Packaging Artwork Design Assistant Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi

Elastic, the Search AI Company, enables everyone to find the answers they need in real time, using all their data, at scale — unleashing the potential of businesses and people. The Elastic Search AI Platform, used by more than 50% of the Fortune 500, brings together the precision of search and the intelligence of AI to enable everyone to accelerate the results that matter. By taking advantage of all structured and unstructured data — securing and protecting private information more effectively — Elastic’s complete, cloud-based solutions for search, security, and observability help organizations deliver on the promise of AI. What is The Role We are seeking a Senior Program Manager, Pricing and Packaging to join the Product Finance team. This role will partner closely with the Product organization to bring new offerings to market. You'll work across functions and levels of leadership to make a real impact on how Elastic brings products to market. What You Will Be Doing As Elastic expands into increasingly complex offerings, the path from idea to launched monetized product requires heavy cross-functional coordination. You’ll be a key strategic partner to our Product organization, owning the operational end-to-end of Pricing and Packaging. Cross Functional Influence: Drive alignment across the stakeholders required to launch a pricing or packaging change, including FP&A, Revenue, Legal, IT, and Billing. Hold stakeholders accountable to timelines and decisions, translate priorities and requirements across functions, and ensure nothing falls through the cracks between product intent and commercial execution. Pricing and Packaging Knowledge: Demonstrate a proficient working knowledge of SaaS pricing models, packaging structures, and monetization levers, including consumption-based and usage-based models. Understand how decisions around tiering, bundling, metering, and discounting flow through the business from product design to revenue recognition. Process Architecture

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing We’re seeking a skilled and self-motivated Electrical Mechanical Specialist to join our golf ball manufacturing operations, where you’ll play a vital role in maintaining and optimizing complex production equipment. In this hands-on position, you’ll independently troubleshoot, repair, and rebuild electrical, electronic, hydraulic, and pneumatic systems with precision and versatility. You’ll perform preventive and predictive maintenance, rebuild and calibrate electromechanical devices, and collaborate with Engineering to design or adapt equipment for evolving production needs. Your ability to plan work efficiently, minimize downtime, and maintain accurate maintenance records will directly support operational excellence. This role also involves testing and calibrating instruments to meet performance standards, while fostering a culture of continuous improvement through effective communication with team members and leaders. What You Bring Must meet one of the following education and experience combinations: 100% completion of TPC curriculum and 3+ years of electrical maintenance experience in an industrial setting Approved technical associate degree or certificate in an electrical/electronic discipline and 3+ years of relevant experience Minimum of 7 years of industrial electrical experience in a skilled tr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. By collaborating closely with our global R&D teams, materials suppliers, and manufacturing teams, we ensure the efficient development, transfer, and implementation of new technology nodes to maintain Micron's leadership in the industry. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management. You will also be required to resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC/FDC methodology. Additional responsibilities include leading and participating in yield improvement and cost reduction activities and handling new process baseline qualifications. You may conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. We are seeking experienced engineers for Principal and MTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications. Role Responsibilities: Identify, diagnose, and resolve assembly p

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

Who We Are At Justworks, you’ll enjoy a welcoming and casual environment, great benefits, wellness program offerings, company retreats, and the ability to interact with and learn from leaders in the startup community. We work hard and care about our most prized asset - our people. We’re helping businesses get off the ground by enabling them to focus on running their business. We solve HR issues. We’re data-driven and never stop iterating. If you’d like to work in a supportive, entrepreneurial environment, are interested in building something meaningful and having fun while doing it, we’d love to hear from you. We're united by shared goals and shared motivations at Justworks. These are best summed up in our company values, which are reflected in our product and in our team. Our Values If this sounds like you, you’ll fit right in. Who You Are The mission of Justworks’ Product Marketing team is to define, articulate, and differentiate our value proposition to the right audiences—positioning our products for growth, adoption, and long-term success. As we continue evolving into a multi-solution platform, how we price and package our offerings is foundational to customer trust, perception, and long-term differentiation. We are seeking a strategic and analytically strong Senior Product Marketing Manager, Pricing & Packaging to help execute Justworks’ multi-year Pricing & Packaging (P&P) strategy. This role will report to the Head of Pricing & Packaging and will play a critical role in driving monetization initiatives, packaging evolution, and pricing experimentation across the business. Pricing & Packaging is a key growth lever at Justworks. In this role, you will help translate pricing principles into actionable recommendations, conduct rigorous analysis to inform pricing decisions, and partner cross-functionally with Product, Finance, Revenue, Strategy, and Marketing to bring pricing strategies to life. This role is ideal for a highly analytical PMM w

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

MTS Design Engineer, Bonding and Packaging — Boise, ID - Main Site. Apply via Workday.

Media & Materials Partner Manager, Labels & Packaging — All Cities, Massachusetts, United States of America. Apply via Workday.