Hbm Mrda Shift Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Member of Technical Staff or Member of Technical Staff, DRAM Design Engineer in the next-generation HBM Architecture team, you will drive the architecture and optimization 3D-stacked, high-performance memories. Apply your knowledge to optimize DRAM designs and architectures for maximum performance, power, and area (PPA). This role is ideal for experienced DRAM designers who will identify, architect, design, and simulate next-generation architectures and memory features in collaboration with experts in stack architecture, memory systems architecture, and SoC microarchitecture. Responsibilities: Identify and develop novel DRAM circuit architectures that anticipate next-generation AI workload requirements, to unlock improvements in bandwidth and energy efficiency. Collaborate with peers to identify the highest-leverage DRAM circuit bottlenecks and define architectural hypotheses. Validate architectural hypotheses through schematic-level circuit design, SPICE simulation, and tradeoff analysis, establishing PPA feasibility. Partner with layout designers to conduct floorplanning studies. Colla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Lead end-to-end layout execution of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. Own full-chip technical decisions covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). Technical Expertise : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. Drive project planning and execution , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. Ensure timely delivery with quality , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. Perform and oversee layout verification activities including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. Lead and mentor the layout team , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. Drive innovation and productivity improvements , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design layout for leaf cells, standard cells (Stdcell), or sub-blocks. Apply a systematic, meticulous, and methodical approach to IC layout design. Interpret DRC/LVS and other physical verification checks to ensure design accuracy. Demonstrate ownership and proactively plan work to meet project timelines. Collaborate effectively with internal teams to ensure successful layout project execution. Minimum Qualifications Bachelor’s, Master’s, or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or related fields. Graduation within the last 2 years (Bachelor’s, Master’s, or PhD). Strong knowledge of electronic circuit concepts. Experience using circuit simulation and design tools. Effective interpersonal and problem-solving skills. English communication skills (conversational level required). Self-motivated, enthusiastic, and collaborative standout colleague. Passion for technology and willingness to grow in the semiconductor industry. Preferred Qualifications Internship or academic project experience in pre-silicon circuit design. Understanding of pre-silicon development areas such as analog circuits and physical design. Basic knowledge of MOS concepts, semiconductor fabrication, and analog layout fundamentals. Strong interpersonal skills and goal-oriented perspective. Experience with programming or script

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming the ways people around the globe engage with information to improve life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Guadalajara, Mexico. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Responsibilities: Design and development of analog, mixed-signal, custom digital block and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Will bee leading planning, area/time estimation, scheduling, delegation and execution to meet project schedule/breakthroughs in multiple project environment. Effectively communicating with Global engineering teams to assure the success of layout project. Minimum Qualification: 5&#43; years of experience in analog/custom layout design in advanced CMOS process, in various

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional responsibilities include, but are not limited to: Responsibilities: Performs electrical or mechanical troubleshooting to determine problems in non-functioning electro-mechanical equipment used in the manufacturing process Dismantles, adjusts, repairs and assembles equipment according to layout plans, blueprints, operating or repair manuals, rough sketches or drawings Uses test and diagnostic equipment to perform checkouts. Rebuilds manufacturing equipment as required May perform equipment modifications as directed by engineers. Successful Candidates must have the following Qualifications: Knowledge of AC/DC circuits, including: fundamentals of electricity, and basic electronic components and circuits Strong mechanical aptitude with the ability to understand and fix mechanical systems Vacuum system knowledge and troubleshooting ability Ability to use schematic diagrams to troubleshoot systems to components level Intermediate PC skills including a familiarity with MS Office Suite. Understanding of the process flow related to area equipment Problem-solving skills and the ability to efficiently prioritize tasks Ability in multi-tasking complex projects and enjoy working in a fast pace environment Time management, organization, and prioritization skills Follows procedures and work with minimal supervision</li

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: New Product Operations (NPO) Product Manager (HBM) plays a critical role in driving successful planning and execution of early lifecycle phases for New Product Introduction (NPI) products and this role will support the enablement of industry leading High Performance memory products (HBM). This position ensures alignment across the value chain to achieve predictable manufacturing readiness and seamless transition to High Volume Manufacturing (HVM). Key Responsibilities: • Be the program Operations liaison in core HBM Product Development Teams (PDT’s) driving all Operations Requirements (Supply Chain, Manufacturing, Procurement, Compliance, Logistics) and representing Operations in executive reporting forums. • Participate early in the Product Lifecycle Management (PLM) process to address manufacturing operations and enterprise system concerns for new products. • Maintain schedules for ramp and a smooth transition to HVM, ensuring milestones are met. • Oversee sample processes, ensuring delivery meets specifications, customer expectations, and On-Time Delivery (OTD)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertise :

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Lead the layout design and development of complex analog, mixed-signal, and digital blocks and full chip level integration Ensure timely delivery of high-quality block-level layouts, meeting project milestones and design specifications. Perform layout verification including LVS, DRC, and antenna checks, along with thorough quality reviews and documentation. Collaborate with global engineering teams to ensure successful execution and integration of layout projects. Provide technical guidance and mentorship to junior team members, reviewing sub-block layouts and supporting their development. Demonstrate leadership in planning, time estimation, scheduling, and execution across multiple projects. Contribute actively to project management and cross-functional coordination. Proven experience in IC layout design with a systematic and methodical approach. Strong attention to detail and a passion for high-quality design. Excellent communication and collaboration

Senior/Staff HBM PYE Product Development Failure Analysis Engineer — Boise, ID - Main Site. Apply via Workday.

Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer — Fab 10A, Singapore. Apply via Workday.

Senior Engineer – HBM PE Component Validation (Singapore) — Fab 10A, Singapore. Apply via Workday.

STAFF ENG-HIG-HBM-LAYOUT — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Staff/Principal Engineer - HBM Design for Test (DFT) — Richardson, TX. Apply via Workday.

STAFF ENG-HIG-HBM-LAYOUT — Jalisco, Mexico. Apply via Workday.