Interns 2027 I Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Architecture team drives exploration and analysis of next‑generation AI memory and system environments. The organization partners closely with DTPCO, Design, and Product/System teams to understand how evolving AI workloads shape memory system behavior and architectural strategies. The HBM Design Architecture Intern supports early‑stage research, performance modeling, and tool development that guide future HBM architectural decisions. This role provides hands‑on exposure to AI system trends and memory subsystem analysis while working closely with senior engineers and technical mentors. Responsibilities Research emerging trends in compute, networking, and storage infrastructure to understand how future AI workloads may evolve. Support HBM architecture analysis by gathering and synthesizing data related to bandwidth, latency, and system‑level memory requirements. Help develop or refine simulation frameworks used to model AI cluster performance and memory subsystem behavior. Participate in building trend dashboards using CSP benchmarks and industry datasets. Collaborate with DTPCO mentors to explore architectural intercept opportunities for next‑generation AI systems. </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions that power artificial intelligence, high-performance computing, and data center applications. The team drives architectural innovation across memory systems, controllers, interfaces, and reliability features to deliver industry-leading performance, scalability, and efficiency for future computing platforms. As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal behavior, and memory controller interactions. Develop and enhance performance models, simulators, and analytical tools using Python, C&#43;&#43;, or similar technologies to assess architectural trade-offs and system performance. Analyze workload behavior, simulation results, and architectural data to provide recommendations for future HBM product development. Utilize AI-assisted engineering tools and workflows to accelerate software development, specification analysis, data exploration, and technical documentat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Engineer is responsible for leveraging area knowledge to optimize area performance and reduce cycle time. A Manufacturing Engineer collaborates with PD, ATE, PEE, ME and IE teams to expedite product movement and reacts to process issues that could impact quality. Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that power Artificial Intelligence (AI), high-performance computing, graphics, and data center applications. Our team collaborates across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver next-generation memory technologies. As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products. This internship provides hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to real-world memory design projects in a collaborative global environment. Responsibilities Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis. Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis using AI-enabled engineering techniques where appropriate. Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development. Document technical work

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a System Architect at Micron Technology, Inc. you will be responsible for defining next generation of Managed NAND architecture, studying and reverse engineering system software and system hardware. Through the design/integration team you will provide support regarding MNAND products like eMMC and UFS, in Android/Linux platforms to: Characterize usage models and platform behaviors , Propose new ASIC architectures, FW models, NAND changes , Support BU’s customer discussion on next generation topics , AI impact on storage products . The ideal candidate for this role would share our passion for new topics, idea generation and prototypization , system modeling . Another important requirement is usage of AI tools for SW development: the candidate should be AI proficient in programming leveraging AI coding capabilities as well. We are looking for highly talented , passionate, and versatile engineer that can contr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We validate Micron memory products on current and next-generation computing platforms. As an Intern System Compatibility Engineer, you will join our System Enablement and Test Development teams and gain hands-on experience with platform bring-up, system configuration, memory validation, test development, automation, data analysis, and AI-enabled engineering workflows under the guidance of experienced engineers. We will provide technical mentorship, structured onboarding, and exposure to DRAM, BIOS and firmware interactions, computer architecture, laboratory workflows, responsible use of approved AI tools, and the memory product lifecycle from initial bring-up through qualification and readiness. Key Responsibilities Set up and support Intel, AMD, and ARM-based systems in Linux, Windows, and UEFI environments; document hardware, BIOS, firmware, operating system, memory, and test configurations for repeatable execution and traceability. Implement memory validation activities that assess compatibility, stability, reliability, performance, and platform readiness. Reproduce and triage failures, collect logs and diagnostic data, use issue-tracking systems, apply structured failure-analysis methods, and support validation of corrective actions. Build or refine automation using Python, PowerShell, C&#43;&#43;, or related languages; use approved AI-assisted tools to accelerate code development, test generation, log analysis, data summarization, technical research, documentation, and report

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Utilize AI-enabled tools and data analytics solutions to improve engineering productivity, accelerate problem solving, an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Scope of project: Analyze NAND defectivity(DPM) pareto to enable qualification of world class end products (Mobile, Consumer SSD, Enterprise SSD) Perform electrical failure analysis(EFA) to solve technical problems using lab tools and techniques Exposure to DPM counter measures in the form of stresses/screens by exercising Digital and Analog Circuit, Device Physics, Process Engineering knowledge Drive Physical Failure Analysis (PFA) and Root Cause Analysis. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Minimum Qualifications: Master's Degree in Electrical Engineering OR Bachelor's Degree in Electrical Engineering Understanding of NAND Flash Device Physics, Memory Design and fundamental Semiconductor processing is an added advantage. Knowledge of Programming Languages such as Python/C/C&#43;&#43; Effective communication skills in written and spoken English Good multitasking skills and ability to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in advanced semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s broader $150 billion global expansion, the High Volume Manufacturing (HVM) organization leverages AI-Enabled innovation, advanced analytics, and operational excellence to deliver world-class memory solutions at scale. As an ID1 High Volume Manufacturing Process Engineer Intern, you will support process optimization, yield improvement, and cost reduction within a high-volume fab environment. You will collaborate with equipment engineering, operations, and multi-functional partners while applying data-driven methodologies and Applying AI to improve wafer output, stability, and performance. Responsibilities Analyze manufacturing data and Apply SPC, FDC, and 8D methodologies alongside AI Assisted analytics to improve yield, reduce defects, and enhance tool availability. Investigate process excursions and Using AI, including LLMs and Generative AI tools, to identify trends, perform root-cause analysis, and recommend corrective actions. Collaborate with multi-functional teams to optimize wafer processing using AI-Enabled and data-driven decision-making approaches. Implement process improvement projects focused on increasing wafer outs, Using AI and visualization tools to enhance process capability and efficiency. Maintain and update process documentation, integrating insights gen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Systems & Architecture Lab researches and develops next-generation memory architectures that enable future AI, cloud, data center, and high-performance computing platforms. By combining advanced modeling, simulation, AI-enabled workflows, and architectural innovation, the team evaluates emerging memory technologies and defines solutions that improve performance, scalability, and efficiency for future memory systems. As a DRAM Architecture Research Intern, you will develop software frameworks, automation tools, and AI-assisted workflows that accelerate memory architecture research and analysis. You will work closely with architects and researchers to evaluate next-generation memory technologies, build simulation environments, perform performance analysis, and apply advanced AI capabilities to automate architectural studies and design-space exploration. Responsibilities Develop and enhance software frameworks, simulation environments, and automation tools that support DRAM architecture research and evaluation. Design and implement AI-assisted workflows for simulation generation, experiment automation, data analysis, technical documentation, and engineering productivity. Analyze memory architectures, including DRAM, LPDDR, DDR6, MRDIMM, CAMM, and emerging memory technologies, using modeling and simulation techniques. Perform performance, power, bandwidth, latency, and workload characterization studies to identify architectural trade-offs and optimization opportunities. Coll

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron's DRAM Systems & Component Architecture team to develop next-generation software platforms and AI-enabled workflows for memory-system architecture research. This role combines computer architecture, DRAM systems, software development, and artificial intelligence to accelerate architecture exploration, simulation, data analysis, and technical decision making for future memory technologies. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $35.96 - $43.15 an hour Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to

At Gilead, we’re creating a healthier world for all people. For more than 35 years, we’ve tackled diseases such as HIV, viral hepatitis, COVID-19 and cancer – working relentlessly to develop therapies that help improve lives and to ensure access to these therapies across the globe. We continue to fight against the world’s biggest health challenges, and our mission requires collaboration, determination and a relentless drive to make a difference. Every member of Gilead’s team plays a critical role in the discovery and development of life-changing scientific innovations. Our employees are our greatest asset as we work to achieve our bold ambitions, and we’re looking for the next wave of passionate and ambitious people ready to make a direct impact. We believe every employee deserves a great leader. People Leaders are the cornerstone to the employee experience at Gilead and Kite. As a people leader now or in the future, you are the key driver in evolving our culture and creating an environment where every employee feels included, developed and empowered to fulfil their aspirations. Join Gilead and help create possible, together. Job Description Intern - Research - Pathobiology - AI As a Gilead intern you will contribute to high-impact meaningful projects that will not only further advance our company’s mission but will allow you to gain real world experience at one of the most innovative organizations in the world. You will also have opportunities to participate in special events including professional development and leadership presentations, social/network building activities and local community volunteer programs. We are seeking a highly motivated intern to support the execution of key Digital Pathology and AI initiatives across Research and Development. This individual will work with a cross-functional t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life. Our commitment to people, innovation, tenacity, collaboration, and customer focus enables us to deliver leading memory and storage solutions that power artificial intelligence, data centers, mobile devices, automotive applications, and other emerging technologies. The DRAM Lithography team develops and optimizes advanced photolithography processes tha t support current and future semiconductor manufacturing technology. As a DRAM Lithography Intern, you will contribute to projects focused on advancing next-generation semiconductor manufacturing processes. You will collaborate with engineers across Photolithography, Metrology, Dry Etch, Wet Process, and other process areas to develop innovative solutions for process optimization and technology development. During the internship, you will complete one or more technical projects with opportunities to apply AI and data-driven approaches to complex manufacturing challenges. Responsibilities Design and execute experiments (DOE) to optimize photolithography processes, including EUV lithography, photoresist performance, and related process technologies. Plan, run, and document experiments in a semiconductor cleanroom environment using advanced process equipment. Analyze process images and manufacturing data using commercial and in-house software tools, including AI-enabled methodologies where appropriate. Support projects focused on photolithography simulations, process window opti

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Fab10X,1 North Coast Drive Department Non-Volatile Engineering Product Engineering, NAND Reliability Project Title Intrinsic Reliability Validation Coverage Enhancement Project Description The intern will review existing intrinsic reliability validation coverage for NAND products and identify critical functionalities that may require additional testing. The project focuses on improving validation robustness and enabling earlier issue detection before product sampling. Objective of the Project Develop a comprehensive validation coverage matrix and recommend enhancements based on existing test flows and product datasheet specifications. Opportunities for Full Time Employment Upon successful completion of the internship, the intern may be considered for future full time employment opportunities, subject to satisfactory performance, role availability, and business needs. Project Scope Review existing intrinsic reliability test flows and validation coverage. Map current tests against datasheet-defined product functionalities. Identify coverage gaps that could delay issue detection.