Hbm Mrda Shift Process Engineer Jobs

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness, performance, power efficiency, and product quality. Develop comprehensive verification plans from architecture and functional specifications in collaboration with architecture and design teams. Create, enhance, and maintain verification environments, UVM testbenches, test suites, and automated regression infrastructures. Define and execute coverage-driven verification strategies to achieve functional, assertion, and code coverage goals. Lead debug and root-cause analysis of complex design issues, drive bug resolution, and ensure verification closure. Apply advanced digital and mixed-signal verification methodologies using industry-standard simulation and verification tools. Drive continuous improvements in verification methodologies, automation, regression efficiency, and AI-assisted verification workflows. Collaborate closely with global design, architecture, product engineering, and system engineering teams to ensure successful project execution. Lead verification efforts for major HBM development programs and mentor engineers through technical leadership and knowledge sharing. Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience. 10+ years of experience in digital and/or mixed-signal design verification with a proven record of deli

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Design Engineer, you will build the future of memory by architecting and delivering high‑performance DRAM circuit compositions for advanced technology nodes. In this highly visible technical leadership role, you’ll develop innovation across building, layout, verification, and silicon validation. You will collaborate closely with multi-functional teams to deliver scalable, manufacturable solutions for next-generation memory products. Your work will directly influence performance, power, reliability, and time‑to‑market for Micron’s groundbreaking memory technologies. Responsibilities Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet aggressive power, performance, and reliability targets Develop and refine floorplans, routing strategies, power delivery networks, sense margins, timings, and die‑size tradeoffs Perform advanced circuit simulations using FINESIM, HSPICE, and VERILOG, analyzing speed, power, noise, and long‑term reliability Model parasitics, verify power and signal integrity, and support validation, reticle experiments, and tape‑out revisions Drive simulation‑to‑silicon correlation, identify gaps, and recommend schematic and layout improvements Lead technical reviews, documentation, and best‑practice standardization across design and layout teams Coordinate and manage layout and build resources, tracking breakthroughs and resolving critical path issues S

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in area/time estimation, scheduling, and execution to meet project schedule/milestones in multiple project environments. • Ability to guide Peer team-members in their execution of Sub block-level layouts & review critical items. • Effectively communicating with Local engineering teams to assure the success of layout project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL development, verification, and delivery of high‑performance digital logic blocks for advanced HBM memory products. In this role, you will translate specifications into robust Verilog/SystemVerilog RTL, evaluate design tradeoffs across power, performance, and area, and apply strong fundamentals in digital logic, computer architecture, and low‑power methodologies. You will collaborate closely with verification, physical design, DFT, CAD, and system architecture teams to deliver high‑quality well‑documented digital designs. Success in this role requires strong technical communication skills, a proactive approach, and the ability to excel in a fast‑paced, highly collaborative engineering environment. Responsibilities: Drive all stages of the digital design flow, including concept definition, specification, RTL implementation, verification support, documentation, and post‑silicon debug. Develop high‑quality RTL in Verilog/SystemVerilog using scalable, parameterized design techniques aligned to architectural specifications. Define and refine micro‑architecture for digital logic blocks, including FSMs, datapath, FIFOs, pipelines, and arbitration logic. Analyze tradeoffs across area, power, latency, and throughput, providing clear documentation and communication of design decisions. Perform CDC/RDC analysis, apply sound clocking and reset strategies, and ide

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network. Main Responsibilities Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work. Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualific

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact the future of memory technology! You will be working in an ambitious environment with a team of world-class engineers to build and analyze digital, analog, and mixed-signal circuits for advanced memory products. Our collaborative approach ensures flawless solutions and innovation, driving the success of future memory generations. Responsibilities Contribute to the development, optimization, and layout of Memory, Logic, and Analog circuits for next-generation memory products. Perform parasitic modeling and support build validation, reticle experiments, and required tape-out revisions. Coordinate and guide the layout process including floor-planning, placement, routing, and physical integration. Conduct circuit modeling and simulation using industry-standard tools to verify timing, functionality, and reliability. Collaborate across CAD, modeling, standards, and verification groups to align with best-known-methods and improve build quality. Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ensure accurate manufacturability and product readiness. Support cross-team communication to promote standardization, consistency, and shared engineering success. Propel innovation through contributions to methodologies, architectures, and technologies for upcoming memory generations. Minimum Qualifications Bach

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work Cont

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Hyderabad, India. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. • Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri