Hvm Production Supervisor Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Global Planning Strategic Program Engineer, you will be handling program to drive FrontEnd Planning Transformative Initiative and Business Process Improvement. You will be collaborating with various stakeholders from Global and FrontEnd HVM team in Asia and USA. Responsibilities include but are not limited to: Understand the planning system and associated application used within Micron and ensure successful implementation through the network Understand the current business process and generate improvement proposal Identifying opportunities for automation and systemizing Ensuring standardization of best practice and implementation of Planning systems (e.g. Fazer, Tools List Web, PDM) Establishing planning input data governance across Planning network (Loading, Capacity Model) Collaborate with business partners and other teams (e.g SMAI, Global and Sites Planning, Layout, etc) to ensure successful deployment of system and business process established Job Requirements Bachelor’s degree with minimum 4 years of experience Fab Planning knowledge Proven Project Management skills in handling various project to meet objectives and timeline Excellent knowledge of Planning systems, applicat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Responsible for both product development and supporting high volume manufacturing of SSD. Support for SSD failure analysis from NPI to HVM stage. Perform manufacturing yield evaluation and data analysis. Perform detailed electrical and physical failure analysis and work with other departments to resolve SSD related issues. Troubleshooting failure from customer return and provide solutions to fix the problems. Requirements: Bachelor or Masters degree in Electrical/Electronic Engineering or Computer engineering. Relevant experience in SSD industry will be an advantage. Relevant experience with computer hardware, knowledge of storage interface such as SATA, SAS will be an advantage. Proficiency in programming languages such as C, C++, Python, Perl and etc. Proficiency in using AI technology (Claude, Copilot) in improving productivity. efficiency and data analysis. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals. Key Responsibilities Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing. Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market. Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness. Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations. Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality. Process Conversions and HVM: Recommen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: New Product Operations (NPO) Product Manager (HBM) plays a critical role in driving successful planning and execution of early lifecycle phases for New Product Introduction (NPI) products and this role will support the enablement of industry leading High Performance memory products (HBM). This position ensures alignment across the value chain to achieve predictable manufacturing readiness and seamless transition to High Volume Manufacturing (HVM). Key Responsibilities: • Be the program Operations liaison in core HBM Product Development Teams (PDT’s) driving all Operations Requirements (Supply Chain, Manufacturing, Procurement, Compliance, Logistics) and representing Operations in executive reporting forums. • Participate early in the Product Lifecycle Management (PLM) process to address manufacturing operations and enterprise system concerns for new products. • Maintain schedules for ramp and a smooth transition to HVM, ensuring milestones are met. • Oversee sample processes, ensuring delivery meets specifications, customer expectations, and On-Time Delivery (OTD) performance metrics. • Ensure product Bill of Materials (BOM) complies with Design for Supply Chain (DfSC) and Bill of Material Risk Review (BRR) guidelines. Facilitat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Responsibilities: As an Engineer, TSE Probe Integration at Micron, you will play a crucial role in our ambitious and world-class team. Your responsibilities will include: Supporting the evaluation, fixing, installation, and deployment of Probe FOAK TOR equipment across manufacturing sites. Deploying best-known methods across all sites, addressing TOR procedure gaps and equipment deficiencies, and building and implementing improvements. Partnering with Probe HVM site equipment teams to develop and support new process and technology implementations. Monitoring process efficiency and OEE to identify improvement opportunities and recommend corrective actions. Supporting TOR equipment operating software and software release activities. Evaluating new technologies and FOAK equipment to improve current toolsets and operating methods. Completing assigned projects and tasks independently with a hardworking approach. Traveling domestically or internationally as needed to support business-critical projects and deployments. Adjusting to functional rotations according to business requirements. Bringing to bear AI skills to improve workability and adopting AI-related skills into the work. Leverage AI-enabled tools and data analytics to improve equipment performance, troubleshooting efficiency, and process optimization. Utilize AI and automation solutions to streamline engineering workflows, accelerate pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, expectations, and deliverables aligned with ramp milestones and fab n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through different phases of a product i.e. concept, build, NPI and HVM by facilitating multi-functional life-cycle management. You will help build and maintain a detailed development schedule and guide the vital tactical progress. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and work you're doing. Responsibilities: Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with the Technology Development, Build, Process, APTD, PE and Manufacturing teams to drive development progress and alignment. Collaborate with PMO org to build and sustain a detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM. Provide regular communication of development status, priorities, and challenges across the broader organization. Set and prioritize tactical expectations across development activities, according to defined achievements and collaborator needs and expectations. Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and leading development documentation. Consolidate a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10. You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality. Job Responsibility: Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Career Growth & Impact Direct ownership of probe strategy and quality outcomes across the product lifecycle. Exposure to advanced technology nodes, customer‑driven requirements, and large‑scale manufacturing systems. Clear growth paths across senior technical contributor, product leadership, or people management tracks within STPG Product Engineering. <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Director, Package Quality & Reliability Engineering Job Summary The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC. Working closely with Package Development Engineering (PDE), front-end fabrication, manufacturing, and quality teams, the role drives Design for Reliability (DFR), qualification rigor, and structured problem-solving at the chip-to-package interface, while building strong team capability and operational excellence. Main Responsibilities Package Quality & Reliability Engineering Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo-mechanical str