Hbm Process Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Become a member of Micron's dynamic and ambitious team in Taiwan, where we focus on advancing the future of memory and storage solutions. As an HBM Manufacturing Production Engineer, you will be essential in maintaining flawless production processes and delivering world-class products. This is an outstanding chance to join a company that prizes innovation, collaboration, and excellence! Responsibilities: •Build, develop, and optimize manufacturing processes for HBM production •Implement and maintain strict quality control measures to ensure the highest production standards •Collaborate with cross-functional teams to determine and successfully implement process improvements •Conduct detailed analyses to identify areas for efficiency improvements and cost reductions •Lead troubleshooting efforts to resolve production issues and minimize downtime •Ensure compliance with safety regulations and industry standards Requirements: •Bachelor's degree in Engineering or a related field, or equivalent experience •Proven experience in a manufacturing role, preferably within the semiconductor industry •Strong understanding of HBM technology and production process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High Bandwidth Memory Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. We bring architecture and physical implementation together to shape products that are efficient, manufacturable, and ready for demanding applications! As a Custom Layout Architecture Engineer , you will use physical layout expertise to inform HBM architecture and implementation decisions from concept through tapeout. You will work with design, architecture, process, verification, and product engineering teams to balance performance, power, area, routability, and manufacturability. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Assess HBM architecture choices through layout feasibility, floorplanning, and performance, power, and area analysis Lead custom layout and full-chip integration for analog, mixed-signal, digital, and memory blocks Resolve antenna, latch-up, ESD, electromigration, IR drop, routability, and power-delivery constraints Complete DRC/LVS, parasitic extraction, post-layout validation, and tapeout support using industry-standard EDA tools Build scripts and automation that improve layout quality, verification, and design-cycle time Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related technical field 4+ years of semiconductor physical layout experience with a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Become a member of Micron's dynamic and ambitious team in Taiwan, where we focus on advancing the future of memory and storage solutions. As an HBM Manufacturing Production Engineer, you will be essential in maintaining flawless production processes and delivering world-class products. This is an outstanding chance to join a company that prizes innovation, collaboration, and excellence! Responsibilities: Build, develop, and optimize manufacturing processes for HBM production Implement and maintain strict quality control measures to ensure the highest production standards Collaborate with cross-functional teams to determine and successfully implement process improvements Conduct detailed analyses to identify areas for efficiency improvements and cost reductions Lead troubleshooting efforts to resolve production issues and minimize downtime Ensure compliance with safety regulations and industry standards Requirements: Bachelor's degree in Engineering or a related field, or equivalent experience Proven experience in a manufacturing role, preferably within the semiconductor industry Strong understanding of HBM technology and production processes Demonstrated ability to work collaboratively in a team-oriented environment

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals. Key Responsibilities Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing. Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market. Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness. Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations. Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality. Process Conversions and HVM: Recommen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Minimum Qualifications: Bachelor’s degree, master or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology or similar. Graduated within the last 2 years from a bachelor’s degree, master’s degree, or PhD program. Strong knowledge of electronics circuit concepts. Experience using electronic circuits simulation and design tools Effective interpersonal and problem-solving abilities. English language communication skills (conversational level is a must). A self-motivated, enthusiastic team player who enjoys working with others Passionate about Technology, willing to learn and develop into the semiconductor field. Applying AI for automation of technical and non - technical process is required. Preferred Qualifications: Participated in internships or school projects related to pre-silicon circuit design. Knowledge of Pre-silicon development areas such as logic circuit design and computer architecture. Have concepts of RTL, verification and logic simulation basics Organized and goal focused thinking. Experience with programming, scripting and hardware description languages such as C++/Phyton, Verilog. Attitude for attaining problem-solving and debug skills in logic verification. Role and Responsibilities Provide verification support to design circuits by simulating, analyzing and debugging pre-silicon full chi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【募集職種/Position Title】 Senior / Staff / Principal Process Development Engineer 【日本語】 MicronのDRAM Technology Development Process Development Teamは、MicronのDRAMおよびHBM (High Bandwidth Memory) 製品向けのプロセス技術、装置ソリューションを開発する、世界最高水準のエンジニアと技術専門家で構成された組織です。 当チームでは、先端DRAM、HBM、およびCMOS技術の開発を推進しており、リソグラフィ、CVD、ドライエッチ、ウェットプロセス、メタライゼーション、拡散、イオン注入、CMP、先端材料開発など、幅広いプロセス分野で経験豊富な人材を募集しています。 本ポジションでは、ユニットプロセス技術の探索、開発、最適化を担当し、プロセスインテグレーション、デバイス、設計エンジニアと連携しながら、装置メーカーや材料サプライヤーと協働して、次世代のDRAMおよびHBM向けの高性能かつコスト競争力のある技術開発を推進していただきます。 本ポジションでは、半導体プロセス開発、デバイス物理、CMOS技術に関する高度な知識が求められます。また、データ解析能力や材料分析、表面解析技術への理解も重要です。チームワークと高いコミュニケーション能力は、本職務で成功するための重要な要素となります。 歓迎する技術経験 以下の技術分野における実務経験をお持ちの方を歓迎します。 ・成膜技術 (CVD、ALD、PVD) ・エピタキシャル成長技術 (Si、SiGe、選択成長など) ・ゲートスタックおよび誘電体技術 ・先端パターニングおよびドライエッチ技術 ・ウェット洗浄および表面処理技術 ・イオン注入および熱処理技術 ・コンタクト形成、配線メタライゼーション技術 ・化学機械研磨技術 (CMP) ・ストレスエンジニアリングおよび先端材料統合技術 ・先端トランジスタ開発を含むロジック技術開発 ・メモリCMOSおよび周辺回路向けプロセスインテグレーション技術 主な職務内容 以下を含みますが、これらに限定されません。 ・デバイス、プロセスインテグレーション、および製品要求事項の理解 ・技術目標およびコスト目標達成に向けたプロセス技術ロードマップおよびサプライヤー戦略の策定 ・開発環境および量産環境におけるプロセスレシピの開発、最適化 ・構造解析、材料分析、および電気特性評価データの解析 ・デバイス性能、歩留まり、信頼性、およびコスト競争力向上に向けた技術革新の推進 ・AI（人工知能）を活用した開発業務の効率化、高度化の推進 ・社内関係部門および外部パートナーとの連携による複雑な技術課題の解決 ・技術戦略および開発方針に関する経営層への提言 ・エンジニアの育成、指導を通じた組織能力の向上 ・高い倫理観、オーナーシップ、および他者への敬意を持った業務遂行 応募資格（必須） ・電気工学、物理学、化学工

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Physical Design team is responsible for implementing advanced High Bandwidth Memory (HBM) SoC and base die designs that enable next-generation AI, high-performance computing, and data center solutions. The team collaborates across architecture, RTL, verification, DFT, and signoff engineering to deliver high-performance, power-efficient silicon while developing innovative design methodologies and automation solutions. As an SoC Physical Design Intern on the HBM team, you will work alongside experienced engineers to support the implementation of advanced HBM SoC designs. You will gain hands-on experience with physical design methodologies, timing analysis, signoff flows, and automation while contributing to the development of next-generation memory products that power AI and high-performance computing applications. Responsibilities Support the physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization activities. Analyze timing, power, area, congestion, and physical verification results to find opportunities for design improvement and optimization. Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners. Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions. Collaborate with multi-functional engineering teams to document r