Hvm De Sr Mgr Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 F15 DXチームは、Fab15のHVM領域におけるデジタル化・自動化を推進し、サイクルタイム短縮、ライン安定化、FabPace改善を目的としたソリューション開発を担当します。製造現場の課題を分析し、データ駆動型の改善策を実装することで、Fabの競争力強化に貢献します。 職務内容 製造KPI（サイクルタイム、スループット等）の分析と改善策提案 自動化アプリケーションの開発（例：Lot Priority Auto Upgrade、FQ Postpone） データ可視化ダッシュボードの設計・構築（例：In-Time Delivery、Photo DBR） API開発およびUI設計による業務効率化 DX関連プロジェクトの要件定義、設計、UAT、導入 OMT DXチームとの連携によるFab全体のオートメーション推進 推奨Skill SQL/Python/Power BI/Streamlit/Tableau/Omelekでのダッシュボード構築 Job Summary The F15 DX team drives digitalization and automation initiatives in Fab15’s HVM area, focusing on cycle time reduction, line stability, and FabPace improvement. The team analyzes manufacturing challenges and implements data-driven solutions to strengthen Fab competitiveness. Key Responsibilities Analyze manufacturing KPIs (cycle time, throughput) and propose improvement actions Develop automation applications (e.g., Lot Priority Auto Upgrade, FQ Postpone) Design and build data visualization dashboards (e.g., In-Time Delivery, Photo DBR) Develop APIs and user interfaces to streamline operations Define requirements, design, conduct UAT, and deploy DX projects Collaborate with the OMT DX team to drive automation across Fab operations Recommended Skills Dashboard development using SQL / Python / Power BI / Streamlit / Tableau/Omlek Using AI: Experience in utilizing AI for work process improvements

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through different phases of a product i.e. concept, build, NPI and HVM by facilitating multi-functional life-cycle management. You will help build and maintain a detailed development schedule and guide the vital tactical progress. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and work you're doing. Responsibilities: Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with the Technology Development, Build, Process, APTD, PE and Manufacturing teams to drive development progress and alignment. Collaborate with PMO org to build and sustain a detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM. Provide regular communication of development status, priorities, and challenges across the broader organization. Set and prioritize tactical expectations across development activities, according to defined achievements and collaborator needs and expectations. Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and leading development documentation. Consolidate a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role Summary The PDE PCS IIoT Senior Manager is responsible for leading the validation, industrialization, and high-volume manufacturing (HVM) enablement of Industrial IoT solutions across the enterprise. This role ensures that IIoT solutions developed through early pathfinding and solution development phases are scalable, robust, compliant, and standardized for global deployment. The position plays a critical governance role across the IIoT lifecycle—driving design-for-scale alignment, enforcing validation rigor, and enabling consistent fanout across sites. The role partners closely with APTD IIoT, site engineering teams, and central functions to deliver production-grade IIoT capabilities that achieve yield, productivity, and operational performance targets. Key Responsibilities 1. IIoT Validation and Industrialization Leadership Own end-to-end IIoT solution validation from pilot through industrial deployment. Ensure solutions are robust, scalable, and meet defined performance targets (e.g., DOC, latency, reliability). Establish and enforce validation frameworks including: Data quality and integrity checks Algorithm robustness and drift validation False positive/false negative performance thresholds Drive cybersecurity, compliance, and enterprise governance sign-off prior to deployment. 2. HVM Fanout and Standardization Lead SOAK fanout governance and ensure control

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10. You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality. Job Responsibility: Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Director, Package Quality & Reliability Engineering Job Summary The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC. Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence. Main Responsibilities Package Quality & Reliability Engineering Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical str

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron Technology as a Staff/Senior Engineer for Automated Material Handling Systems (AMHS), based at Hiroshima plant, where you will serve as the on-site technical anchor while simultaneously leading Global AMHS network initiatives. This role is pivotal in driving KPI improvements, ensuring operational excellence, and establishing scalable best practices across Micron's worldwide fab network. This position bridges site-level execution at Hiroshima plant with global AMHS strategy — accelerating issue resolution, reducing systemic risk, and elevating automation maturity across all high-volume manufacturing (HVM) sites — without increasing headcount at individual sites. Hiroshima Plant Operations & KPI Ownership Act as the global technical lead for AMHS operational governance across all Micron manufacturing sites Drive alignment and standardization of wafer transport, storage systems, and carrier purge solutions spanning the network Partner with site AMHS teams globally for real-time issue resolution and partner concern management Develop and deploy global operational response strategies and standardized critical metric frameworks Serve as the primary AMHS technical lead stationed at Fab15, owning day-to-day system performance and availability Define, monitor, and drive improvement of AMHS critical metrics, including: Overall Equipment Efficiency (OEE) System uptime and reliability Carrier purge efficiency (

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and responsibilities Ensure a safety-first culture for all program and project solutions. Support network Track installation to meet TIQ (Tool Installation Qualification) goals. Close collaboration with network Photolithography Track suppliers (TEL, alternate suppliers, etc) and internal stakeholders (HVM fabs, Central Teams, Technology Development teams). Drive network Track defect reduction and Machine Matching Management (MMM) to achieve industry best-in-class performance in Track productivity (Wafers Per Day) and Process matching through best practices establishment, problem solving techniques and analytical up skill. Lead Track Technical Authority (TTA) with Track Subject Matter Experts (SMEs) to govern network Track areas of focus (E.g. Future tool configurations, Hardware, Recipe, Defectivity). Drive and facilitate governance meetings and cross-collaboration projects with internal and external stakeholders to achieve Micron Strategic Initiatives (E.g. Cost, Yield, Quality, Maxout, Environmental Sustainability). Demonstrate strong communication and reporting skills to provide regular Executive updates on project progress, challenges, and escalation for resource support. Demonstrate ownership and accountability in delivering results. Coach network Track leaders and groom future Track generation leadership. Proactively identify bottlenecks, drive improvements, and share best practices across HVM fabs. <b

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownersh

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Prioritize and lead multiple projects based on Fab and corporate objectives. Communicate and respond to issues in a timely manner, with a cadence appropriate to the priority of the issue. Keep collaborators and team members informed of project status, progress, and roadblocks/opportunities. Requirements: Bachelor’s degree in engineering. Min. 5 years of experience working as a CMP Process/Equipment Senior Engineer. Strong people and collaboration skills to lead globally sites on BKM alignments. Self-motivated: Able to work independently with minimal supervision. Dependability and able to work effectively in cross-functional teams. Good organization skills and able to plan and prioritize. Excellent verbal, listening and written communications skills. Strong attention to details. The ability to interface with suppliers professionally. Willin

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description The MSH PDE Process Integration (PI) Manager leads a team of Process Integration engineers responsible for the successful execution of High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM) . This role combines people leadership, technical oversight, and cross‑functional execution , ensuring PI readiness, yield ramp, and risk mitigation across wafer fabrication, assembly, and test. The manager is accountable for delivering NPI commitments while developing a strong, scalable PI organization. Job Responsibilities People Leadership & Talent Development Lead, coach, and develop a team of MSH PDE PI engineers across multiple experience levels Set clear expectations, goals, and priorities aligned to NPI and business objectives Provide regular feedback, performance evaluations, and career development guidance Build organizational capability through hiring, onboarding, mentoring, and succession planning Foster a culture of accountability, collaboration, and technical excellence HBM NPI Execution & Delivery Own PI execution for HBM NPI programs, en