Job Title Material Handler 2 Job Description The Material Handler 2 will assist group leads prepare the line for production; they will ensure the correct components have been issued for the work order based on the BOM. The Material Handler will keep the line supplied with components and remove waste from the line as needed. Your role: Assist the group lead manage the workflow within the assigned manufacturing cell to achieve the daily production objective. Supervise workflow, move full pallets of finished goods to the proper location and monitor inventory of components to insure the line has enough components to complete the order. Interface with warehouse personnel to ensure all components are correct and staged in the appropriate area to avoid delays in production. Maintain the all the materials needed to complete the work order and take appropriate action when it's not. You're the right fit if: You have a high school diploma, GED or equivalent. No experience required, preferably knowledgeable on any of the following manufacturing production e
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MRDA Defect Insight Engineering Scope : Data Analytics Yield correlation analysis Spatial signature analysis Defect density monitoring Process-health dashboards AI/ML model deployment with Agentic AI Predictive excursion detection Defect Management Defect inspection strategy development Inline defect monitoring Defect pareto analysis Defect source identification Yield detractor elimination Killer defect reduction Job requirements Bachelor's or Master's degree in Engineering or related discipline 0–2 years of experience in semiconductor manufacturing or engineering Basic knowledge of ASSY defect analysis for yield improvement Basic knowledge of SPC,FDC or data analysis tools, ie JMP...etc Utilizes baseline digital and AI capabilities appropriate to the role to responsibly leverage AI technologies for research, analytical insights, content generation, process improvement, problem resolution, and the achievement of business objectives. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellen
Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom
Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv
Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron currently has an opening for a Staff or Principal level EUV Equipment Engineer for our Boise, Idaho location. Our Advanced Lithography and Equipment Engineering team enables the technologies that power the future of semiconductor innovation. We work at the leading edge of EUV and High-NA EUV development, partnering across process, manufacturing, facilities, and supplier organizations to deliver world-class equipment performance and support Micron’s technology roadmap. This EUV Equipment Engineer is a technical leadership role focused on maximizing the performance, reliability, and capability of EUV lithography systems. This position plays a critical role in advancing next-generation semiconductor technologies through equipment optimization, problem solving, supplier engagement, and collaboration across engineering disciplines. Responsibilities: Own the performance, reliability, availability, and productivity of assigned EUV lithography equipment Lead equipment installations, upgrades, qualifications, maintenance strategies, and continuous improvement initiatives Drive improvements in scanner performance, tool matching, imaging stability, defectivity reduction, contamination control, and recipe optimization Analyze equipment data and establish monitoring systems to improve overlay, focus, source performance, automation, and overall equipment health Provide technical leadership through supplier management, cross-functional collaboration, mentoring, a
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: Key Responsibilities Develop systems to optimize operational performance across manufacturing platforms. Design, build, and deploy predictive models related to equipment utilization and performance enhancement. Analyze manufacturing data to identify bottlenecks and optimization opportunities for both short-term and long-term planning. Build and deploy LLM-based AI solutions to support fab operations, enabling smarter decision-making and improved operational efficiency. Collaborate closely with PMs, IT, and Core AI teams to drive cross-functional AI initiatives. Build interactive dashboards and visualizations to support data-driven decision-making. Work within the GCP environment for model training, deployment, and maintenance. Explore and implement MLOps, AutoML, and other advanced techniques to enhance model performance and reliability. Required Qualifications Master’s degree or above in Computer Science, Statistics, Engineering, or related fields 3+ years of experience in data science Proficient in Python, SQL, TensorFlow or other deep learning frameworks Skilled in data visualization tools Strong communication skills and experience in cross-functional collaboration </li
Lead Design and Analysis Engineer (Electrical Systems Design) Company: The Boeing Company Boeing is currently hiring for a Lead Design and Analysis Engineer located in Berkeley, MO to be a part of the MQ-25 Electrical and Equipment Installation team. The MQ-25 Stingray is a new autonomous, unmanned carrier based refueling air vehicle. The selected candidate will be a part of aviation history by helping our Navy customer productization Autonomous Carrier landing, takeoff and refueling capabilities. The MQ-25 program is currently building the Engineering and Manufacturing Development (EMD) vehicles for the Navy. Additional work is under way for the beginning of the Low Rate Initial Production (LRIP) program for additional vehicles. The MQ-25 Electrical & Equipment team is responsible for the power architecture & design, electrical equipment technical management, electrical installation design, wire harness design, and integrating avionics and other equipment into the vehicle. This role will be focused on the power architecture & design. Position Responsibilities: Leads work with customers to develop and document complex electronic and electrical system requirements. Leads and coordinates work to analyze and translate requirements into system architecture, hardware and software designs and interface specifications. Leads work to test and validate to ensure system designs meet operational and functional requirements. Researches technology advances for potential application to company business needs. Makes recommendations for technology investments. This position is expected to be 100% onsite. The selected candidate will be require
NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP
At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: The Office Administrator will be required to oversee and man
At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary: We are searching for an Associate Engineer - Cleanroom to jo
At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary : The Construction Project Support Administration Supervisor
At United Integrated Services (UIS), we build more than facilities—we build the infrastructure that enables technologies to shape the future. As a global engineering and construction company specializing in the semiconductor industry, UIS brings together talented people, technical expertise, and innovative solutions to deliver the most complex and critical projects in the industry. Our U.S. team is helping build the next generation of advanced semiconductor manufacturing facilities, working alongside some of the world's leading technology companies. Our work requires precision, collaboration, accountability, and a commitment to doing things the right way—from the planning and engineering stages through construction and project completion. As UIS continues to grow, we are building more than projects. We are building teams, developing careers, and creating opportunities for talented professionals to make a meaningful impact. If you are looking for an opportunity to work on challenging projects, grow your career, and be part of something bigger, we invite you to build the future with UIS. WHAT WE OFFER Comprehensive Benefits – Medical, Dental, Vision, Short-Term Disability (STD), Long-Term Disability (LTD), and Life Insurance provided at no cost to employees. Competitive Compensation – Competitive salaries and opportunities for performance-based incentives. Career Growth – Opportunities to develop your skills, take on new challenges, and grow with a rapidly expanding organization, supported by education reimbursement for eligible employees pursuing continued learning and professional development. Meaningful Work – The opportunity to contribute to some of the most advanced semiconductor construction projects in the country. Collaborative Environment – Work alongside experienced professionals across engineering, construction, project management, safety, procurement, and operations. Summary The QA/QC Inspector (Fire) is responsible for conducting fiel
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof
Job Details: Job Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. With a focus on driving results and fostering collaboration across multiple organizational boundaries, this role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap. Key Responsibilities: - Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions. - Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals. - Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes. - Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power performance and area leadership. - Build and maintain partnerships with supplier executive management to nurture unique industry ideas and research innovations. - Coach and mentor engineering teams in pathfinding and technology road mapping for advanced technology development. - Develop long-term strategies for module engineering capabilities to support emerging technological requirements. - Ensure accountability and drive team results by setting clear goals, performance benchmarks,
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