Packaging Engineer Jobs

We take play seriously. We’re looking for curious adventurers ready to find their party, fueled by imagination and drive to build what’s never been built before. At Hasbro and Wizards of the Coast, you’ll collaborate with passionate teams to reimagine our iconic brands and create experiences that spark joy, connection, and community through the magic of play. This is your chance to shape legendary play that lasts a lifetime. Purpose of Role • Drive packaging structural simplicity whereas product protection is a primary goal of packaging box. • Oversee packing processes of Hasbro’s products and fully engaged with new packaging designs or improving existing ones to appeal consumer in terms of packaging structure design, quality and cost. • Drive strategic next generation materials, engage in hands-on project-based work, and establish key material suppliers’ relationships with a sharp focus on material and process sustainability. Key responsibilities include • Review different types of packaging that commonly applied in Hasbro, design and develop packaging solutions that is safe and cost-effective. • Supports structural packaging initiatives, such as process improvements, material qualification, manufacturing and cost improvements, and sustainability. • Maintain knowledge of industry trend, development and innovation in paper & cardboard materials and printing technology. Act as a SME to educate internal engineers for right use of packaging material, tackle pa

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities: Develop and optimize flip chip attach processes including bump formation, placement, reflow, and underfill for high-performance semiconductor packages. Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps) and substrate pad finishes for robust interconnect performance. Drive package integration from die to substrate, ensuring alignment, coplanarity, and yield optimization. Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding, head-in-pillow, and interconnect defects. Collaborate with substrate vendors, OSATs, and internal teams to define design rules (pad pitch, bump pitch, keep-outs, stack-ups). Lead process development for reflow profiles, flux selection, cleaning, and underfill dispense/cure. Perform root cause analysis of assembly and reliability failures using cross- sectioning, SEM, CSAM, and other failure analysis techniques. Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling. Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure robust pa

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing. Summary: Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet). This role spans mold compound and underfill material selection and qualification, wafer level molding and encapsulation processes, underfill dispense and cure, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities: Develop and optimize wafer level molding processes including compression molding, transfer molding, and mold underfill (MUF) for fan-out and advanced heterogeneous packages. Own mold compound and underfill material selection and qualification, including evaluation of filler content, CTE, modulus, Tg, viscosity, and moisture uptake to meet thermo-mechanical and reliability requirements. Drive underfill process development including capillary underfill (CUF) dispense strategies, flow and void optimization, and cure profile development for high-density flip chip and chiplet assemblies. Evaluate and mitigate assembly risks including warpage, delamination, void formation, bleed-out, mold flash, and filler settling; define process windows and controls to ensure repeatable yield across wafer and panel formats.

We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities Own end-to-end bump interconnect development for both ubump (micro-bump) and C4 processes, including bump formation, and reflow for use with mass reflow, TCB, and LAB chip attach for high-performance semiconductor packages. Define and own bump metallurgy stacks for ubump (e.g., Cu pillar/SnAg) and C4 (e.g., SAC alloys) interconnects, including UBM selection and pad finish specifications for both chip-side and interposer capture pads. Develop and own design rules for bump interconnects including pitch, bump diameter, standoff height, keep-outs, and land pad geometry for both the chip side and interposer or substrate capture pads. Lead RDL (redistribution layer) process development including electroplating of Cu RDL traces, via fills, and pad finishes; define RDL design rules for line/space, via diameter, and layer stack-up to meet electrical and reliability requirements. Collaborate with OSATs and bumping foundries to qualify ubump and C4 bumping processes, drive design rule alignment, and manage process transfers into production. Evaluate and mi

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. As part of Packaging Design Team, you will need to think about how to make the perfect unboxing experience for users, keep the safety for transportation, out of the box, break impossibility, and be open to discussion in pursuit of perfection. We don’t just expect you to build products simply but to be proud of what we do. Are you ready to embrace challenges in a fast-paced organization? Join UI, refresh us with your crazy but creative ideas, and make a great impact on the world together! Responsibilities (What he/she will do after join UI): Accelerate design implementation to bring improved UX to market faster for MP models Maintain constant communication with the EPM and global team to follow up on projects Tracking the design status and diagnosing issues with packaging designer to create packaging solutions action Create packa

We take play seriously. We’re looking for curious adventurers ready to find their party, fueled by imagination and drive to build what’s never been built before. At Hasbro and Wizards of the Coast, you’ll collaborate with passionate teams to reimagine our iconic brands and create experiences that spark joy, connection, and community through the magic of play. This is your chance to shape legendary play that lasts a lifetime. Purpose of Role • Drive packaging structural simplicity whereas product protection is a primary goal of packaging box. • Oversee packing processes of Hasbro’s products and fully engaged with new packaging designs or improving existing ones to appeal consumer in terms of packaging structure design, quality and cost. • Deliver insights of new paper-making methods such as recycling paper, new techniques for shaping and forming paper, and new materials for use in paper-based products. • Drive strategic next generation materials, engage in hands-on project-based work, and establish key material suppliers’ relationships with a sharp focus on material and process sustainability. Key responsibilities: • Review different types of packaging that commonly applied in Hasbro, design and develop packaging solutions that is safe and cost-effective. • Develop and implement quality control procedures to ensure consistent product quality such as paper, coating, inks and adhesives. • Supports structural packaging initiatives, such as process improvements, mat

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final

What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background: Experience with integrated photonics package assemblies with multiple dies Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. Nice to Have: Experience with large device count photonic assemblies Experience with clear underfill Experience with high density fiber attach Experience with large substrate size photonic MCM assemblies Hands-on experience with PIC design

About the Role You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more. We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP. This creates both unique challenges and opportunities. The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude. What We Look For Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application. What works for 5x reticle platforms may not work for 56x reticle platforms Design or process development of complex packages Nice to Have: Experience with heterogeneous material assemblies Experience with high-TDP packages Experience with compound semiconductor assemblies Experience with co-packaged optics Ability to work with architects to co-design system architecture and package design Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc Experience with flip-chip integration, especially mass reflow, TCB & LAB Experience with large scale (>50x50mm) substrates Compensation Package:

Title: AI Application Packaging Engineer Location: Andheri (East), Mumbai Reports to: Service Director ABOUT BLENHEIM CHALCOT: As part of the Blenheim Chalcot portfolio, we benefit from the expertise, infrastructure, and scale of the leading global venture builder. With over 25 years of experience creating and growing SaaS businesses powered by Generative AI, Blenheim Chalcot has built 60+ ventures across sectors such as financial services, education, health, and marketing. Our global ecosystem—including Scale Space in London, the Rajasthan Royals in Mumbai, and a go-to-market base in Austin—enables us to access world-class talent, tools, and support to accelerate our growth and build a market-leading business. THE ROLE: We’re looking for an AI-first ITS Engineer with strong Application Packaging expertise to join our growing team at Agilisys. In this role, you’ll work across Application Packaging, Endpoint Management, Cloud Deployment, and Automation, helping modernise IT operations through AI-driven and scalable solutions. This is an opportunity to work in a fast-paced environment where automation, innovation, and operational efficiency are at the core of what we do. ABOUT YOU: Must-Have's 5+ years of hands-on experience with SCCM and/or Microsoft Intune for application packaging, deployment, and endpoint management. Strong experience with PowerShell scripting and a good understanding of Windows Registry, File System internals, and deployment workflows.

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking Manufacturing Engineers to develop and launch the Vehicle Assembly processes for our autonomous defense vehicles. You will own the processes, stations, and tooling for an assigned area of the assembly line. You'll take that area from late-stage prototype builds to full-rate production at Mach's Forge factories, with high first-pass yield at target cycle times. You will own launch readiness for your area. Your stations, tooling, work instructions, parts, and equipment must be ready for each build. You'll work directly with Design Engineering, Supply Chain, Packaging Engineering, Material Flow, and Automation and Equipment Engineering to close gaps before they affect production. You'll also work closely with the Lead Manufacturing

Senior Installation Package Development & Validation Engineer (Contract role) Focus Areas : MSI InstallShield (Windows) & Linux/Unix InstallAnywhere Automation Role Type: Contractor – 6 months Primary Focus: Installer Engineering, Packaging & Release Validation InstallShield (MSI), InstallAnywhere, VBScript / Custom Actions, Java / JDBC, Gradle (Kotlin DSL), GitHub Actions, Active Directory / gMSA, Docker Role Overview We are seeking a Senior Installation Package Specialist to own, modernize, and automate the multi-platform installer ecosystem. In this critical role, you will be responsible for end-to-end packaging engineering from developing Windows InstallShield (.msi) and Linux/Unix InstallAnywhere (.iap_xml) installer payloads to orchestrating custom build tasks in Gradle, automating database provisioning via JDBC, and ensuring seamless enterprise upgrades across thousands of mission-critical customer environments. You will collaborate closely with Core Engineering, Security, and Quality Engineering teams to eliminate installation roadblocks, enhance silent/unattended rollout capabilities, support modern enterprise security standards (gMSA, CyberArk PAM), and maintain zero-downtime upgrade integrity. Key Responsibilities Dual-Platform Installer Development & Maintenance Windows Packaging (InstallShield MSI): Maintain and enhance InstallShield project files (.ism) for flagship Windows products. Linux/Unix Packaging (InstallAnywhere): &nbsp

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and s

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. Position Summary: The Senior Manager, Finance serves as the Finance lead for Global Logistics & Distribution, Global Trade & Compliance, Packaging Engineering, cost-to-deliver financial management, and regional supply chain operations. This role establishes financial objectives, forecast methodologies, and savings tracking mechanisms across freight, duties, tariffs, logistics costs, trade compliance initiatives, and supply chain transformation programs. The position partners with Supply Chain, Logistics, Trade Compliance, Accounting, Operations, and Finance leadership to translate operational drivers into financial outcomes, improve gross ma

We’re here for one reason and one reason only – to cure cancer. Every moment is dedicated to developing treatments and every action moves us one step closer to our goal. We’ve made incredible scientific breakthroughs and our pioneering personalized CAR T-cell therapies have changed the paradigm. But we're not finished yet. Join Kite, as we make even bigger advances in cancer therapies, and help shape where our business and medical science goes next. We believe every employee deserves a great leader. People Leaders are the cornerstone to the employee experience at Gilead and Kite. As a people leader now or in the future, you are the key driver in evolving our culture and creating an environment where every employee feels included, developed and empowered to fulfil their aspirations. Join Kite and help create more tomorrows. Job Description Key Responsibilities Manage commercial pharmaceutical labeling projects from initiation through implementation. Coordinate labeling activities across Regulatory Affairs, Quality Assurance, Supply Chain, Manufacturing, Packaging Engineering, and external vendors. </sp