Hbm Shift Production Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets. RESPONSIBILITIES AND TASKS: Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area. Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management. Develop test Automation solutions as electrical validation and qualification of new test equipment and tools. Independently debug and identify root causes on test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and justification on program v

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a highly skilled Physical Design Engineer to drive the critical Die-to-Die (D2D) Physical Implementation from RTL to GDSII. This role demands deep expertise in full physical design flow with a specific focus on closing high-speed D2D interfaces for multi-die/chiplet architectures. This role is remote role open to any location in the U.S. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned ASIC Physical Design Engineer with 5+ years at advanced nodes (7nm or below) and multiple successful tapeouts. Strong in full-chip implementation, comfortable owning blocks from RTL to GDSII across synthesis, floorplanning, place-and-route, CTS, and sign-off. Deeply familiar with high-speed interfaces (D2D, PCIe, HBM, SerDes) and the physical challenges that come with them (timing, signal integrity, power integrity). Detail-oriented and methodical with STA, constraints, and closure for complex, high-speed designs. A hands-on problem solver who enjoys collaborating across analog, digital, and full-chip teams to debug tough issues. What We Need Lead Die-to-Die (D2D) physical implementation and closure, taking high-spe

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop