Mts Rtl Verification Engineer Jobs

MTS - Machine Learning — Fab 10A, Singapore. Apply via Workday.

MTS Design Engineer, Bonding and Packaging — Boise, ID - Main Site. Apply via Workday.

MTS - Adv Pkg TD Integrator — Fab 10A, Singapore. Apply via Workday.

MTS Equipment Technical & Automation Program Manager, TCP Operation — Tainan, Taiwan. Apply via Workday.

MTS, AI Engineering, SMAI — 2 Locations. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly motivated and experienced Technical Staff Member to join our Quality Engineering team in Boise, ID. Your role will be crucial in ensuring the reliability and quality of wafers shipped from our Boise manufacturing site! Summary The Product Quality and Reliability team ensures Micron delivers high-quality, reliable semiconductor solutions that meet customer expectations and business objectives. The team partners across product engineering, design, technology development, manufacturing, and reliability organizations to identify risks, solve complex technical challenges, and drive continuous improvements in product performance, yield, and customer satisfaction! Position Overview As a Senior Product Quality and Reliability Engineer, you will be a technical leader. You will drive product excellence in quality, dependability, and yield across advanced semiconductor technologies. You will lead complex technical investigations, influence product and technology decisions, and develop innovative approaches that strengthen quality systems and business outcomes. This role provides an opportunity to have broad interpersonal impact through technical leadership, multi-functional teamwork, and strategic problem-solving. Responsibilities Lead complex investigations involving yield excursions, product deviations, and quality issues, driving root cause identification, containment actions, and sustainable corrective solutions Define product quality and reliability moni

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! We are seeking a Principal or Member of Technical Staff (MTS) in Analog Design to join our DRAM IP Design team. As a Principal/ MTS, you will help shape the next generation of Micron's memory products, while working closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level analog and mixed-signal circuits for DRAM projects. Work with the internal data science team and EDA vendors to leverage and improve AI-assisted design flow and circuits optimization. Propose, evaluate and implement new or improved circuit topology to further enhance PPAC of the circuit block. Improve design verification scope and coverage to increase circuit robustness to enhance mass production yield. Partner with global design groups and provide layout guidance through post‑layout simulation. Compare silicon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal/MTS Process Development Engineer with a focus on Vapor/Thermal etching, you will be part of a revolutionary Advanced DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration, equipment development engineers, hardware vendors and other process areas including Dry Etch, Metals, CVD, Diffusion, Lithography and CMP. You will work on state of the art and best in class tooling and own the process roadmap to meet program and yield goals! Responsibilities: Develop and integrate advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM technologies Lead feasibility studies, technical investigations, and root-cause analysis to resolve complex process challenges Drive process roadmaps, technical readiness, and yield improvements to meet program objectives Collaborate with Process Integration, equipment development, hardware vendors, and cross-functional engineering teams to deliver innovative solutio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! We are seeking a Principal or Member of Technical Staff (MTS) in Analog Design to join our DRAM IP Design team. As a Principal/ MTS, you will help shape the next generation of Micron's memory products, while working closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level analog and mixed-signal circuits for DRAM projects. Work with the internal data science team and EDA vendors to leverage Agentic- AI and improve AI-assisted design flow and circuits optimization. Propose, evaluate and implement new or improved circuit topology to further enhance PPAC of the circuit block. Improve design verification scope and coverage to increase circuit robustness to enhance mass production yield. Partner with global design groups and provide layout guidance through post‑layout simulation. Com

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We’re driving the next wave of memory innovation at Micron, pushing the boundaries of DRAM and enabling future scaling! Our team works at the intersection of science and manufacturing, turning advanced concepts into high-volume solutions that power a data-driven world. As a Principal/ MTS Wet Process Development Engineer, you will lead critical process innovation and integration for next-generation nodes. This role shapes wet process technology direction, influences roadmap decisions, and delivers scalable, manufacturable solutions that enable high-volume success. Key Responsibilities Technical Leadership and Problem Solving - Lead development, optimization, and troubleshooting of advanced wet process applications from Wet cleans and etches, Vapor-phase processes, Strip processes, Bevel etch, to Copper plating. Perform rigorous root cause analysis and implement robust, fab-ready and HVM-compatible solutions. Apply strong fundamentals in fluid dynamics, reaction kinetics, thermodynamics, transport phenomena. Evaluate interactions between upstream and downstream processes to ensure integration and yield success. Technology Development and Road-mapping - Translate device scaling requirements into actionable wet process technology roadmaps. Identify technical gaps and define solutions to meet critical specifications (CSPEC). Drive innovation in chemistry, process architecture, and tooling to support future technology nodes. Contribute to the development

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a E5/MTS/SMTS NAND Design Rule / Process Integration engineer, your role is to support the development and high-volume manufacturing of advanced 3D NAND technologies. This role drives design-rule and PDK deliverables, partners closely across process integration and design organizations, and ensures quality, documentation, and timely execution across R&D and production programs. Lead the release of design rules and PDK deliverables; manage DRC waivers, mask definitions, and mask reviews for both R&D and production designs. Own program execution and milestones from kickoff through end-of-life. Partner with stakeholders across Array & CMOS Process Integration, Devices, Layout & Design, Modeling, Scribe & Frame, unit process areas (e.g., PHOTO/OPC/CMP), and Quality & Reliability to guide new 3D NAND generations. Ensure high quality and documentation for Design Rule Checks (DRCs) and drive timely disposition of deviations and exceptions. Collaborate with Yield Enhancement, Product Engineering, Defect Analysis, and Quality Assurance to identify layout- or database-related process issues and prioritize corrective actions. Design and evaluate test structures to generate data for next-generation devices and to assess process margin on

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals. Evaluate and implement new etch technologies, chemistries, and hardware platforms. Mentor and guide junior engineers; foster a culture of innovation and technical excellence. Interface with equipment vendors and external partners to co-develop solutions. Drive root cause analysis and continuous improvement initiatives for process-related issues. Present findings and recommendations to executive leadership and global teams. Qualifications: Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field. Minimum 10 years of hands-on experience in Dry Etch process development , preferably in DRAM or advanced memory technologies . Proven track record of technical leadership in semiconductor process engineering. Deep understanding of plasma etch mechanisms, process control, and defect mitigation. Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques. Strong analytical, problem-solving,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Member of Technical Staff (MTS) – 3D NAND Process Integration Job / Role Summary The role drives advanced 3D NAND technology pathfinding and process integration within the Advanced NAND Technology team in Singapore. It leads the translation of device concepts, materials, and process architecture into validated, manufacturable technology solutions. The position coordinates end-to-end development from concept through technology validation, applies data-driven, AI-assisted, and model-based methods to resolve complex scaling challenges, and collaborates across Device, Probe, Test, Design, and Operations to improve performance, yield learning, execution, and future-node roadmap readiness. Main Responsibilities Lead 3D NAND integration, pathfinding, and advanced architecture enablement in support of the technology roadmap. Drive end-to-end technology development from concept through validation, including learning vehicles, chara