Hbm Mrda Shift Process Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of complex full chip custom designs with advanced low power and power management technologies spread across multiple categories such as memories that are capable of operating at high speeds. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on cross functional tasks that can widen your skill set. Responsibilities Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for HBM emerging memory architectures and features. Participate in developing verification methodology and verification environments for advanced HBM and emerging memory products. Co-work with international colleagues on developing new verification flows to take on the challenges in HBM and emerging memory design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Applying AI for automation of technical and non - technical process is required. Minimum Qualifications: 5+ years of experience in pre-silicon verification BE or

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive cross-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor junior engineers and provide technical leadership to project teams. Define and improve design methodologies utilizing AI-enabled tools, automation, and best practices. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and stakeholders. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field. 8+

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Platform Architecture team defines the electrical, thermal, and power-delivery architectures that enable Micron's next-generation High Bandwidth Memory (HBM) solutions. Working closely with architecture, design, packaging, and technology teams, the organization drives innovation in signaling, power integrity, thermal management, and system optimization to support AI, high-performance computing, and data center applications. As an HBM Platform Architecture Intern, you will contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures for advanced memory systems. You will work alongside experienced architects to analyze design trade-offs, develop modeling tools, and investigate solutions that improve performance, power efficiency, reliability, and scalability for next-generation memory products. Responsibilities Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies. Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems. Analyze power delivery networks (PDNs), including IR-drop, electromigration (EM), power integrity, and power grid optimization for advanced HBM architectures. Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities. Collaborate with architecture, design, packaging, and technology teams to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions that power artificial intelligence, high-performance computing, and data center applications. The team drives architectural innovation across memory systems, controllers, interfaces, and reliability features to deliver industry-leading performance, scalability, and efficiency for future computing platforms. As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal behavior, and memory controller interactions. Develop and enhance performance models, simulators, and analytical tools using Python, C++, or similar technologies to assess architectural trade-offs and system performance. Analyze workload behavior, simulation results, and architectural data to provide recommendations for future HBM product development. Utilize AI-assisted engineering tools and workflows to accelerate software development, specification analysis, data exploration, and technical documentat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Build, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor engineers with less experience and provide technical leadership to project teams. Define and improve compose methodologies applying AI-enabled tools, automation, and protocols. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Location: Richardson, TX We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities · Lead the design and execution of sophisticated memory subsystems and top-level integration activities. · Own design planning, technical decision-making, risk assessment, and schedule execution. · Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. · Review design specifications, microarchitecture documents, and implementation plans. · Drive memory array design, including address decoders and data path, internal power supplies, and custom circuit design activities depending on project needs. · Lead design reviews and drive issue resolution across organizations. · Guide engineers who are developing their skills and provide technical leadership to project teams. · Define and improve building methodologies by applying AI-enabled tools, automation, and guidelines. · Support silicon bring-up, debug, characterization, and yield improvement activities. · Communicate project status, risks, and mitigat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives. As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality. Responsibilities Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions. Collaborate with architects and multi-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans. Support design-quality activities including simulation, synthesis, static timing analy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive multi-functional collaboration across Building, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. Key Responsibilities Lead the design and execution of complex memory subsystems and top-level integration activities. Own design planning, technical decision-making, risk assessment, and schedule execution. Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability. Review design specifications, microarchitecture documents, and implementation plans. Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs. Lead design reviews and drive issue resolution across organizations. Mentor early-career engineers and provide technical leadership to project teams. Define and improve develop methodologies applying AI-enabled tools, automation, and standard processes. Support silicon bring-up, debug, characterization, and yield improvement activities. Communicate project status, risks, and mitigation plans to management and collaborators. Required Qualifications BS/MS/PhD in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction At Micron's High Bandwidth Memory (HBM) team, we develop advanced memory solutions that enable next-generation artificial intelligence and high-performance computing applications. We collaborate across global engineering teams to deliver innovative semiconductor technologies that help transform how the world uses information. Join us and help build the future of memory innovation! Position Overview As a Layout Build Engineer within the HBM organization in Guadalajara, Mexico, you will develop and integrate analog, mixed-signal, and custom digital layouts for advanced memory solutions. You will support physical build implementation, verification, and project execution while collaborating with global engineering teams to deliver high-quality layouts on schedule. This role contributes directly to AI-enabled and high-performance computing products through efficient and reliable layout development. Responsibilities Develop analog, mixed-signal, custom digital block layouts, and support full-chip integration activities. Perform layout verification activities, including Build Rule Check (DRC), Layout Versus Schematic (LVS), antenna checks, quality reviews, and documentation. Deliver block-level layout builds on schedule while meeting established quality requirements. Lead layout planning, area and schedule estimation, task delegation, and execution across multiple concurrent projects. Work together with international engineering groups to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal Engineer, you will be a senior technical authority who owns complex validation scopes, optimizes test flows, and leads technical problem solving for next generation HBM products. You’ll drive coverage completeness, improve detection efficiency, and mentor junior engineers—ensuring flawless product readiness through deep platform, Verilog simulation, and analysis expertise. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient IQP/ETV material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across MBIST and flows; drive Hot/Cold corners , TSV screen/AQLK , async timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on SM3/Cobra and Advantest V93K ; enforce code quality, reviews, and r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits • AI Relevant Job Responsibilities: - Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. - Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how th