Manufacturing Quality Engineer Jobs

Job Requisition ID # 26WD100617 Position Overview Autodesk is shaping the future of the design and make industries by helping our customers navigate a rapidly evolving AI-driven landscape. Supporting our Autodesk AI initiatives, you will help us understand how AI and new business models are reshaping the competitive landscape across Manufacturing, AECO (Architecture, Engineering, Construction, and Operations), and Media and Entertainment. This is an individual contributor role on a team with deep business, industry, and technical experience. A successful candidate builds with AI by default, not as a tool added on top. The way competitive intelligence gets done is changing faster than most business functions can adapt. We’re hiring for that gap. You will spend as much time building the systems that produce our intelligence as you will producing it. Location : We support hybrid work, and you work near our Portland, Oregon, or San Francisco, California offices. Responsibilities Build and maintain the automated systems that produce our intelligence, including source monitoring and refresh cadences Find the parts of our process that shouldn’t be manual anymore and fix them without waiting for permission Track how AI is changing our markets, following competitors, startups, funding, product releases, partnerships, research, talent movement, and regulatory shifts Work directly with business functions, product management, engineering, and technical benchmarking to define target markets, map competitive landscapes, size opportunities, identify gaps, and test market and com

At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: We are seeking a motivated and detail-oriented Procurement A

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: As a Facilities Mechanical Engineer, you will play a pivotal role in ensuring the reliable operation and maintenance of Intel's advanced mechanical systems, supporting our cutting-edge manufacturing, cleanroom, and research and development activities. Your work will directly impact Intel's ability to innovate and deliver world-class technologies by maintaining the critical infrastructure that enables peak operational performance. This role offers a unique opportunity to drive engineering excellence, collaborate with cross-functional stakeholders, and shape the future of Intel's facilities globally. Key Responsibilities: Ensure the availability, reliability, and maintenance of mechanical systems such as oil-free air systems, HVAC systems, chilled water plants, boilers, environmental abatement systems, and compliance exhaust systems. Support daily tactical efforts to meet safety, reliability, and environmental targets for mechanical systems. Design and analyze mechanical systems and equipment, troubleshoot systematic issues, and provide evaluations, recommendations, and solutions to resolve problems. Develop engineering scopes of work for mechanical projects and conduct design reviews to ensure system integrity and performance. Conduct feasibility studies and testing on new and modified designs, while overseeing prototype fabrication and design testing. Partner with internal business units and operations teams to deliver engineering solutions tailored to their specific needs.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ● Experience in - Telephony/Teams Call/AudioVisual Zoom rooms/Multi-fuction printer - Operation of Microsoft windows OS and LAN TCP/IP - Knowledge related to problem research. ● Ability to analyze and solve problems for Telephony/Teams Call/AudioVisual Zoom rooms/Multi-fuction printer ● Leveraging Artificial Intelligence to speed Micron AI transfermation ●Support the acquisition, installation, maintenance, and administration for hardware and software ●Manage asset and refresh hw align life cycle rule ●Work with world-wide Corporate teams to implement new solutions and meet business requirements ●Those with manufacturing work experience are preferred. ●Proficient in Chinese/English oral and written communication skills. ●Participate in on-call rotation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Human Resources Business Partner (Experienced or Senior) Company: The Boeing Company The Boeing Company is seeking an experienced, strategic Human Resources Business Partner (HRBP) (Experienced or Senior) to support our manufacturing operations. This role is ideal for a seasoned HR professional who thrives in fast-paced, operational environments and who partners closely with business leaders to shape workforce strategy, drive organizational performance, and enhance employee experience. This is a fully onsite position based in Everett, WA supporting manufacturing operations across shifts. Why This Role Matters As a strategic HR Business Partner, you will influence critical business outcomes by aligning HR strategies with operational goals, advising leaders on workforce planning and change, and serving as a visible HR leader on the manufacturing floor. Your work will help ensure a productive, engaged, and resilient workforce that meets both short‑term needs and long‑term organizational objectives. Position Responsibilities: What You’ll Do Maintain a visible, proactive HR presence on the manufacturing floor to support leaders and employees in real time Provide expert guidance on HR policies, labor relations, performance management, employee development, and change management Identify and address systemic workforce trends and issues by analyzing employee feedback and operational data to inform HR strategy and continuous improvement Lead or support complex employee relations cases, ensuring consistent, equitable, and policy‑aligned resolutions Coach and develop leaders to increase managerial capability, strengthen team performance, and drive engagement Partner with Centers of Exce

Distinguished Technologist - Principal Architect, Platform Security and Firmware Systems Description - HP is seeking a senior technical leader to serve as a lead architect for hardware rooted Platform Root of Trust for HP's commercial PC platform. In this role, you will be responsible for envisioning, defining, and driving the architecture of hardware, firmware, software, and cloud-integrated security capabilities that protect HP commercial PCs from current and emerging threats. You will also work across the hardware and security architecture teams, collaborate with HP's Security Research Labs, Firmware (BIOS) team, our security business that creates and deploys industry leading enterprise security and manageability solutions, product management, manufacturing, supply chain, customer enablement, and field organizations to create cohesive system solutions that deliver unique customer value. This position requires deep expertise in embedded systems, platform firmware, hardware, security, device manageability, and PC system architecture. The role also requires the ability to translate complex technical capabilities into customer-relevant value propositions and to influence internal and external stakeholders without relying solely on formal authority. Responsibilities Serve as principal architect for HP Endpoint Security Controller roadmap, associated hardware and firmware based capabilities, cryptographic identity, attestation, secure communication, event logging, and future controller generations. Define and evolve HP Sure Start architecture and related firmware resilience capabilities, including hardware-enforced firmware authenticity, recovery, update, and protection mechanisms. Drive secure BIOS and firmware configuration management strategies, including HP Sure Admin ecosystem capabilities, key management, zero-touch provision

The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. System Integration sits at the intersection of all of them. It is the layer where every architecture, design, software, and manufacturing decision meets reality. When something breaks late in a program, it usually breaks here first. We are hiring a Senior Manager to lead this team in the US and partner closely with teams globally. Your work will sit on the critical path of every NVIDIA silicon program, and the bar you set for system integration is the bar we ship to! The two hardest, highest-leverage problems in this seat: Find critical silicon issues earlier — often before software is production-ready. Left-shifting post-silicon coverage is the highest-value thing System Integration can do. Standing up wide-area testing as a repeatable capability is a core part of the role. Keep programs on milestone when upstream dependencies slip. Validation plans collide with reality every program! The team needs new strategies, not just contingency plans, to keep moving when software, firmware, or methodology slip. You will design and run those strategies. What you’ll be doing: Plan and execute post-silicon feature integration, PVT validation, and wide-area testing across NVIDIA’s GPU, SoC, and CPU programs. Build wide-area and in-system test as a repeatable capability that shifts post-silicon coverage left, so issues surface before we are production-ready. Lead resolution of the most complex system-level issues, RMAs, and HW/SW interaction problems with creative workarounds and focused lab experimentation. Deve