Hbm Photo Process Engineer Jobs

HBM Manufacturing Production Engineer — Taichung - MTB, Taiwan. Apply via Workday.

HBM ENGINEERING SUPPORT TECHNICIAN — Taichung - AATT, Taiwan. Apply via Workday.

HBM MRDA SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Equipment Technician 輪班助理工程師 — Taichung - MTB, Taiwan. Apply via Workday.

HBM Hardware Emulation Architect — 2 Locations. Apply via Workday.

HBM 招募專區｜加入 MTB，站上 AI 與先進記憶體最前線 — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM SHIFT PROCESS ENGINEER — Taichung - MTB, Taiwan. Apply via Workday.

HBM Customer Systems Validation Engineer — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. Key Responsibilities Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance. Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements. Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance. Drive cross-functional technical investigations and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HBM Core-Die Architecture & Circuit Design Engineer This role owns next‑generation HBM core‑die architecture and critical DRAM circuit design that directly impact bandwidth, power, area, thermal efficiency, and long‑term reliability. The engineer will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D‑stacked HBM products. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Key Responsibilities Own HBM core‑die architecture including Bank/Bank‑Group organization, array partitioning, datapath, refresh, and reliability features Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade‑offs Define and validate refresh, row‑hammer mitigation, data‑retention, and power‑efficient operation schemes Lead architecture feasibility studies using transistor‑level simulation and physical implementa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High Bandwidth Memory (HBM) organization develops industry-leading memory solutions that power artificial intelligence, high-performance computing, graphics, and data center applications. The team brings together experts across architecture, design, verification, physical design, product engineering, and validation to deliver advanced memory products that enable the world's most demanding computing workloads. As an HBM Design Development Technical Leadership (DDTL) Intern, you will support the planning, execution, and coordination of next-generation HBM product development programs. You will work closely with technical leaders and engineering teams to track project execution, manage risks, analyze program data, and improve engineering productivity through automation, analytics, and AI-enabled workflows. This role offers exposure to both the technical and leadership aspects of semiconductor product development. Responsibilities Support HBM product execution by tracking schedules, achievements, dependencies, technical risks, and design readiness throughout the development lifecycle. Collaborate with multi-functional engineering teams to monitor project status, coordinate deliverables, and support successful achievement completion. Develop dashboards, reports, data analytics solutions, and executive summaries to provide transparency into program health and key performance indicators. Create automation tools, workflow improvements, and AI-assisted solutions that improve engineering productivity, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4+ years of semiconductor physical layout experience with a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Handle several tasks at once and bring them to completion within the specified timeframe. Accurately examine and interpret production data to pinpoint and address abnormal issues. Collaborate with other departments to solve problems and improve production processes. Apply Generative AI to improve the efficiency of daily work. Carry out research to analyze process changes and propose improvements or alterations to equipment. Minimum Qualifications: Demonstrated skill in analyzing and interpreting data with precision. Demonstrated excellence in team building, mentoring, and coaching. Strong problem-solving skills and the ability to find solutions to improve production. Skill in managing several assignments concurrently and completing them on time. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and