Packaging Value Engineer Jobs

Internship Packaging — Drachten. Apply via Workday.

Substrate Packaging Defect Metro Tool Owner — Arizona, Phoenix. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s growth depends heavily on the Global Procurement team, which delivers powerful cost management and supply chain resiliency. We apply pioneering predictive capabilities and risk assessment with a strong focus on sustainability and diversity. Our business goals align with the importance we place on our team members – our greatest asset. We invest in people through a skill-based learning and development model to establish clear career paths. We also promote an engaging and inclusive culture by building camaraderie and recognizing diverse perspectives among all our distributed team members. Join us to discover why Micron’s Global Procurement team is the preferred place to advance your talent! Serving as Senior Category Supplier Manager for Advanced Packaging Material at Micron, you will gain a remarkable chance to lead a major strategic supplier or group of suppliers. You will contribute to Micron’s outstanding data retention and data management offerings. Your role includes collaborating with colleagues from multiple categories to maintain outstanding supplier support for goods and services. You will also partner internally to define and track crucial performance metrics. Your expertise will play a key role in directing supplier approaches to optimize cost, supply, and quality. Responsibilities Global Category Strategy & Market Leadership: Own and establish global category strategies for Advanced Packaging Material to foster innovation in solutions for HBM and wafer-level packaging technology. L

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Global Procurement team and help shape the future of Advanced Packaging technology. In this role, you will drive global sourcing and procurement strategy for process equipment capital supporting Technology Development (TD), with a focus on cost leadership, supplier strategy, and technology enablement. Through strong partnerships with internal stakeholders and strategic suppliers, you will accelerate innovation and readiness for next-generation packaging solutions. As part of an inclusive, high-performing team, you will leverage your expertise to support Micron’s relentless pursuit of innovation for customers and partners, including enabling Generative AI and Agentic AI-driven solutions that power future Advanced Packaging technologies. At Micron, you will contribute to a culture built on integrity, sustainability, collaboration, and community impact while helping drive the breakthroughs that fuel the next era of innovation About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G

About the Team DoorDash Labs, established in 2018, serves as the innovation hub for DoorDash, focusing on developing automation and robotics solutions to enhance last-mile logistics. The team's mission is to create technologies that support and augment human networks, aiming to improve efficiency for Dashers, merchants, and consumers alike. We’re ruthlessly focused on business impact. We are a highly senior team composed of former pioneers from a variety of different robotics industries. As of 2025, DoorDash has completed 10B lifetime deliveries. We’re focused on how to do the next 10B even better About the Role As a Hardware Engineer, Electronics Packaging & Vehicle Integration, you will lead the mechanical architecture, design, and delivery of electromechanical systems for DoorDash’s next-generation autonomous delivery vehicle. You will develop robust packaging solutions for compute, electrical, communications, and sensor-related hardware that operate reliably in demanding real-world fleet environments. This role sits at the intersection of mechanical engineering, vehicle integration, and product reliability. You will partner closely with electrical engineering, PCB design, industrial design, systems engineering, manufacturing, supplier partners, reliability, and operations teams to turn system requirements into durable, manufacturable, serviceable, and cost-effective product designs. You will own designs from concept through launch, including electronic enclosures, housings, mounting systems, seals, connector interfaces, and vehicle-level integration features. Success in this role requires strong mechanical design judgment, practical experience with production processes, and the ability to resolve cross-functional packaging tradeoffs. Responsibilities: Own the mechanical design and release of electronic packaging, housings, enclosures, and vehicle integration solutions in support of program timing and product launch. Design components

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Director - Foundry Advanced Packaging Business Development — US, California, Santa Clara. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. Job Responsibilities: Perform linear and non-linear static analysis for package and material behavior Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages Develop multiphysics models (thermo-mechanical, therm

This position is responsible for supervising Nivagen label control and packaging area. Works in SAP system and Quality system to perform inspection testing of incoming labelling and packaging components. Supervising the packaging team to provide oversight of Packaging and making sure that AQL’s support finished product release. The position is a liaison with the warehouse, customer service and manufacturing for incoming goods both finished product and incoming components. The position is responsible for implementing Nivagen inspection and testing quality standards for labelling and incoming packaging components, while leading the packaging QA team to meet Nivagen timelines. ESSENTIAL DUTIES AND RESPONSIBILITIES Manage the Label Control Program ensuring that finished product is appropriately labeled to the correct versions and timelines. This includes management of specifications, inspections, and release of labelling in SAP. Manage the Packaging Component Specification program by obtaining documentation for components that have product contact from project managers, engineers, or purchasing. Prepare or review change controls to introduce product/components into Nivagen Quality System. Develop quality inspection criteria for finished products to include label review, temperature requirements, and destructive testing for quality attributes, if applicable. Create documentation for Quality inspection of each packaging component against supplier drawings, supporting documentation and physical testing. Work with Engineer and Operations for component acceptability testing on the line in conjunction of writing component specifications for approval. Sample and inspect incoming drug products and/or components against quality standards. Record and review documentation for accuracy and completeness. Maintain the initial and final documentation in the electronic management system. Disposition of product/component after quality review of inspection criteria Set up metadata in SAP

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 1. Global Category Strategy & Market Leadership - Own and define global category strategies for Advanced Packaging Material to drive innovation in solutions for HBM and wafer-level packaging technology. - Lead market intelligence, including: Supplier landscape & capability mapping, Technology roadmaps & inflection points, Pricing models and long ‑ term cost curves. - Shape dual ‑ source / alternate ‑ source strategies and supply base optimization to mitigate concentration and continuity risks. 2. Executive ‑ Level Supplier Relationship Management - Act as Micron’s primary commercial lead for strategic material suppliers, executive reviews, and escalation governance with supplier executives. - Drive alignment on Capacity commitments, Technology enablement and Long ‑ term partnership frameworks. 3. Commercial Negotiation & Contracting - Lead sourcing events/RFQ process into bundled negotiation - Lead negotiations for contract extensions and renewals, renegotiation of prices, transfers, etc - Apply should ‑ cost, total cost of ownership (TCO), and global benchmarking models to negotiations. - Own strategy, governance, and renegotiations as market or capacity conditions shift. 4. Cost,

Title: AI Application Packaging Engineer Location: Andheri (East), Mumbai Reports to: Service Director ABOUT BLENHEIM CHALCOT: As part of the Blenheim Chalcot portfolio, we benefit from the expertise, infrastructure, and scale of the leading global venture builder. With over 25 years of experience creating and growing SaaS businesses powered by Generative AI, Blenheim Chalcot has built 60+ ventures across sectors such as financial services, education, health, and marketing. Our global ecosystem—including Scale Space in London, the Rajasthan Royals in Mumbai, and a go-to-market base in Austin—enables us to access world-class talent, tools, and support to accelerate our growth and build a market-leading business. THE ROLE: We’re looking for an AI-first ITS Engineer with strong Application Packaging expertise to join our growing team at Agilisys. In this role, you’ll work across Application Packaging, Endpoint Management, Cloud Deployment, and Automation, helping modernise IT operations through AI-driven and scalable solutions. This is an opportunity to work in a fast-paced environment where automation, innovation, and operational efficiency are at the core of what we do. ABOUT YOU: Must-Have's 5+ years of hands-on experience with SCCM and/or Microsoft Intune for application packaging, deployment, and endpoint management. Strong experience with PowerShell scripting and a good understanding of Windows Registry, File System internals, and deployment workflows. Experience managing application packaging, deployment, patching, and remediation processes in enterprise environments. Exposure to vulnerability management and patch lifecycle activities using tools such as WSUS, Active Directory, or endpoint security solutions. An AI-first mindset with interest or experience leveraging Generative AI tools to improve efficiency across packaging, testing, deployment, troubleshooting, and operational tasks. Hands-on experience using automation or AI-assisted tools

Category Supplier Manager – Adv Packaging TD Capital Equipment — Boise, ID - Main Site. Apply via Workday.

Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.

Package Architect – Advanced Packaging & System Exploration — 2 Locations. Apply via Workday.