Mechanical Modeling Engineer Jobs

Mechanical Modeling Engineer — Dayton, OH. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Systems Engineer (Modeling & Simulation) (Associate or Mid-Level) Company: The Boeing Company Boeing Defense & Security (BDS) is looking for an Associate or Mid-Level Systems Engineer (Modeling & Simulation) (Level 2 or 3) to join our multi-disciplined engineering team in Albuquerque, New Mexico designing and developing advanced concepts on a DOD propriety program . This position will join a multi-disciplined team of engineers and scientists to develop and test advanced concepts for the Department of Defense. Work could include such things as image processing and analysis, radiometry, modeling and simulation, evaluation of field data to anchor models, and wherever the data may lead throughout the program. The ideal candidate will have strong MATLAB or Mathematic skills, an interest in data analysis; modeling and simulation; and some knowledge of optics and electro-optics. Position Responsibilities: Assists in developing and validating requirements for various electro-optical systems and components Uses data analysis results and output of mod/sim tools to assist in the development and validation of requirements for electro-optical systems, mechanical systems, interconnects and structures Works with engineering teams to collect and analyze data used to anchor models Performs complicated trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts critical analyses of various kinds to validate performance of designs to requirements Defines and conducts tests to validate performance of designs to requirements and anchor models to fi

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

Role Overview We are seeking a Staff Simulation Engineer to build an end-to-end aerial autonomy simulation stack at DoorDash Labs. This is a highly technical, hands-on leadership role focused on defining and implementing the simulation architecture that underpins autonomy development, validation, CI/CD testing, and pilot training. You will operate as the technical authority for simulation: owning core architecture decisions, developing key components yourself, and setting engineering standards. You will build and mentor a small, high-caliber simulation team while remaining deeply involved in implementation and system design. This role is ideal for someone who has built simulation systems from first principles, understands simulator internals deeply, and is excited to create a world-class platform from scratch. Key Responsibilities Architect and implement an end-to-end simulation stack for aerial autonomy at DoorDash Labs.. Develop high-fidelity simulation capabilities, including: Flight dynamics modeling Contact modeling and constraint handling Sensor and perception simulation Autonomy software-in-the-loop (SITL) integration Design and implement scalable simulation infrastructure to support: Regression testing in CI/CD pipelines Continuous validation of flight autonomy and autopilot software stack Mission-level testing and scenario generation Build cloud-deployed simulation systems to enable large-scale parallel testing and pilot training. Partner closely with autonomy, controls, and aircraft teams to ensure simulation fidelity and validation alignment. Establish technical direction, architecture standards, and performance benchmarks for simulation. Mentor and grow a small team of simulation engineers while remaining deeply hands-on. Required Qualifications Master’s or PhD in Computer Science, Electrical Engineering, Mechanical Engineering, Robotics, Aerospace Engineering, or a related field. 10+ years of experience in robotics or physics-based simulation. Deep expe

Interactive Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and non-technical audiences Build, test, troubleshoot, and iterate prototypes to identify issues and improve product performance, reliability, a

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

Senior Low Observables (LO) Mission Systems Integration Engineer Company: The Boeing Company The Senior LO Mission Systems Integration Engineer will lead design, integration, analysis, test, and production activities for low observable materials, structures, apertures, sensors, and radomes for mission systems. The role requires strong technical leadership, independent execution of complex tasks, advanced use of computational electromagnetic (CEM) solvers, and the ability to produce and defend technical results with minimal oversight. Key Responsibilities Lead design, modeling, and analysis efforts for LO materials, coatings, structures, and integrated mission systems to meet signature reduction and performance requirements. Independently apply CEM solvers (e.g., FEKO, HFSS, CST, WIPL‑D, xFDTD, or equivalent) to model antennas, apertures, radomes, and LO treatments; perform design optimization and trade studies. Drive integration of LO treatments with mechanical, thermal, and sensor/antenna system constraints; identify and mitigate producibility, testability, and sustainment risks. Plan, execute, and oversee laboratory and field tests (anechoic chamber measurements, antenna/radome characterization, RCS measurements); lead data collection, reduction, and validation activities. Develop and validate predictive models, reconcile simulations with measurements, perform uncertainty quantification, and provide actionable recommendations to engineering and program leadership. Produce high-quality technical documentation: test plans, test reports, technical memoranda, design reviews, and customer briefings. Mentor and provide technical oversight to junior engineers and technicians; ensure adherence to engineering processes, qual

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve people's lives. About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will work closely with mechanical, electrical, controls, and robotics engineers to evaluate designs before hardware is built, identify risks early, and guide critical architecture decisions. This role spans structural and thermal analysis and design across robotic subsystems including actuators, mechanisms, structures, electronics, and integrated systems. You will develop simulation workflows that improve engineering velocity, increase confidence in design decisions, and help us build more capable, reliable, and manufacturable robotic platforms. This role is based in San Francisco, CA. This role will be expected to be in office 4 days per week and offer relocation assistance to new employees. In this role, you will: Perform thermal simulations to assess heat generation, cooling strategies, thermal interfaces, and system-level thermal performance Partner with mechanical, electrical, and controls engineers to influence design decisions early in development Build simulation models to evaluate robotic actuators, transmissions, mechanisms, structures, soft goods, and integrated assemblies Correlate simulation results with physical testing and develop methodologies to improve model accuracy Support architecture trade studies by evaluating design concepts before hardware is built Develop simulation workflows, standards, and best practices that scale across the robotics o

Who We Are HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates. We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless. We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset. By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work. Join us as we reinvent work, so people everywhere can do their best work. About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering ana

ABOUT THE ROLE We are seeking a detail-focused engineer to take the lead in ensuring technical documentation is clear, consistent, and accurate. This includes both creating and managing engineering documents. This role collaborates closely with the Mechanical Engineering, Industrial Design, Program Management and Quality Engineering teams to ensure appropriate product definition and design controls through 2D drawings and 3D CAD support for all phases of the product development lifecycle. YOUR DAILY IMPACT AT PELOTON Create technical 2D product drawings for all components and assemblies Provide CAD support to the Industrial Design and Mechanical Engineering teams Establish best practices for 3D and 2D CAD creation Create and manage Bills of Material (BOMs) in Windchill PLM Work with Hardware Engineering team to define engineering tolerances on drawings Coordinate cross departmental drawing and process reviews Review engineering drawings to ensure documentation consistency Stay current with the latest SolidWorks features and updates Support Solidworks deployment throughout company, including installation, upgrades Interface with Windchill PLM team to ensure seamless integration with Solidworks YOU BRING TO PELOTON 4+ years mechanical design experience and/or 6+ years of drafting experience BS in Mechanical Engineering, or equivalent Strong experience with consumer product design Proficiency in 3D modeling software (Solidworks preferred) Detailed-focused in drafting and reviewing drawings Knowledge of product life cycle management Spoken and written English Knowledge of ASME Y14.5 or ISO 8015, 1101 and 2768 drawing standards Proficiency in reading and applying GD&T BONUS Experience with Windchill as a PLM system Advanced 3D surfacing skills Experience working with contract manufacturers #LI-SD1 #LI-Onsite ABOUT PELOTON: Peloton (NASDAQ: PTON) provides Members with expert instruction, and world class cont

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is looking for an Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 3) to join our team in Huntington Beach or El Segundo, California. This position will be joining a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Develops and validates requirements for various communication, sensor, electronic warfare and other electromagnetic systems and components Develops and validates electromagnetic requirements for electrical\electronic systems, mechanical systems, interconnects and structures Develops architectures to integrate systems and components into higher level systems and platforms Performs trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts tests to validate performance of designs to requirements Manages appropriate aspe