Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metro Real-time Defect Analysis (RDA) Process & Equipment Engineer, you will be responsible for developing, deploying, and sustaining RDA capabilities that enable robust process control and equipment performance across advanced packaging and New Product Introduction (NPI) manufacturing environments. You will focus on integrating process knowledge, equipment behavior, and automation intelligence to improve tool stability, detect early signals of risk, and accelerate learning during NPI, pilot, and ramp phases. This role serves as a critical link between Process Engineering, Equipment Engineering, NPI teams, and RDA, ensuring monitoring strategies are technically sound, actionable, and scalable to high-volume manufacturing (HVM). You will work closely with Site and Global RDA, Process, Equipment, Automation, and IT teams to drive continuous improvement in equipment capability, process robustness, and manufacturing readiness. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Working place : Hiroshima Manufacturing site (Fab15) 勤務地:広島製造拠点(Fab15) As a Process Integration Engineer at Micron Fab15, you will help ensure process stability and drive yield/quality improvements by leveraging standard procedures, data analysis, and cross-functional collaboration. You will support early detection, root-cause isolation, and corrective/preventive actions for process deviations in a high-volume manufacturing environment. 職務概要 Micron Fab15 プロセスインテグレーションエンジニアとして、標準手順データ分析、ならびに部門横断的な協業を活用し、プロセス安定性を確保するとともに、歩留まりおよび品質改善を推進します。 Job role more in detail, Optimizing Device performance to improve not only yield but also repair density consumption. Need to think about appropriately HVM DRAM process condition especially focusing on Device process condition. Need to collaborate with other PI module teams and Each Area teams and also discuss with PE/GQ/ Design and TD device teams to take balance for deciding HVM device process condition Need to collaborate with other site OMT, ID1 and TD. 職務内容詳細 歩留まり改善を行うだけでなく、Repair Density消費の最適化を含めたデバイス性能の最適化を行う。 特にデバイスプロセス条件に注目し、HVM DRAM プロセス条件を適切に検討する。 他のPI moduleチームおよび、各エリアチームと連携し、さらにPE/GQ/Design /TDデバイスチームと議論しながら、HVMデバイスプロセス条件のバランスを取った意思決定を行う。 他サイトのOMT,ID1,TDチームとも連携する。 Job responsibilities Take responsibility for creating SWR for device performance improvement proactively. Take responsib
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Mask Development department in Micron’s Technology Development organization delivers reticle solutions that help shape next-gen memory and storage products in the evolving global technology landscape. This team works at the intersection of advanced equipment, materials science, and precision manufacturing. If you enjoy solving complex problems, collaborating with other subject-matter experts and department leaders, and seeing your direct impacts on product quality, you’ll feel at home here! Position Overview: Micron is seeking a highly experienced Resolution Enhancement Techniques (RET) Engineer to join the AMD team at Micron. At the Senior Member of Technical Staff level, our ideal candidate is a master in their field and has a history of innovation and driving technical direction in the industry. This role will focus on developing and optimizing RET and Optical Proximity Correction (OPC) solutions that enable high-fidelity wafer patterning for advanced memory technologies. This role will partner with a variety of teams to develop innovative reticle solutions, improve tapeout methodologies, and resolve complex patterning challenges across both R&D and HVM environments. We are looking for an ambitious and goals-centric individual to help drive groundbreaking solutions that maintain Micron’s competitive advantage. Responsibilities: Drive a steady stream of sophisticated projects with built-in contingency plans related to mask development, lithography optimization, and tapeout flow
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We’re driving the next wave of memory innovation at Micron, pushing the boundaries of DRAM and enabling future scaling! Our team works at the intersection of science and manufacturing, turning advanced concepts into high-volume solutions that power a data-driven world. As a Principal/ MTS Wet Process Development Engineer, you will lead critical process innovation and integration for next-generation nodes. This role shapes wet process technology direction, influences roadmap decisions, and delivers scalable, manufacturable solutions that enable high-volume success. Key Responsibilities Technical Leadership and Problem Solving - Lead development, optimization, and troubleshooting of advanced wet process applications from Wet cleans and etches, Vapor-phase processes, Strip processes, Bevel etch, to Copper plating. Perform rigorous root cause analysis and implement robust, fab-ready and HVM-compatible solutions. Apply strong fundamentals in fluid dynamics, reaction kinetics, thermodynamics, transport phenomena. Evaluate interactions between upstream and downstream processes to ensure integration and yield success. Technology Development and Road-mapping - Translate device scaling requirements into actionable wet process technology roadmaps. Identify technical gaps and define solutions to meet critical specifications (CSPEC). Drive innovation in chemistry, process architecture, and tooling to support future technology nodes. Contribute to the development
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. What Makes This Opportunity Unique: Micron Technology values a collaborative and inclusive work environment where each team member can thrive. As a Engineer, you will be crucial in our mission to deliver flawless, top-tier solutions. This is an outstanding chance to work with innovative technology and be part of a team committed to achieving ambitious goals and implementing groundbreaking projects! Responsibilities and Tasks: Support the smooth operations of RAM lots and tools, including optimizing RAM tool performance and completing cost-saving projects. Manage lot disposition and tool operations to ensure accurate completion of lot measurements without quality issues or errors. Collaborate closely with teams like HVM RAM to align with metrology and RDA processes and work with process owners to ensure actions align with specifications and procedures. Coordinate and conduct training or briefings for the operations team on procedures and best-known methods (BKM) or any changes communicated. Track operational performance metrics and implement continuous improvement efforts to improve metrology and RDA processes. Ensure end-to-end project execution, including efficiency and RPT reduction projects, to meet operational requirements.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description The Realtime Defect Analysis (RDA) and Metrology organization supports Micron’s global high‑volume manufacturing network by enabling advanced defect detection, metrology capability, and quality systems that ensure world‑class manufacturing standards. The team plays a critical role in driving global quality alignment, accelerating technology transfer, and supporting next‑generation memory development. The RDA ID1 Quality Engineer is responsible for developing, implementing, and sustaining global quality control systems and standards for the RDA and Metrology department. This role serves as a technical leader, partnering with global manufacturing, process integration, data science, and yield teams to identify defect trends, resolve process issues, and improve detection accuracy and process stability across high‑volume manufacturing sites worldwide. Responsibilities Develop and implement global quality systems and standards for RDA and Metrology. Define and drive strategic roadmaps for defect detection and metrology to enable future technology scaling. Lead cross‑functional collaboration with global HVM sites, process integration, data science, and yield engineering teams. Establish advanced monitoring, analytics, and metrics for defect trending, excursion mitigation, and process health.
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities and Tasks: Drive continuous improvement of RDA equipment applications and recipe setup flows to reduce Time ‑ to ‑ Recipe (TTR), improve repeatability, and enhance data quality Support cost ‑ saving and productivity initiatives by leveraging best ‑ known methods (BKM), recipe reuse, and workflow optimization across RDA toolsets. Support tool recovery activities to restore availability and performance following tool downs, upgrades, or excursions. Manage hardware ‑ related logistics such as tool access, scheduling, and cross ‑ team coordination to minimize impact to RDA lot execution. Support the smooth operations of RAM lots and tools, including optimizing RAM tool performance and completing cost-saving projects. Manage lot disposition and tool operations to ensure accurate completion of lot measurements without quality issues or errors. Collaborate closely with teams like HVM RAM to align with metrology and RDA processes and work with process owners to ensure actions align with specifications and
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies. Risk Management: The
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer, Photo EUV Technology, you will be responsible for EUV process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with other Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors. Key Responsibilities Develop and optimize EUV process modules to meet the stringent requirements of advanced memory devices. Perform advanced process development tasks, including material evaluations, reticle and layout design, OPC development, process window analysis, and overlay optimization. Lead the successful introduction of new technologies to manufacturing, focusing on yield improvement, cycle time reduction, and tool expansion. Collaborate closely with R&D and high-volume manufacturing (HVM) partners in globally diverse locations to ensure seamless integration and flawless execution. Partner with DRAM Development site leaders to align development strategies, deliverables, and provide on-site support for various technology projects. Work alongside Micron’s Manufacturing and Central teams to implement outstanding methods for manufacturability. Qualifications Proven experience in EUV process development and photolithography. Outstanding problem-solving skills and the ability to successfu
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