Manufacturing Equipment Production Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a member of the engineering team, you will take a lead role in the development of next-generation defense technologies, including but not limited to unmanned aerial vehicles (UAVs), missiles, and advanced weapon systems. You’ll regularly interact with senior leadership to influence fundamental operation of our platforms while collaborating with electrical, software, mechanical, and manufacturing teams to steer this project from initial conception to manufacturing. Key Responsibilities Design of advanced RF front ends and transceivers in support of next generation products including phased arrays, transmitters, and receivers. Mastery and expertise of RF components such as matching networks, filter synthesis, LNAs, Mixers, VGA, PLL/Synthesizers, and VCOs. Design, schematic capture, and PCB layout of RF transceivers and High-Speed circuits. Utilize best practice and strategies to minimize and troubleshoot EMI/RFI issues. Perform design validation testing of prototype and production designs with test equipment such as signal generators, spectrum/signal analyzers, network analyzers, power meters, noise figure meters, and etc. Contribute to various aspects of the integration of the RF/Microwave designs into aircraft and other systems. Analyze in-th

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role As a member of the engineering team, you will take a lead role in the development of next-generation defense technologies, including but not limited to unmanned aerial vehicles (UAVs), missiles, and advanced weapon systems. You’ll regularly interact with senior leadership to influence fundamental operation of our platforms while collaborating with electrical, software, mechanical, and manufacturing teams to steer this project from initial conception to manufacturing. Key Responsibilities Design of advanced RF front ends and transceivers in support of next generation products including phased arrays, transmitters, and receivers. Mastery and expertise of RF components such as matching networks, filter synthesis, LNAs, Mixers, VGA, PLL/Synthesizers, and VCOs. Design, schematic capture, and PCB layout of RF transceivers and High-Speed circuits. Utilize best practice and strategies to minimize and troubleshoot EMI/RFI issues. Perform design validation testing of prototype and production designs with test equipment such as signal generators, spectrum/signal analyzers, network analyzers, power meters, noise figure meters, and etc. Contribute to various aspects of the integration of the RF/Microwave designs into aircraft and other systems. Analyze in-th

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As a Real Time Defect Analysis Engineer, you will drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization. Working closely with cross-functional engineering teams, you will investigate defectivity and process deviations, evaluate new materials and equipment, implement corrective actions, and develop solutions that enhance process capability, product performance, and manufacturing efficiency. Success in this role requires strong analytical and problem-solving skills, effective collaboration, and a passion for continuous improvement and technology innovation. Main Responsibilities Establish and improve process condition and technology. Upgrade process capability and reduce production cost. Establish and modify process management projects. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to und

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Shift Process Engineer is responsible for improving process quality, working on yield and efficiency improvements, cost reduction, and resolving line issues in their assigned area to achieve area KPIs and optimize manufacturing wafer outs. They partner with equipment team members, leaders within the area, shift operations leaders, and periphery stakeholders to ensure critical area priorities are understood and executed on Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures proper tool documentation/reaction mechanisms exist and submits updates to content Leads in expertise of executing area operations to ensure throughput needs are accomplished Resolves or escalates issues that

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As a Real Time Defect Analysis Engineer, you will drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization. Working closely with cross-functional engineering teams, you will investigate defectivity and process deviations, evaluate new materials and equipment, implement corrective actions, and develop solutions that enhance process capability, product performance, and manufacturing efficiency. Success in this role requires strong analytical and problem-solving skills, effective collaboration, and a passion for continuous improvement and technology innovation. Main Responsibilities Establish and improve process condition and technology. Upgrade process capability and reduce production cost. Establish and modify process management projects. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other proc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. check process weak point review by AI assistance. AI assisted About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexua

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. AI Relevant Job Responsibilities: - Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. - Ability to apply baseline digital fluency and role ‑ appropriate AI literacy to use AI ‑ enabled tools responsibly and effectively for research, analysis, content creation, problem ‑ solving, operational tasks, and achieving business About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet). This role spans mold compound and underfill material selection and qualification, wafer level molding and encapsulation processes, underfill dispense and cure, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities: Develop and optimize wafer level molding processes including compression molding, transfer molding, and mold underfill (MUF) for fan-out and advanced heterogeneous packages. Own mold compound and underfill material selection and qualification, including evaluation of filler content, CTE, modulus, Tg, viscosity, and moisture uptake to meet thermo-mechanical and reliability requirements. Drive underfill process development including capillary underfill (CUF) dispense strategies, flow and void optimization, and cure profile development for high-density flip chip and chiplet assemblies. Evaluate and mitigate assembly risks including warpage, delamination, void formation, bleed-out, mold flash, and filler settling; define process windows and controls to ensure repeatable yield across wafer and panel formats. Collaborate with OSATs and material suppliers to qualify mold and underfill materials, define dispense and cure equipment requirements, and manage process transfers into production. Lead characterization of mold and underfill material properties (viscosity, gel time, cure kinetics, adhesion, CTE, modulus) and correlate material behavior to process outcomes and package reliability. Work closely with thermal mechanical modeling teams to model solder joint reliability of bump interconnects with va

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The qualifications and skills for this position include, but are not limited to: Bachelor’s or master’s degree in Electrical Engineering or Computer Engineering with 7+ years of proven experience in Test Engineering role. Excellent programming skills for writing and debugging ATE test programs and test-related hardware development. Proficiency with Advantest V93K ATE platforms and/or other logic device ATE testers is preferred. Proficiency in programming with C/C++ and/or JAVA is required. Solid understanding of testing for CMOS SoCs. Prefer candidates with exceptional digital, analog, and MXS test programming and debug experience. Familiar with testing IP blocks such as PLL, efuse, DDR. Expertise in test strategy development, test plan definition, DFT pattern implementation (ATPG SCAN, TDF, MemBIST and repair, BSACAN, JTAG/IEEE1500, and Functional Patterns). Expertise in ATE architecture and test hardware design and debugging, schematic capture, and PCB layout. ATE test vector conversion tools like VTRAN and proficiency in debugging issues during development or high volume production. Knowledge of semiconductor manufacturing process. Knowledge of accurate and effective use of lab test equipment (i.e., oscilloscope, logic analyzer, etc.). Experience with data analysis software in support of c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. AI in Job Responsibilities: •Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. •Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. AI in Job Requirements: •Baseline digital fluency, with the ability to use AI-assisted tools to support research, analysis, content creation, problem-solving, or operational tasks relevant to the role. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion Planning Engineer, you will be a key contact in preparing for production in a new high volume memory manufacturing facility in Boise, Idaho, calculating and presenting capital impacts of processes that will be introduced at the site to senior leaders in manufacturing and R&D. Innovation is highly valued at Micron. In this role, you will have the opportunity to develop new visualization and data driven tools to expedite, optimize and refine the fab planning and reporting processes used to prepare, ramp, and operate the site. Successfully partnering with supply chain, finance, engineering, procurement, production, and R&D, you will connect the business in driving execution of manufacturing, including long term capacity, capital planning and cost savings, for the operation. The ability to understand and efficiently communicate capital impacts of manufacturing changes is essential. Every day, our team has the opportunity to provide recommendations which will transform the future of memory manufacturing through data analysis and a growth mindset. Are you ready to meet the challenge? Your responsibilities will include, but are not limited to: Collaborate with partners to drive future tool and process roadmaps, and calculate network capacity impacts of process changes Complete financial analyses before new capital equipment is purchased including metrics optimization, process flexibility, capacity sharing and equipment repurpose Handle site tool utiliza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Waferless Metrology team within Micron’s Metrology organization, supporting advanced semiconductor manufacturing using inspection guided by design software. We are a small, highly engaged group that values precision, speed, and practical problem solving. Our work directly impacts yield, cycle time, and manufacturing confidence! This role plays a key part in enabling waferless, non-contact metrology for advanced processes. You will translate design data into reliable, production-ready recipes that support both high-volume manufacturing and R&D. The work is collaborative, detail-focused, and performed onsite without cleanroom requirements. Responsibilities: Develop and validate waferless metrology recipes using CAD data Translate CAD designs into measurement locations and alignment strategies Partner with process, yield, and equipment teams to define inspection targets Automate and support recipe generation for manufacturing and R&D Analyze metrology results and resolve recipe execution issues Minimum Qualifications: Bachelor’s degree in engineering, physics, materials science, or equivalent practical experience 2+ years of experience in semiconductor metrology, process engineering, or CAD-based recipe development Experience with CAD tools and metrology platforms such as SEM or CD-SEM Strong analytical and problem-solving skills Preferred Qualifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Fab Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. This position will identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Japanese skill (conversational level) About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The F15 ATE DIF Engineer is responsible for successful transfer achievement of new technode transferred from TD, Yield improvement/CT reduction/tool expansion toward TTMCY with great collaboration with TD/F15 all related Dept/DRAM network/MCT.Safety, Technology transfer to sister site & further new tech node transfer readiness are also our responsibility. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take a responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated to work positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-perfor