Hbm Mtb Ai Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an HBM Design Engineer, you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products . You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. Responsibilities Design Support: Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). Silicon Debug: Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. Cross-Functional Collaboration: Work closely with DE, PE, TD, and system teams

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that power Artificial Intelligence (AI), high-performance computing, graphics, and data center applications. Our team collaborates across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver next-generation memory technologies. As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products. This internship provides hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to real-world memory design projects in a collaborative global environment. Responsibilities Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis. Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis using AI-enabled engineering techniques where appropriate. Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development. Document technical work

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next‑generation computing. In this role, you will own design for test (DFT) solutions for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work will directly enable manufacturability, quality, and successful silicon bring‑up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full‑chip levels while partnering closely with register‑transfer level (RTL) d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: • Own and deliver critical HBM IO blocks and subsystems from architectural definition through circuit and RTL implementation, verification, tape-out, silicon bring-up, and post-silicon debug, including interfaces supporting future CPO systems. • Define HBM PHY, controller-to-PHY, die-to-die, clocking, training, calibration, power-management, error-handling, and test requirements for advanced heterogeneous systems. • Drive robust, high-performance builds by balancing bandwidth, latency, power, area, reliability, electrical signal quality, power stability, yield, and manufacturability trade-offs. • Lead architecture and design of analog, mixed-signal, and digital interface functions used in high-speed memory subsystems. • Partner with package, interposer, physical design, signal integrity, power integrity, and thermal teams to optimize interface implementation across 2.5D and 3D systems. • Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, RTL, architecture, process, package, interposer, and system interactions. • Serve as technical project lead for one or more advanced interface programs, coordinating execution across architecture, design, layout, verification, validation, packaging, test, and product engineering teams. • Define and communicate technical priorities, interface specifications, execution plans, risks, dependencies, and schedule impacts. • Work with internal teams, customers, IP pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities • Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership qualities in area/time estimation, scheduling, and execution to meet project schedule/milestones in multiple project environments. • Ability to guide Peer team-members in their execution of Sub block-level layouts & review critical items. • Effectively communicating with Local engineering teams to assure the success of layout project

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of the Heterogeneous Integration Group within Technology and Products, where we build High Bandwidth Memory solutions that power AI and ML platforms. Our team works at the edge of what’s possible, stacking and integrating advanced silicon technologies to deliver industry‑leading bandwidth, density, and power efficiency. We move fast, solve hard problems, and set technical direction others follow! This role sits at the center of next‑generation HBM development. As a senior SI/PI technical authority, you will shape system‑level decisions that directly impact performance, reliability, and scalability across multiple product generations. If you enjoy deep technical ownership, complex problem solving, and influencing architecture from concept to sign‑off, this role offers both challenge and impact. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency‑ and time‑domain evaluation Define and drive power delivery architecture, impedance targets, and transient analysis Perform electromagnetic extraction and modeling across PCB, package, and interposer designs Establish SI/PI standards, methodologies, and sign‑off criteria for HBM system designs Provide clear technical direction in ambiguous or incomplete design environments Minimum Qualifications: 7 years of experience in

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Develo

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will: Be responsible for system-level validation, failure analysis, characterization, and experimentation of customer systems Run and configure diagnostic software, design experiments, analyze and interpret data, creating custom tools (Hardware and Software), presenting data to customers both inside and outside Micron Provide technical customer integration support at customer locations. To accomplish these responsibilities, you will use a variety of equipment (oscilloscopes, logic analyzers, signal generators, multi-meters, etc.) Work with customers and memory enablers like GPU manufacturers to attain design wins and qualifications of Micron memory products in their applications You will work with other engineers within the HBM team, Product Engineering, FAE, Quality Assurance, and business unit teams Debug Micron Product Customer Failures Provide technical support to customers and the field sales Utilize diagnostics to reproduce the original failure Identify failure mechanism Collaborate with Product Engineering and Return Material Authorization (RMA) </l

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, Generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency . • Utilize AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime. • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms. • Familiar with TCB/DB process and possesses a minimum of 5 years of semiconductor equipment engineering experience . • Identify, diagnose, and resolve assembly equipment related issues utilizing data-driven and AI-supported methodologies. • Coordi nate and execute process, equipment, and material evaluations, leveraging AI insights to optimize manufacturing performance and quality. • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies. • Validate and qualify new processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv