidelines across HBM programs. Coordinate PI execution across multiple HBM NPI programs, ensuring delivery against network-level achievements and ramp targets. Ensure robust risk identification, early detection mechanisms, and mitigation strategies. Serve as the central PI leader collaborating with various engineering and manufacturing organizations. Champion the adoption of AI-enabled tools for yield analysis and risk prediction. Organizational Leadership & Talent Strategy Guide and grow a group of PI managers and senior engineers spanning several locations or departments.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information into intelligence through industry-leading memory and storage solutions. The Process Development Engineering team drives innovation for future DRAM and HBM technologies by developing and optimizing semiconductor manufacturing processes that enable next-generation memory products. Our engineers work at the intersection of advanced research and high-volume manufacturing to solve complex technical challenges and accelerate technology advancement. As a Process Development Engineering Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within a fast-paced research and development environment. Under the mentorship of experienced engineers, you will collaborate across process and equipment teams to develop innovative solutions that meet demanding product requirements. The internship concludes with a formal presentation of your project results to technical and leadership audiences. Responsibilities Develop and optimize semiconductor processes that meet physical and electrical performance requirements for current and future memory products. Partner with multi-functional process and equipment engineering teams to identify and implement process improvements. Perform root-cause analysis and failure-mode analysis to identify process limitations and develop corrective actions. Conduct fundamental research to support next-generation memory technologies and process innov

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout. · Interpret product specifications and design circuits to meet the required functionality. · Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators , DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory ( HBM ) products · Integration of modules with Power delivery network and propose design solution for optimum performance · Deep understanding of Array and its peripheral circuits. · Driving innovation into the future Memory generations within a dynamic work environment · Validate & optimize design for reliability (Device stress, Aging effect) · EM/IR simulation, optimize layout to achieve best circuit performance ·

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product Engineering, Design Engineering , System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that imp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. High-bandwidth memory (HBM) is an innovative memory solution that uses 3D stacking of DRAM for fast speeds, expansive bandwidth and low power per transaction. HBM is primary solution for AI applications. As a Micron Global Quality FE Central (Senior) QE Product Engineer, you will be a member of the worldwide quality team, responsible for driving quality and reliability initiatives into FE MFG network for high bandwidth memory (HBM) product for critical customer AI applications. You will work closely with PE/GQ QRA/FE fab teams and Central PIE to establish BKMs, set up program with line of sight metric, develop a strategy and closely work on execution to achieve program milestones for customer field DPM excellence. You will also work with smart manufacturing AI team for automation and AI solution development and deployment to continue helping HBM quality management with AI transformation. Responsibilities and Tasks: <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. DRAM ASIC Architecture Role Overview Micron is seeking an experienced architect to drive the definition of next-generation DRAM products incorporating advanced CMOS-based logic die technologies. This role will help define how future DRAM products leverage advanced CMOS logic die technologies to enable higher levels of integration, observability, reliability, power efficiency, security, and system differentiation beyond what is achievable in conventional DRAM-only implementations. The architect will define architectures that leverage advanced logic die capabilities to complement and enhance DRAM functionality across LPDDR, DDR, HBM and future heterogeneous memory solutions. The successful candidate will architect I/O, reliability, manageability, interface, test and system-enhancement functions. The role requires strong collaboration across DRAM design, ASIC architecture, packaging, process technology, product engineering, validation, firmware, and system architecture teams. Key Responsibilities Define next-generation DRAM &#43; logic-die architectures, including functional partitioning between DRAM arrays, peripheral circuitry, and advanced CMOS logic die platforms – to optimize performance, power, cost, reliability, and product differentiation. Identify and evaluate system, interface, reliability, test, management, and control functions that may benefit from advanced logic-die implementations; perform architectural tradeoff analysis coverin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3&#43; years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role We are looking for a passionate and innovative ATE Test Engineer to design and deliver cutting-edge test solutions for HBM-DRAM devices using modern advanced ATE platforms. In this role, you will lead the development and implementation of test plans, ATE test programs, silicon validation, and test methodologies, while driving multi-site hardware design and development, product characterization, and high-volume production support. Success in this position requires a forward-thinking mindset and the ability to apply the right technologies to meet evolving challenges. Key Responsibilities Develop and implement robust test strategies, plans, and ATE programs for HBM-DRAM devices. Drive silicon validation, characterization, and yield improvement initiatives. Design and debug test hardware, including schematic capture and PCB layout. Collaborate cross-functionally to ensure seamless integration of test solutions into production. Support high-volume manufacturing and troubleshoot complex test issues. Qualifications & Skills Education: Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering. Experience: A

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Development Engineer in the Media Health team, you will act as a key interface between a variety of engineering groups and specialties, improving a diverse range of expertise to innovate new and improved test strategies, features, and technologies! You will have or develop guide capability with Probe, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering (DE) to run simulations pre-silicon to validate test strategies and Design for Test circuits. Provide feedback to DE, Test Engineering (TE), and others in Product Engineering (PE) Assist in pre-silicon checklist items and work with TE to define required tester resources Work with TE and PE to modify test programs for specific product requirements to ensure that silicon performance meets expectations Support TE by aiding in test program debug, data analysis, and test development Support fabrication sites and process integration through test development to increase effective process feedback Debug and identifying root causes for failures using test and experimental data, and elec