Hbm Mtb Ai Jobs

HBM Manufacturing Production Engineer — Taichung - MTB, Taiwan. Apply via Workday.

HBM MRDA SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Equipment Technician 輪班助理工程師 — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

SR. HBM Stacking Process Engineer — Taichung - MTB, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview At Micron, we are committed to world-class performance and innovation. As a SR ENGINEER, MTB QE OPS, you will be essential in creating the initial quality defense for incoming materials. You will also drive quality management and support our ambitious projects. This is an outstanding chance to lead technological progress in the semiconductor industry! Key Responsibilities Set up the initial quality safeguard for incoming materials, including PSMC/TSMC wafers and UMC interposers. Lead excursion identification, containment, resolution, and supplier quality oversight to reduce yield, reliability, production, and customer risks. Assist HBM ramp, HBM4e, and IQP builds through active incoming quality assessment and supplier quality development. Work Schedule Regular day shift, Monday to Friday, 08:00 AM–05:00 PM. Candidate Qualifications At least 1 year of Semiconductor / Quality experience. Expertise in Incoming Material Quality, Supplier Quality, Excursion Management, and HBM/Wafer/Interposer quality governance. AI-Related Information Develop Generative AI and Agentic AI solutions for Quality operations. Build AI Assistants, knowledge management, intelligent search, and chatbot platforms. Leverage LLMs to improve engineering efficiency and decision-making. Integrate manufacturing, quality, and engineering data to enable intelligent analytics, Quality Digitalization, and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The PDE API Process Integration (PI) Engineer is responsible for driving process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM) products across sites during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Front-end to Assembly interactions , PWF, Assembly, and Test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with different cross-functional teams including Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Technical Leadership Serve as the Process Integration Subject Matter Expert, owning end‑to‑end integration across PWF, assembly, and test from NPI through sustained HVM Define PI technical direction, integration frameworks, and success criteria for HBM programs Lead process characterization strategy, window definition, and systemic yield improvement Resolve complex yield, reliability, and performance issues through deep technical analysis and integration expertise Drive resolution of high‑impact, ambiguous, cross‑site integration challenges affecting ramp, quality, or business commitments Anticipate risks early and define mitigation strategies across programs and sites

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Engineer, MCT Operations Quality at Micron Technology, Inc., you will lead and collaborate closely with Global Assembly & Test (AT) sites, Global Quality, and various cross-functional stakeholders to drive on Manual Touchpoint Reduction. You will champion a Quality-First mindset by driving manufacturing solutions and end-to-end redesign initiatives to eliminate manual steps upfront that reduce operational error, prevent customer events and enhance product quality across Global AT network. Job Responsibilities: Lead global initiatives and collaborate with AT sites and Global Quality to identify and eliminate high-risk manual touchpoints across Assembly, Test/Post E, Module/SSD, HBM/PWF areas. Conduct onsite validation of the manual touchpoints at the source, identify quality risks, and propose improvements to eliminate the touchpoints. Collaborate with subject matter experts and drive the development and deployment of scalable solutions through physical automation/robotics, system automation, and Predictive Quality & Generative AI-enabled solutions. Collaborate with subject matter experts on end-to-end redesign initiatives to eliminate manual touchpoints upfront. Lead as the central team program governance to drive strategy, alignment, and execution consistency across all AT sites. Drive the rapid replication and scaling of proven solutions across AT sites through structured deployment frameworks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Staff Engineer in Micron’s High Bandwidth Memory (HBM) Component Validation team, you will contribute as Subject Matter Expert (SME) and contribute to define new standards on validation development for advanced HBM products and ensure stable, scalable validation testing infrastructure with zero code-related escapes across various test flows and high speed memory validation. You own optimizing test flows, and lead technical problem solving for next generation HBM products. You’ll drive validation development deliverables and mentor junior engineers. Why Join Us You’ll gain hands-on experience with cutting-edge HBM technologies and validation platforms, working alongside global experts. This role offers opportunities to learn advanced validation techniques, drive and deliver product readiness, technology solutions and innovations, and grow into technical leadership roles. Responsibilities: Test program development SME: Drive and develop and maintain test programs for HBM component validation Deliver timely test program releases aligned with validation milestones and drive code quality, reviews, and release best-practices Drive test time optimization and parallelism improvements Drive tes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Manager at Micron Technology, Inc. in the Cloud Memory Business Unit (CMBU), you will be charged with driving execution of the products in high bandwidth memory (HBM) portfolio that will position Micron for success in growing the Artificial Intelligence (AI), Machine Learning (ML) and High-Performance Computing (HPC) business segments. You will be working on leading-edge technologies to enable next generation high bandwidth memory (HBM) products and drive customer focused innovation. You will lead a cross-functional team of key representatives from multiple engineering, marketing, and operations teams to ensure the execution of product is aligned to spec within a specific timeline and budget. You will assist the Product Management team in defining the strategy and vision of the product portfolio and drive the execution focused Stage Gates when necessary. Ideal candidates are ambitious leaders with a strong Business plus Engineering background and analytical skills who “own” all aspects of the execution and possess good communication skills to drive the cross functional team towards the business goals. Products managers in this role will be self-starters with a can-do attitude who can apply their critical thinking ability to drive the best possible outcome. Responsibilities: Develop and drive product strategy, roadmap planning, and requirements definition for next-generation HBM solutions targeting AI, HPC, and cloud infrastructure markets Partner with customers, hyperscal

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1.HBM_TNR process yield maintain（machine alarm, SPACE alarm，product defect analysis） 2.Following PM spec to perform the machine PM 3. Perform the machine trouble shooting and draft the passdown 4. Maintain equipment area 6S 5. Submit the improvement ideas of equipment PM or troubleshooting 6. Reporting the abnormals or findings during daily work 7.Utilize AI-enabled tools to support troubleshooting, equipment maintenance, technical documentation, data review, and continuous improvement activities. Demonstrate the ability to effectively incorporate AI into daily work processes while ensuring accuracy, safety, and compliance. 8.Associate's or Bachelor's degree in Electronics, Electrical, Mechanical Engineering, or a related discipline. 9.New graduates and experienced candidates are encouraged to apply. Prior experience in the electronics or semiconductor industry is a plus. 10.Proficiency in basic English communication skills (listening, speaking, reading, and writing). About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memo