Hbm Mrda Shift Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Senior Analog Design Engineer to join our High Bandwidth Memory (HBM) team. This role is responsible for the architecture, design, simulation, and silicon bring ‑ up of high ‑ performance analog and mixed ‑ signal circuits used in HBM PHYs and supporting infrastructure. The ideal candidate has deep expertise in high ‑ speed I/O, clocking, power management, and advanced ‑ node analog design, and has successfully delivered silicon to production. Responsibilities will include, but are not limited to: Design and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Principal Engineer – HBM Verification Location: Hyderabad, India Experience : 12&#43; years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Engineer, Principal Engineer, or Member of Technical Staff, Design Architect in the Next-generation HBM Architecture Team, you will design, simulate, analyze, and optimize the architecture of 3D-stacked, high-performance memories. Apply your knowledge to explore trade-offs in 3D-stacked logic and memory designs in close collaboration with peer architecture and design teams. Your responsibilities will include definition of, evaluation of, and specification of circuit implementations, technology requirements, thermal performance improvements, power delivery architectures, and on- and off-chip interfaces. Responsibilities: Design, optimize, and simulate critical analog and/or mixed-signal circuits. Architect and design power delivery for high-performance, stacked memories. Analyze, specify, and prototype on-/off-chip interfaces. Perform timing, area, power, and complexity analysis for high-performance, low-power circuits. Define architectures for improved thermal management. Conduct pathfinding activities for future-generation stacked-memory products. Com

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges. Responsibilities: Develop a strong understanding of customer system architecture, application requirements, and integration challenges. Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams. Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies. Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration. Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements. </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Physical Verification Engineer, you will be a key technical contributor within the Heterogeneous Integration Group (HIG), responsible for defining, executing, and driving sign-off quality physical verification flows for next‑generation HBM logic die and memory‑centric SoCs. You will work across physical design, design rule development, EDA tool teams, foundry interfaces, and product engineering teams to deliver industry‑leading, tape-out-ready silicon under aggressive schedule, quality, and reliability constraints. This role combines full-chip physical verification ownership — including DRC, LVS, ERC, and DFM — with deep collaboration across implementation and silicon bring‑up, ensuring design integrity from layout through first silicon. Responsibilities will include, but are not limited to: Implement physical verification sign‑off for full‑chip and hierarchical designs, including Design Rule Check (DRC), Layout Versus Schematic (LVS), Electrical Rule Check (ERC), Physical Electrical Rule Check (PERC), antenna checking, and Design for Manufacturability (DFM). Implement and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

MTS, HIG-HBM Layout — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Senior Engineer, HIG HBM Media Health — Taichung - Fab 16, Taiwan. Apply via Workday.