Hbm Shift Production Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Develo

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next‑generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best‑in‑Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device‑ and stack‑level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design‑For‑Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross‑functional partners—including Fab, Product Leads, Design Engineering, Technology Development, and Test Solutions Engineering—to execute both strategic initiatives and tactical deliverables, ensuring continued technology and product leadership. The future of HBM is fast‑moving and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, Generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency . • Utilize AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime. • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms. • Familiar with TCB/DB process and possesses a minimum of 5 years of semiconductor equipment engineering experience . • Identify, diagnose, and resolve assembly equipment related issues utilizing data-driven and AI-supported methodologies. • Coordi nate and execute process, equipment, and material evaluations, leveraging AI insights to optimize manufacturing performance and quality. • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies. • Validate and qualify new processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production. We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production. Responsibilities will include, but are not limited to: Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network. Main Responsibilities Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work. Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualific

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules. • Identify, diagnose and resolve assembly equipment related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous utilization improvement and cost reduction activities • Validate and fan out baseline qualified, including new process, tools and/or materials for new product introduction • Support FDC/RMS/APC/SPC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement • Familiar with one of the process as below and has 3 years of equipment experience at least Flip chip / CoWos Wafer inspect / Wafer Molding Grinding/PSRG/Thinning Mount/Pillar Reflow

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the d esign and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Senior Analog Design Engineer to join our High Bandwidth Memory (HBM) team. This role is responsible for the architecture, design, simulation, and silicon bring ‑ up of high ‑ performance analog and mixed ‑ signal circuits used in HBM PHYs and supporting infrastructure. The ideal candidate has deep expertise in high ‑ speed I/O, clocking, power management, and advanced ‑ node analog design, and has successfully delivered silicon to production. Responsibilities will include, but are not limited to: Design and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer , you will lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products . You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability. Technical Leadership: Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple doma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Title: Principal Engineer – HBM Verification Location: Hyderabad, India Experience : 12&#43; years in Design Verification (experience with Pre-Silicon Verification OR DDR/GDDR/LPDDRmemory/SerDes PHY IP Verification is preferred) Role Description Join the Micron HBM team where you will drive verification architecture for next-generation HBM, ensuring robust methodologies and sign-off strategies. This role is perfect for a hands-on silicon verification expert who is passionate about developing best-in-class verification methodologies, testbench design, AI enabled verification and developing novel solutions to improve quality and efficiency of verification workflows. Key Responsibilities Define and drive verification architecture and methodology for next generation HBM designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Apply Formal Verification techniques for critical Collaborate strictly with build teams to ensure verification completeness and quality. Mentor a