Package Engineering Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Leadership Responsibilities Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement. Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape. Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages. Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models. Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. End-to-End Traceability </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a HIG PSE IE Senior Technician , you will support HBM IQP Reliability, Device Reliability, Package Reliability, Wafer Reliability, and product debug activities . The role includes reliability testing, failure analysis, laboratory operations, inventory and logistics management, audits, safety compliance, and continuous improvement initiatives. You will leverage Artificial Intelligence (AI) and AI-assisted tools to improve IQP reliability run rate management, enhance debug capabilities, support wafer-level reliability testing, and drive automation and digital transformation within the lab environment. Key Responsibilities Support Device Reliability, Package Reliability, and Wafer Reliability execution. Monitor and manage IQP reliability run rates, sample flow, and hardware readiness. Perform first-pass failure analysis and product debugging using probe stations and other debug tools. Utilize AI-assisted tools to improve debugging efficiency, root cause investigation, and operational planning. Support automation projects, data analysis, dashboard reporting, and process improvements. Manage procurement, inventory, logistics, and laboratory readiness activities. Support audits, document control, ESD

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a HIG PSE IE Senior Technician , you will support HBM IQP Reliability, Device Reliability, Package Reliability, Wafer Reliability, and product debug activities . The role includes reliability testing, failure analysis, laboratory operations, inventory and logistics management, audits, safety compliance, and continuous improvement initiatives. You will leverage Artificial Intelligence (AI) and AI-assisted tools to improve IQP reliability run rate management, enhance debug capabilities, support wafer-level reliability testing, and drive automation and digital transformation within the lab environment. Key Responsibilities Support Device Reliability, Package Reliability, and Wafer Reliability execution. Monitor and manage IQP reliability run rates, sample flow, and hardware readiness. Perform first-pass failure analysis and product debugging using probe stations and other debug tools. Utilize AI-assisted tools to improve debugging efficiency, root cause investigation, and operational planning. Support automation projects, data analysis, dashboard reporting, and process improvements. Manage procurement, inventory, logistics, and laboratory readiness activities. Support audits, document contr

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5&#43; years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

Senior Installation Package Development & Validation Engineer (Contract role) Focus Areas : MSI InstallShield (Windows) & Linux/Unix InstallAnywhere Automation Role Type: Contractor – 6 months Primary Focus: Installer Engineering, Packaging & Release Validation InstallShield (MSI), InstallAnywhere, VBScript / Custom Actions, Java / JDBC, Gradle (Kotlin DSL), GitHub Actions, Active Directory / gMSA, Docker Role Overview We are seeking a Senior Installation Package Specialist to own, modernize, and automate the multi-platform installer ecosystem. In this critical role, you will be responsible for end-to-end packaging engineering from developing Windows InstallShield (.msi) and Linux/Unix InstallAnywhere (.iap_xml) installer payloads to orchestrating custom build tasks in Gradle, automating database provisioning via JDBC, and ensuring seamless enterprise upgrades across thousands of mission-critical customer environments. You will collaborate closely with Core Engineering, Security, and Quality Engineering teams to eliminate installation roadblocks, enhance silent/unattended rollout capabilities, support modern enterprise security standards (gMSA, CyberArk PAM), and maintain zero-downtime upgrade integrity. Key Responsibilities Dual-Platform Installer Development & Maintenance Windows Packaging (InstallShield MSI): Maintain and enhance InstallShield project files (.ism) for flagship Windows products. Linux/Unix Packaging (InstallAnywhere): Develop and configure Revenera InstallAnywhere (.iap_xml) project files for Unix based repo installers. Custom Action Engineering: Design, write, and maintain: Windows VBScript / JScript Custom Actions: Develop Immediate and Deferred custom actions (with elevated privilege handling and rollback logic) for configuration gathering, service registration, and file manipulation. Java Custom Actions: Develop compiled Java classes for InstallAnywhere runtime execution to handle

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for understanding the processes used to assess and mitigate risks related to the introduction of new package technologies so that you can improve efficiency and effectiveness by implementing automation, data analysis and machine learning/AI solutions. Set up data bases, develop data ingestion pipelines, and implement automated data analysis and reporting tools. Support problem solving and risk assessment for internal or customer quality issue by pulling and analyzing data. Contribute to the advancement of technology at Micron through mentoring, publishing technical papers (internal and external), and developing innovative solutions to challenging problems. Implement Automation, Data Analysis, and AI Solutions. Collaborate with Engineering teams to Map Package DDQA processes and data streams. Set up and optimize databases and develop solutions to improve efficiency and effectiveness. Understand the needs of internal customers and develop solutions. Support Problem Solving and Risk Assessment for Quality Issues. Pull relevant product information, manufacturing data, and reliability data based on given problem statements. Determine the appropriate dataset and treatment required to answer questions posed by problem solving teams. This could include producing data visualizations, machine learning models, statistical inferences, and web applications. Provide recommendations about root cause findings and product risk, based on data analysis. Collaboratively Communicate Findings and Best Practices. Share best practices with global teams to enable a cultur

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Position Summary As an IoT Engineer, Engineer based in Singapore, you will design, build, and deploy Industrial IoT (IIoT) and machine vision solutions to support advanced packaging technology development and factory enablement. You will implement hands-on engineering work from proof-of-concept through deployment and sustainment, contributing to scalable and secure solutions that improve quality, productivity, and early risk detection. You will collaborate cross-functionally to translate manufacturing needs into measurable signals, robust data pipelines, and actionable insights, while operating with a strong safety mentality and a bias for practical, reliable delivery. Key Responsibilities Develop and deploy IIoT solutions end-to-end: sensing strategy, edge compute, connectivity, data ingestion/storage, monitoring, and sustainment (including data quality and traceability). Build machine vision solutions: support hardware selection (cameras/optics/lighting), image acquisition strategy, algorithm development, performance validation, and deployment readiness. Work with process, equipment, automation, quality, and IT/data platfor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented. Main Responsibilities: Conduct Electrical and PFA Characterization Perform electrical fault analysis to pin-point hot

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Post-Silicon Yield & RMA Leadership Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures. Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions. Develop hypothesis-driven debug strategies and coordinate multi-functional execution. Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans. Device Technology & Process Interaction Analysis Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield. Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations. Translate silicon learning into actionable design and process improvements. Advanced ASIC Design Interaction & Silicon Debug Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems. Analyze silicon failures across transistor, circuit, block, die, package, and system levels. Drive post-silicon debug activities involving design teams, DFT, product engineering, quality,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: ​ - To take on reliability accountability for Singapore Fab 10 with cross-functional projects and tasks which include but not limited to Understand semiconductor reliability failure mechanisms and physics Understand RG and FG process technology and risks on manufacturing quality Understand probe testing, device datasheet spec, and device characterization knowledge Accountable for Fab Reliability performance, define Wafer Level Reliability (WLR) sampling plan, Outgoing Quality and Reliability Monitoring (OQRM) matric, Fab process SWR study and conversion risk assessment Partner with Fab 10 PI/ PEE and Global TD, QE, Product, Test engineering team to meet intrinsic targets through process improvement Perform risk assessment on Class 1 and Class 2 process conversions and advise on data collection requirements and conversion roadmap Development of WLR capability as a proxy for equivalent package level reliability test Deep dive in Product Intrinsic Scorecards and Key Metric Understanding (Endurance, Retention, Program Disturb, X-temp, etc) Part of the Fab quality team contributing as SME in reliability fail modes and its associated detec