Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement: 1 years of experience in semiconductor manufacturing, packaging, or assembly processes. Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses infor
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Job Title: Engineering Shift Supervisor Reports To: Chief Engineer Department / Function: Engineering Job Purpose / Summary • The Lead Shift Engineer is a multiskilled engineering professional responsible for leading, coordinating and supervising all engineering activities on their assigned shift within a fast paced FMCG environment. • They provide technical leadership to Shift Engineers, ensure safe and effective maintenance across all plant and packaging machinery, prioritise engineering workload, and act as the first point of escalation for technical issues during the shift. • The role drives engineering reliability, reduces downtime and ensures compliance with safety, food safety and legal requirements while role modelling engineering excellence. Other Information · The job holder is required to do all tasks considered relevant by their line manager · Responsible for Food Safety, Quality and Legality EQUAL OPPORTUNITIES: The Company strives to be an equal opportunities employer. This means that decisions concerning recruitment, promotion, dismissal or any other aspect of employment will be based on the needs of the business and not any assumptions based on sex, race, age, disability, gender reassignment, sexual orientation, married or civil partnership status, pregnancy or maternity, religion or belief. This is an important commitment which all employees are expected to share. Key Accountabilities Shift Leadership & People Responsibilities Day‑to‑day leadership of Shift Engineers, including task allocation, prioritisation and performance during the shift. Coordinate maintenance workload in real‑time based on breakdowns, production needs and planned tasks. Provide technical guidance, coaching and hands‑on support to engineers on shift. Lead shift handovers, ensuring clear communication of ongoing issues, completed work, risks and priorities. Conduct informal skills assessments and support the Engineering Manager with identifying training needs. Role model enginee
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Key Responsibilities: Process Optimization: Establish, monitor, and optimize daily assembly process parameters to ensure stable production lines. Troubleshooting & Failure Analysis: Lead the containment and root-cause analysis of manufacturing defects and process abnormalities. Yield & Quality Improvement: Implement Statistical Process Control (SPC) to reduce process variation, drive yield enhancement, and prevent quality excursions. Documentation: Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports. Cross-functional Support: Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks. 2. Role Requirement Work Experience: 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes (Fresh graduates with a strong research background in related fields are highly welcome). Work Environment: Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Attributes: Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. 3. Education Degree: Master’s degree (M.S.) is required. Engineering, Electrical Engineering, Physics, or a related STEM discipline. 4. Skills and Experience Core Technical Knowledge: Fundamental understanding of semi
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Lead and develop teams responsible for customer integration, technical engagement, and system engineering. Drive customer technical interlocks, design reviews, escalations, and integration activities. Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions. Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement. Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification. Drive resolution of complex technical issues while influencing future product and technology roadmaps. Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges. Qualifications BS/MS in Electrical Engineering, Computer Engineering, or related field. 10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification. <l
About the Team OpenAI’s Financial Engineering (FinEng) team powers how revenue flows through our products—pricing & packaging, checkout, payments, subscriptions, and the financial infrastructure behind them. We operate at the intersection of Product, Engineering, Risk, Finance, and Go-to-Market to ensure that paying for OpenAI products is seamless, reliable, scalable, and globally optimized. As OpenAI expands internationally and across product surfaces, FinEng plays a critical role in enabling durable, efficient revenue growth. About the Role As a Data Scientist for Financial Engineering, you will drive the measurement, experimentation, and optimization work that powers OpenAI’s monetization infrastructure. You will define how we measure and improve checkout, payments, subscriptions, and pricing systems globally—balancing conversion, risk, cost, reliability, and user experience. As a senior individual contributor, you will establish source-of-truth metrics, design rigorous experiments, develop analytical frameworks, and translate complex findings into decisions that directly affect revenue and international growth. This role is based in San Francisco, CA. We use a hybrid model of three days per week in the office and offer relocation support. In this role, you will Define key metrics and guardrails across checkout, payments, subscriptions, and pricing. Design experiments, staged rollouts, and offline incrementality studies. Improve conversion, payment performance, retention, and involuntary churn. Develop pricing, elasticity, FX, and localization frameworks. Partner with Data Engineering to build trusted datasets and operational monitoring. Turn complex analysis into recommendations that shape product and business decisions. Provide technical leadership and mentor other data scientists. You might thrive in this role if you have 10+ years of experience in data science, experimentation, or product analytics. Experience with monetization, payments, checkout, subscr
Senior Installation Package Development & Validation Engineer (Contract role) Focus Areas : MSI InstallShield (Windows) & Linux/Unix InstallAnywhere Automation Role Type: Contractor – 6 months Primary Focus: Installer Engineering, Packaging & Release Validation InstallShield (MSI), InstallAnywhere, VBScript / Custom Actions, Java / JDBC, Gradle (Kotlin DSL), GitHub Actions, Active Directory / gMSA, Docker Role Overview We are seeking a Senior Installation Package Specialist to own, modernize, and automate the multi-platform installer ecosystem. In this critical role, you will be responsible for end-to-end packaging engineering from developing Windows InstallShield (.msi) and Linux/Unix InstallAnywhere (.iap_xml) installer payloads to orchestrating custom build tasks in Gradle, automating database provisioning via JDBC, and ensuring seamless enterprise upgrades across thousands of mission-critical customer environments. You will collaborate closely with Core Engineering, Security, and Quality Engineering teams to eliminate installation roadblocks, enhance silent/unattended rollout capabilities, support modern enterprise security standards (gMSA, CyberArk PAM), and maintain zero-downtime upgrade integrity. Key Responsibilities Dual-Platform Installer Development & Maintenance Windows Packaging (InstallShield MSI): Maintain and enhance InstallShield project files (.ism) for flagship Windows products. Linux/Unix Packaging (InstallAnywhere): Develop and configure Revenera InstallAnywhere (.iap_xml) project files for Unix based repo installers. Custom Action Engineering: Design, write, and maintain: Windows VBScript / JScript Custom Actions: Develop Immediate and Deferred custom actions (with elevated privilege handling and rollback logic) for configuration gathering, service registration, and file manipulation. Java Custom Actions: Develop compiled Java classes for InstallAnywhere runtime execution to handle
About Atomic Industries Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. About the Role As an Automation Engineer at Atomic, you’ll build the systems that connect our physical factory to our software platform. You’ll work across sensors, electronics, industrial controls, robotics, machine interfaces, data infrastructure, and simulation to make our equipment observable, programmable, and increasingly autonomous. This is not a traditional plant controls role focused on maintaining an installed base of PLCs. You’ll help define the architecture, standards, and tools through which Atomic’s machines, molds, robots, and production workflows operate as one integrated system. This role is ideal for a software-capable automation generalist who enjoys building real hardware, commissioning it on the factory floor, and owning systems from first prototype through reliable production use. What You’ll Do Design, build, and commission a
Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by adjusting work hours and working overtime when necessary to support organizational priorities and ensure successful completion of business objectives. Preferred Qualifications & Experience: High school or GED Preferred 1 year manufacturing experience Preferred Physical & Mental Requirements: May involve prolonged periods of sitting or standing, as appropriate. May be required to reach, push, or pull to accomplish job accountabilities. Requires the use of safety glasses in designated areas.
Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl
Job Details: Job Description: The Role and Impact We are seeking a dynamic individual to lead global supply chain engineering and commercial teams in optimizing supply chain performance and fostering supplier relationships in support of Advanced Packaging Technology and Manufacturing (APTM) operations. In this role, you will drive operational excellence by integrating supplier strategies with Intel's manufacturing capabilities, collaborating closely with cross-functional teams to develop and implement strategies across global manufacturing sites. Business group Strategic Parts and Service Supply Chain (SPSC) is part of the Foundry Construction and Sourcing (FCS) team in Intel Foundry. We play a pivotal role in developing and managing supply chain solutions supporting Intel Foundry's wafer/packaging development and manufacturing operations. Key Responsibilities - Lead global supply chain teams to optimize supplier performance and operational efficiency through clear metrics, market intelligence, and continuous improvement. - Build strategic supplier partnerships to drive long-term engineering and supply chain roadmaps aligned with future technological needs. - Lead benchmarking and industry intelligence to drive supplier and technology improvements in factory equipment spares and service products. - Provide leadership through goal setting, facilitating team execution, maintaining accountability, and driving performance management practices. - Inspire and develop teams to achieve results while role modeling Intel values and creating a productive work environment. Qualifications: Minimum Qualifications - Bachelor's degree in a relevant field. - 12+ years of progressive experience with a Bachelor's degree, 10+ years of experience with an advanced degree in supply chain, engineering
Account Manager - FlexPack Description - This Account Manager role is responsible for understanding and promoting HP's FlexPack (Flexible Packaging) organization's products, using consultative selling techniques to engage with clients, and creating customized solutions. The role manages the sales pipeline, crafts competitive sales strategies, and handles challenging situations in collaboration with account managers. The role stays updated on industry trends and mentors junior team members to enhance their sales and consulting skills. Responsibilities • Demonstrates a deep understanding of the organization’s products and services while explaining product features and benefits to potential customers. • Offers technical expertise and support to the account managers in identifying potential clients, nurturing leads, and driving revenue growth. • Utilizes various sales and marketing techniques to identify and engage with potential clients and helps in tailoring sales pitches and solutions. • Creates and presents customized solutions or proposals that address the client's needs and demonstrate the alignment of the organization’s offerings with the client’s business objectives. • Maintains strong relationships with existing clients providing ongoing support, addressing client concerns, and actively seeking opportunities for upselling or cross-selling. • Develops pursuit plans and manages the sales pipeline to ensure alignment with account managers and overall sales objectives by setting clear goals and strategies for each opportunity. • Utilizes domain-specific knowledge to craft competitive sales strategies to better position the organization’s offerings in the market. • Handles challenging situations like negotiations, and client escalations to resolve issues in a professional and timely manner. • Attends industry events and
NVIDIA’s Executive Briefing Center (EBC) Solutions Architect (SA) team is looking for a highly hands-on Solutions Architect with exemplary communication skills. The role involves developing, demonstrating (in the NVIDIA EBC), and packaging agentic AI systems. Partnering with account SAs you will co-develop proof of concepts (POC) and "uplift" their presentation quality to match the NVIDIA branding and messaging used with Executive meetings. This is a builder’s and presenter's role! You will spend time architecting and writing code. You will develop multi-agent systems, retrieval pipelines, and optimized inference stacks on NVIDIA’s full-stack accelerated computing platform. We want a creative, diligent, and curious engineer energized by agentic AI and ready to make significant change. If that’s you, join us! What you’ll be doing: Architect, build, and ship end-to-end Agentic AI applications for a variety of use cases—spanning multi-agent coordination, long-horizon reasoning, planning, and tool use. Act as Technical Advisor alongside fellow Subject Matter Experts (SME) in Executive Briefings. Creating and presenting demos that are used at Trade Shows or Customer Meetings. Partner with NVIDIA engineering, product, and sales teams to secure build wins, translate customer feedback into actionable product and roadmap insights, and scale global expertise through technical collateral, workshops, and developer communities. What we need to see: BS/MS/PhD in Computer Science, Electrical/Computer Engineering, Physics, Mathematics, AI/ML, or a related field (or equivalent experience) 2+ years as an ML/Software Engineer or Solutions Architect writing production-level code in Python and/or C/C++ in Linux environments. Validated experience building sophisticated agentic and multi-agent AI sy
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