Hbm Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design layout for leaf cells, standard cells (Stdcell), or sub-blocks. Apply a systematic, meticulous, and methodical approach to IC layout design. Interpret DRC/LVS and other physical verification checks to ensure design accuracy. Demonstrate ownership and proactively plan work to meet project timelines. Collaborate effectively with internal teams to ensure successful layout project execution. Minimum Qualifications Bachelor’s, Master’s, or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or related fields. Graduation within the last 2 years (Bachelor’s, Master’s, or PhD). Strong knowledge of electronic circuit concepts. Experience using circuit simulation and design tools. Effective interpersonal and problem-solving skills. English communication skills (conversational level required). Self-motivated, enthusiastic, and collaborative standout colleague. Passion for technology and willingness to grow in the semiconductor industry. Preferred Qualifications Internship or academic project experience in pre-silicon circuit design. Understanding of pre-silicon development areas such as analog circuits and physical design. Basic knowledge of MOS concepts, semiconductor fabrication, and analog layout fundamentals. Strong interpersonal skills and goal-oriented perspective. Experience with programming or script

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertise :

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Lead the layout design and development of complex analog, mixed-signal, and digital blocks and full chip level integration Ensure timely delivery of high-quality block-level layouts, meeting project milestones and design specifications. Perform layout verification including LVS, DRC, and antenna checks, along with thorough quality reviews and documentation. Collaborate with global engineering teams to ensure successful execution and integration of layout projects. Provide technical guidance and mentorship to junior team members, reviewing sub-block layouts and supporting their development. Demonstrate leadership in planning, time estimation, scheduling, and execution across multiple projects. Contribute actively to project management and cross-functional coordination. Proven experience in IC layout design with a systematic and methodical approach. Strong attention to detail and a passion for high-quality design. Excellent communication and collaboration

Senior/Staff HBM PYE Product Development Failure Analysis Engineer — Boise, ID - Main Site. Apply via Workday.

Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer — Fab 10A, Singapore. Apply via Workday.

Senior Engineer – HBM PE Component Validation (Singapore) — Fab 10A, Singapore. Apply via Workday.

STAFF ENG-HIG-HBM-LAYOUT — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Staff/Principal Engineer - HBM Design for Test (DFT) — Richardson, TX. Apply via Workday.

STAFF ENG-HIG-HBM-LAYOUT — Jalisco, Mexico. Apply via Workday.

STAFF ENG-HIG-HBM-LAYOUT — Jalisco, Mexico. Apply via Workday.

Senior Manager - HIG-HBM Product Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Senior Engineer - HBM Analog Design — Bengaluru, India. Apply via Workday.

Senior Engineer - HBM Circuit Verification — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Senior Engineer – HBM PE Component Validation (Singapore) — Fab 10A, Singapore. Apply via Workday.