Packaging Area Shift Engineer Jobs

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by adjusting work hours and working overtime when necessary to support organizational priorities and ensure successful completion of business objectives. Preferred Qualifications & Experience: High school or GED Preferred 1 year manufacturing experience Preferred Physical & Mental Requirements: May involve prolonged periods of sitting or standing, as appropriate. May be required to reach, push, or pull to accomplish job accountabilities. Requires the use of safety glasses in designated areas.

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Job Details: Job Description: The Role and Impact We are seeking a dynamic individual to lead global supply chain engineering and commercial teams in optimizing supply chain performance and fostering supplier relationships in support of Advanced Packaging Technology and Manufacturing (APTM) operations. In this role, you will drive operational excellence by integrating supplier strategies with Intel's manufacturing capabilities, collaborating closely with cross-functional teams to develop and implement strategies across global manufacturing sites. Business group Strategic Parts and Service Supply Chain (SPSC) is part of the Foundry Construction and Sourcing (FCS) team in Intel Foundry. We play a pivotal role in developing and managing supply chain solutions supporting Intel Foundry's wafer/packaging development and manufacturing operations. Key Responsibilities - Lead global supply chain teams to optimize supplier performance and operational efficiency through clear metrics, market intelligence, and continuous improvement. - Build strategic supplier partnerships to drive long-term engineering and supply chain roadmaps aligned with future technological needs. - Lead benchmarking and industry intelligence to drive supplier and technology improvements in factory equipment spares and service products. - Provide leadership through goal setting, facilitating team execution, maintaining accountability, and driving performance management practices. - Inspire and develop teams to achieve results while role modeling Intel values and creating a productive work environment. Qualifications: Minimum Qualifications - Bachelor's degree in a relevant field. - 12+ years of progressive experience with a Bachelor's degree, 10+ years of experience with an advanced degree in supply chain, engineering

Account Manager - FlexPack Description - This Account Manager role is responsible for understanding and promoting HP's FlexPack (Flexible Packaging) organization's products, using consultative selling techniques to engage with clients, and creating customized solutions. The role manages the sales pipeline, crafts competitive sales strategies, and handles challenging situations in collaboration with account managers. The role stays updated on industry trends and mentors junior team members to enhance their sales and consulting skills. Responsibilities • Demonstrates a deep understanding of the organization’s products and services while explaining product features and benefits to potential customers. • Offers technical expertise and support to the account managers in identifying potential clients, nurturing leads, and driving revenue growth. • Utilizes various sales and marketing techniques to identify and engage with potential clients and helps in tailoring sales pitches and solutions. • Creates and presents customized solutions or proposals that address the client's needs and demonstrate the alignment of the organization’s offerings with the client’s business objectives. • Maintains strong relationships with existing clients providing ongoing support, addressing client concerns, and actively seeking opportunities for upselling or cross-selling. • Develops pursuit plans and manages the sales pipeline to ensure alignment with account managers and overall sales objectives by setting clear goals and strategies for each opportunity. • Utilizes domain-specific knowledge to craft competitive sales strategies to better position the organization’s offerings in the market. • Handles challenging situations like negotiations, and client escalations to resolve issues in a professional and timely manner. • Attends industry events and

NVIDIA’s Executive Briefing Center (EBC) Solutions Architect (SA) team is looking for a highly hands-on Solutions Architect with exemplary communication skills. The role involves developing, demonstrating (in the NVIDIA EBC), and packaging agentic AI systems. Partnering with account SAs you will co-develop proof of concepts (POC) and &#34;uplift&#34; their presentation quality to match the NVIDIA branding and messaging used with Executive meetings. This is a builder’s and presenter's role! You will spend time architecting and writing code. You will develop multi-agent systems, retrieval pipelines, and optimized inference stacks on NVIDIA’s full-stack accelerated computing platform. We want a creative, diligent, and curious engineer energized by agentic AI and ready to make significant change. If that’s you, join us! What you’ll be doing: Architect, build, and ship end-to-end Agentic AI applications for a variety of use cases—spanning multi-agent coordination, long-horizon reasoning, planning, and tool use. Act as Technical Advisor alongside fellow Subject Matter Experts (SME) in Executive Briefings. Creating and presenting demos that are used at Trade Shows or Customer Meetings. Partner with NVIDIA engineering, product, and sales teams to secure build wins, translate customer feedback into actionable product and roadmap insights, and scale global expertise through technical collateral, workshops, and developer communities. What we need to see: BS/MS/PhD in Computer Science, Electrical/Computer Engineering, Physics, Mathematics, AI/ML, or a related field (or equivalent experience) 2&#43; years as an ML/Software Engineer or Solutions Architect writing production-level code in Python and/or C/C&#43;&#43; in Linux environments. Validated experience building sophisticated agentic and multi-agent AI sy

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages. Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models. Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. End-to-End Traceability </

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Material Engineer is responsible for driving packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives. This role collaborates closely with Key Material Group (KMG) teams, manufacturing sites, quality, suppliers, and partner organizations to execute material qualification, manage material changes, and ensure laboratory, equipment, and compliance readiness. Key Responsibilities Responsibilities include, but are not limited to: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Collaborate with KMG teams and site stakeholders to develop and implement material improvements that reduce cost and improve quality and delivery performance. Execute packaging material qualification for trays, carrier tapes, formed end caps, moisture barrier bags (MBB), desiccants, and humidity indicator cards. <li

Job Details: Job Description: About the Group Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Intel Foundry will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IP's. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. Come join us and do something wonderful. The Aerospace, Defense, Government (ADG) - The Senior DFT Logic Design Engineer provides technical support to Intel Foundry Services customers on our PDKs, DFT/DFM insertion, ATPG validation methodology and flows. The successful candidate will: Collaborate with internal teams across Intel and external stakeholders such as foundry customers' design teams, IP providers, and EDA vendors on issue resolution. Create content, application notes and deliver technical training/presentations. Drive quality of ASIC DFT/DFM and ATPG validation methodology, capability/flow and documentation for block level and SOC level. Support and provide Tool/Flow/Methodology on customer issues and challenges for successful c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. P

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global Defense Line (DL) matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment for DL signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. <

About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. Position Overview We are seeking a dependable and motivated Entry-Level Injection Molding Machine Operator to join our new injection molding facility in Shelby Township, Michigan. This role is ideal for candidates with at least one year of experience in a manufacturing or production environment who are eager to grow their skills in injection molding operations. The operator will perform visual inspections of molded parts, light assembly, packaging, housekeeping duties, and support safe and efficient production processes. Key Responsibilities Machine Operation & Production - Operate injection molding machines under supervision following established procedures. - Monitor production to ensure consistent production output. - Notify supervisors of machine issues, quality concerns, or material shortages. Quality Control - Perform visual

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience or know-how in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modellin

About the Role Rubrik is seeking an innovative and strategic Services Engineering Leader to lead the lifecycle development of new Professional Services offerings. In this key leadership role, you will be responsible for creating, packaging, and launching high-value services that accelerate our customers' time-to-value for the entire Rubrik product portfolio. As a core member of the Global Professional Services Leadership Team , you will bridge the gap between product strategy and field execution. You will work extensively across Product Management, Product Engineering, Global Practice Leaders, Consulting Leadership, and PS Delivery teams to ensure our services offerings evolve in lockstep with our technology roadmap. Reports To: Vice President, Global Professional Services Key Responsibilities 1. Service Productization & Portfolio Strategy Design & Launch Offerings: Lead the end-to-end development of standardized, scalable Professional Services offerings, playbooks, and delivery methodologies that drive rapid customer adoption and time-to-value. Product & Engineering Alignment: Partner closely with Product Management and Product Engineering teams during early-stage product releases to build corresponding service packages, deployment frameworks, and best practices. Service Lifecycle Management: Continuously evaluate, refresh, and optimize the existing PS portfolio based on field feedback, customer outcomes, utilization data, and emerging market trends. 2. Strategic Leadership & Cross-Functional Collaboration PS Leadership Contribution: Serve as an active member of the Global PS Leadership Team, contributing to overall services strategy, operational strategy, and long-term business growth. Practice & Delivery Enablement: Collaborate with Global Practice Leaders and Field Delivery teams to ensure new services are operationally viable, efficiently packaged, and backed by robust delivery artifacts. Go-To-Market (GTM) Integration: Work alongside

As a Product Marketing Manager for NVIDIA NIM, you will play a pivotal role in helping enterprises deploy AI. NVIDIA NIM is revolutionizing AI from experimentation to production, packaging optimized, production-ready models for rapid deployment. Our product marketing team operates at the intersection of developer tooling and enterprise go-to-market, ensuring that our narrative resonates with ML engineers and CTOs alike. If you relish diving into technical depth and translating it into compelling stories, this is the perfect opportunity! What you will be doing: Launching products: You'll build and manage launch plans for high-visibility NIM releases, coordinating assets, timelines, keynote slides, demos, and press materials while driving cross-functional execution with product management, engineering, technical marketing, and PR or equivalent experience. You'll align the team on messaging and positioning for NIM across developer and enterprise audiences. You will develop messaging docs, sales enablement materials, customer presentations, solution overviews, and web content. Driving awareness: You'll identify target audiences and content gaps, then build the assets that fill them — blogs, webinars, demos, solution briefs, and more. Crafting the ecosystem story: You'll drive co-marketing engagements with NVIDIA's model providers, cloud partners, and ISV ecosystem to showcase the full range of possibilities with NIM. Collaborating with PR: You'll work with PR on press launches to ensure the NIM story is accurate, compelling, and consistent across every channel. What we need to see: Excellent written and verbal communication skills, with a proven track record of articulating technical value to both developer and executive audiences. College degree or equivalent experience. More t