Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design onl
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are building the next generation of memory design by embedding AI into how circuits are designed, validated, and brought to silicon. We work at the intersection of design, CAD, and data, and we focus on solutions that scale across teams and technology nodes. If you want your work to directly impact silicon outcomes, this team delivers! This role is critical to transforming memory design workflows using AI and automation. You will partner closely with design, layout, CAD, and product teams to reduce manual effort, improve quality, and accelerate time-to-tapeout across memory products. Responsibilities: Embed AI and automation into circuit design, layout, and verification workflows Apply data-driven methods to modeling, validation, and tape-out iteration reduction Enable AI-assisted optimization of floorplanning, placement, routing, and simulation Leverage historical design and silicon data to drive predictive insights Collaborate across design, CAD, and manufacturing teams to scale AI-enabled methods Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent practical experience 5 to 7 years Experience with circuit design, layout, verification, or CAD flows Strong coding skills with the ability to develop and maintain production-quality software in Python or similar languages Experience applying data analysis, machine learning, or automation to engineering workflows <
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Define physical design rules for current and future Non-Volatile Memory (NVM) technologies from conception to full production ramp. Interact with process integration team to keep all technology developments up to date, to ensure DR's are accurate. Interact with design teams to evaluate the feasibility of different layout and architecture options (i.e., design rule and process limitations). Interact across multi-disciplinary teams to understand product and test structure failures and their interaction with layout and mask generated data Support design rule checking (DRC) of both base and mask layers and interface with physical verification team. Define algorithms for generation of mask data from drawn base layer data. Involve projects across multi-disciplinary teams focusing on layout and mask generation issues About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of hig
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly experienced Staff Engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description: Responsibilities will include, but are not limited to: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 5+ years of experience in semiconductor industry in areas such as Process Integration, Yiel
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Have you ever dreamed of contributing to the development of groundbreaking technologies? Micron plans to invest more than $250 billion globally over the next decade in groundbreaking manufacturing and R&D, including fab expansion in the United States giving us the opportunity to bring in passionate team members to help us continue to be at the forefront of memory in the World! We have an outstanding opportunity for a high energy, tenacious, ambitious, result driven individual with a strong work ethic and integrity to join our Facilities Team in Boise, Idaho! Micron seeking a Life Safety & Fire Alarms Systems Engineer, to become part of a team that is helping shape the future of how the world uses information. T his is an outstanding opportunity to work at the forefront of technology while supporting the design, operation, and continuous improvement of critical life safety systems within world-class semiconductor manufacturing facilities. Responsibilities: Serve as a technical owner for fire alarm, mass notification, emergency communication, and life safety systems. Review of vendor provided design drawings and specifications for completeness, accuracy and adherence to all applicable design and safety standards and codes including NFPA 72, NFPA 70, NFPA 101, IFC, IBC, and FM Global requirements. Review system configurations, equipment layouts, and distribution routing to ensure functionality, life s
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description Key Responsibilities: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 2+ years of experience in semiconductor industry in areas such as Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development
We take play seriously. We’re looking for curious adventurers ready to find their party, fueled by imagination and drive to build what’s never been built before. At Hasbro and Wizards of the Coast, you’ll collaborate with passionate teams to reimagine our iconic brands and create experiences that spark joy, connection, and community through the magic of play. This is your chance to shape legendary play that lasts a lifetime. Position Summary: We are seeking a highly motivated and diligent Project Engineer to join the Preschool & Fashion Engineering team. In this role, you will play a key part in crafting toys and deliver groundbreaking play experiences to reach more than 1 billion fans annually. The candidate will be owning the engineering development and delivery of innovative, safe, high-quality, and efficient products from concept through production launch, including PEPPA PIG, MY LITTLE PONY, BABY ALIVE and more. This role requires close collaboration with Product Design, Project Management, Packaging, Quality Assurance, and manufacturing partners to ensure successful product execution throughout the development lifecycle. The ideal candidate combines strong engineering fundamentals with excellent project management, communication, and problem-solving skills. Key Responsibilities: Product Development Lead engineering development activities for Preschool & Fashion product lines. Support new product development from concept evaluation through market introduction including feasibility study of concepts, estimate BOM cost and tool plan at initial stage. Partner internationally with multi-functional team to drive product development to meet specification within timeline. Analyze various engineering build options to work towards the best product performance, quality, efficient product cost and shortest development path. Product debug and drive issue resolution during development and production phases. On-site review to support manufacturing proc
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description About Our Team Our team builds and enables scalable, cloud-native software platforms that power critical manufacturing and business operations. We use modern full stack engineering practices and AI-driven technologies to create innovative solutions that improve automation, decision making, and operational efficiency. Position Overview We are seeking an AI-Centric Full Stack Software Engineer to design, build, and support modern software solutions with a strong focus on AI-enabled applications and intelligent automation. This role goes beyond simply using AI coding assistants. You will have strong understanding of Prompt Engineering, Vibe Coding, Rework Rate Reduction and leverage Custom Agents, and integrations built around the Model Context Protocol (MCP). You will apply strong software engineering fundamentals to assemble, integrate, and operationalize AI capabilities into real production systems being accountable for Full-Stack solutions. The goal of this role is to significantly shorten development and feedback cycles by automating routine engineering work, augmenting human decision-making, and embedding intelligence directly into our development workflows and the applications we deliver! Responsibilities Design, develop, test, deploy, and maintain scalable full stack applications and platform services. Own software solutions end-to-end, including system design, architecture, implementation, testin
About Us: Samara Aerospace is revolutionizing satellite design by addressing the challenges of deploying and managing large satellite constellations. Our innovative Hummingbird spacecraft bus offers a modular and scalable platform that streamlines satellite production and deployment, significantly reducing launch costs. Hummingbird's compact architecture maximizes launch capacity, making it the most efficient and agile spacecraft in the industry. At the core of our technology is the patented Multifunctional Structures for Attitude Control (MSAC) system. Unlike traditional wheel-based pointing control systems, MSAC utilizes actuators embedded in the hinges of deployable solar panels to provide 3-axis attitude control and active jitter cancellation. This design eliminates the need for spinning wheels, reducing mass and potential points of failure, while enhancing pointing precision. Role: The Mechanical team at Samara is seeking a mechanical engineer to support the design, analysis, build, and testing of next-generation spacecraft at our headquarters in San Francisco. You’ll work closely with experienced mechanical and electrical engineers, gaining exposure to spacecraft structures, mechanisms, solar arrays, ground support equipment, and environmental testing in a fast-paced startup environment. Responsibilities: Design, analyze, procure, assemble, and test satellite structures, mechanisms, and solar arrays. Identify loads, interface, and functional requirements at the component- and systems-level. Select materials and mechanical components suitable for space environments. Incorporate design for manufacturing (DFM) and design for assembly (DFA) features. Contribute to and help define high-level spacecraft architecture. Collaborate with the electrical engineering team to successfully integrate avionics and wiring harnesses. Perform mechanical and/or thermal analysis of spacecraft systems. Generate manufacturing drawings, manage BOMs, and source components. Participate
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Package Development & Engineering Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments. Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems. Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness. Analyze engineering data, identify risks, document findings, and recommend technically sound actions. Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives . Design, CAD & EDA Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables. Use CAD/EDA tools
About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We're looking for an Optical Interconnect System Engineer to design, qualify, and deploy scalable optical connectivity for large-scale AI infrastructure. This role spans fiber-system architecture, optical-mechanical integration, validation, reliability, deployment, and serviceability. You will work with optical, mechanical, electrical, networking, manufacturing, reliability, and data-center teams to translate system needs into practical interconnect solutions. This is a hands-on role for someone who can connect design decisions with installation, qualification, troubleshooting, and long-term operational performance. In this role, you will: Define optical interconnect architectures and requirements across hardware platforms and rack-level systems. Design high-density fiber systems for performance, density, reliability, installation, and serviceability. Lead optical-mechanical integration and cross-functional design reviews. Develop test and qualification plans for optical components, modules, switching platforms, and integrated systems. Own optical loss budgets, routing guidelines, handling requirements, and serviceability criteria. Support system bring-up, deployment, troubleshooting, failure analysis, and reliability improvement. Create reusable design guidelines, interface requirements, and qualification methods. You might thrive in this role if you have: Core experience Experience desi
About the Team OpenAI, in partnership with our capital and technology partners, is building a global network of advanced datacenters to support the most demanding AI workloads. The Industrial Compute team ensures that all datacenter systems are manufactured, delivered, and commissioned to the highest standards of quality, reliability, and performance. We work closely with manufacturing partners, engineering teams, and operations staff to ensure that every component is delivered ready for installation, startup, and long-term service. About the Role We are seeking an experienced Quality Engineer (QE) to drive Product and Site Quality initiatives across OpenAI’s infrastructure ecosystem. In this role, you will establish, implement, and manage a comprehensive, quality-focused program across our global supply chain network, ensuring excellence from design through deployment. You will be responsible for end-to-end quality of finished products, as well as maintaining and elevating manufacturing site quality standards. Working cross-functionally with Design (NPI) and Engineering teams, you will help achieve First Pass Yield (FPY), quality, and reliability targets. This includes leading site and fixture validation efforts, driving yield improvement initiatives (Yield Bridge, CPI), and implementing robust corrective and preventive actions (CAPA) to resolve issues at their root cause. In addition, you will play a key role in supplier quality management, assessing and qualifying new vendors, overseeing ongoing supplier performance, and ensuring readiness for future business awards. You will lead vendor audits, monitor key performance metrics, and coordinate corrective actions to ensure predictable delivery schedules, reduced operational risk, and high system reliability. By partnering closely with external suppliers and internal Engineering and Operations stakeholders, you will help ensure OpenAI’s datacenter infrastructure is delivered on time, meets the highest quality standa
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