Photolithography Scanner Duv Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Track & Trim Equipment Development Engineering team, driving innovation at the heart of advanced semiconductor manufacturing. We partner across process, integration, and manufacturing teams to bring next-generation lithography capabilities—including EUV—to life. If you enjoy solving complex technical challenges and crafting the future of high-volume manufacturing, you’ll feel right at home here! In this role, you will serve as a technical leader and recognized authority on photolithography Track and Trim systems. You’ll lead critical programs, influence process strategy, and ensure equipment performance at advanced nodes. Your work will directly impact yield, cost, and scalability throughout international fabrication facilities, making this a highly visible and rewarding opportunity. Responsibilities: Serve as SME for Track & Trim systems; define process strategy and resolve complex equipment and process issues Lead equipment lifecycle programs including selection, installation, qualification, and deployment for advanced nodes including EUV Improve tool uptime, reliability, and performance to meet yield and cost targets in high-volume manufacturing Drive safety and operational perfection by embedding safe practices (PPE, LOTO, chemical safety) into equipment and processes Partner with multi-functional teams and vendors to develop, optimize, and scale solutions across global fabs Minimum Qualifications: B

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and responsibilities Ensure a safety-first culture for all program and project solutions. Support network Track installation to meet TIQ (Tool Installation Qualification) goals. Close collaboration with network Photolithography Track suppliers (TEL, alternate suppliers, etc) and internal stakeholders (HVM fabs, Central Teams, Technology Development teams). Drive network Track defect reduction and Machine Matching Management (MMM) to achieve industry best-in-class performance in Track productivity (Wafers Per Day) and Process matching through best practices establishment, problem solving techniques and analytical up skill. Lead Track Technical Authority (TTA) with Track Subject Matter Experts (SMEs) to govern network Track areas of focus (E.g. Future tool configurations, Hardware, Recipe, Defectivity). Drive and facilitate governance meetings and cross-collaboration projects with internal and external stakeholders to achieve Micron Strategic Initiatives (E.g. Cost, Yield, Quality, Maxout, Environmental Sustainability). Demonstrate strong communication and reporting skills to provide regular Executive updates on project progress, challenges, and escalation for resource support. Demonstrate ownership and accountability in delivering results. Coach network Track leaders and groom future Track generation leadership. Proactively identify bottlenecks, drive improvements, and share best practices across HVM fabs. <b

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop and optimize photolithography processes for new products and technologies Monitor and control production processes using statistical methods Analyze data to identify root causes and implement yield improvement actions Adjust equipment parameters and troubleshoot technical issues Collaborate with cross-functional teams and global partners 新製品・新技術に対応するフォトリソグラフィ工程の開発・最適化 統計的手法を用いた量産プロセスの監視・管理 データ解析による不良要因の特定と歩留まり改善策の実施 装置パラメータの調整および技術的トラブルの解決 他工程やグローバルチームとの協働によるプロセス統合 Preferred Qualifications Basic understanding of photolithography or semiconductor manufacturing Interest in learning process control methods such as SPC or DOE Comfortable working with data analysis or using tools like Excel Strong team spirit and motivation to solve problems collaboratively Openness to talking, reading technical documents or emails in English 歓迎条件 フォトリソグラフィ工程や半導体製造に関する基本的な知識 SPCやDOEなどの工程管理手法に興味がある方 データ解析やExcelを使った業務に抵抗がない方 チームで協力しながら課題解決に取り組む意欲がある方 英語での会話、メールや技術文書の読解に挑戦したい方 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Ever

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are accelerating the transformation of information into intelligence through industry-leading memory and storage solutions. The 3D DRAM Photolithography team develops advanced patterning technologies that enable future memory scaling and support next-generation products powering AI, cloud computing, and data-intensive applications. Our work combines innovative research, semiconductor process development, and high-volume manufacturing innovation. As a 3D DRAM Photolithography Process Development Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within the 3D DRAM Photo team. Under the mentorship of experienced engineers, you will collaborate across process and equipment subject areas to solve complex manufacturing challenges and develop innovative solutions that meet demanding product requirements. The internship culminates in a presentation of project results to technical and leadership teams. Responsibilities Develop and optimize photolithography processes that meet product requirements for physical and electrical performance. Partner with multi-functional process and equipment teams to find opportunities for process improvements and technology advancement. Conduct root-cause and failure-mode analyses to identify process limitations and implement corrective actions. Perform statistical analysis of pilot manufacturing and technology development data to support process optimization and decision-making

Job Details: Job Description: This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As IMO module Engineer the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. Develops strategies to resolve difficult problems and establishes systems to manage these problems in the future. An ideal candidate should exhibit the below behavioral traits: Experience with rapid analysis of complex process issues and identification of a solution path Willing to work Independently with minimal direction, to be self-directing and show initiative Communication skills and demonstrated ability to summarize complex d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer, Photo EUV Technology, you will be responsible for EUV process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with other Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors. Key Responsibilities Develop and optimize EUV process modules to meet the stringent requirements of advanced memory devices. Perform advanced process development tasks, including material evaluations, reticle and layout design, OPC development, process window analysis, and overlay optimization. Lead the successful introduction of new technologies to manufacturing, focusing on yield improvement, cycle time reduction, and tool expansion. Collaborate closely with R&D and high-volume manufacturing (HVM) partners in globally diverse locations to ensure seamless integration and flawless execution. Partner with DRAM Development site leaders to align development strategies, deliverables, and provide on-site support for various technology projects. Work alongside Micron’s Manufacturing and Central teams to implement outstanding methods for manufacturability. Qualifications Proven experience in EUV process development and photolithography. Outstanding problem-solving skills and the ability to successfu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: You must be enrolled in an AAS/Certificate Program in Mechatronics, Robotics, Engineering Technology, or related field of study program! Micron Technology Virginia is looking for enthusiastic interns to join our state-of-the-art research and development fabrication facility. As one of the most advanced fabs globally, we specialize in various process areas including Wet Etch, Dry Etch, Diffusion, Photolithography, Metrology, RDA, PCVD, CMP, Implantation, and Probe. As a Fab Equipment Maintenance Technician Intern, you will gain a basic knowledge of the semiconductor fabrication process. Interns will be exposed to new technology and the equipment we use in the clean room environment to manufacture the world’s leading memory solutions! Interns receive on-the-job training that includes safety and cleanroom protocol, preventative and corrective maintena

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron’s MaskTech department is responsible for reticle data preparation and mask-related technologies that enable advanced semiconductor manufacturing. The team partners closely with Design, Process Integration, Mask Development, Scribe, Lithography, Tapeout Operations, Mask Shops, and Manufacturing Fabs to ensure successful tapeout execution and high-quality wafer patterning. As an Optical Proximity Correction (OPC) Engineer, you will process reticle design data through OPC to ensure designs are accurately transferred to silicon during photolithography. You will also develop and improve processes, automated verification methods, and systems that support tapeout operations while collaborating with global teams across the United States, Japan, and India to drive operational excellence and continuous improvement. Responsibilities Drive OPC job deck development, process flow execution, and recipe optimization to support production and R&D tapeouts. Collaborate with teams from multiple functions to develop new OPC flows, implement best-known methods (BKMs), and resolve manufacturing challenges. Analyze and troubleshoot OPC process issues, maintaining high-quality work to support a stable production environment. Develop automation, scripts, and process improvement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross‑fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5&#43; years (Senior) or 8&#43; years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a technical point of contact for blocking issues and lead problem solving involving multiple functions Strong data-driven approach and communication skills; comfortable working with

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives Resolve complex photo/overlay metrology issues through data ‑ driven root ‑ cause analysis Define and deploy photo/overlay metrology Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex photo/overlay metrology customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5&#43; years (Senior) or 8&#43; years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Lead HVM photo yield, quality, productivity, and cost improvement initiatives Resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching) through data ‑ driven root ‑ cause analysis Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI Act as the technical point for cross-fab, complex lithography customer concerns Drive MOR–POR gap closure and cross ‑ fab/node alignment in collaboration with internal teams and suppliers Influence key suppliers and represent OCT Photo in reviews, workshops, and governance forums Job Requirement and Qualifications: BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field 5&#43; years (Senior) or 8&#43; years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing Strong hands-on experience in photo process engineering (yield, quality, productivity, cost improvement) Proven experience in solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs Ability to act as a t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Welcome to Micron’s Advanced Mask Development Group! We are a group of engineers who provide advanced technology solution of Optical Proximity Correction (OPC) and Resolution Enhancement Techniques (RET) to support wafer process development. Through the rigorous simulation and data analysis, we develop the optimization strategy and methodology in reticle design to support all Micron products, using various tools, scripts and programming to improve process window of semiconductor process on wafers. You will have the opportunity to participate and to collaborate in a group project, together with an experienced RET engineer, to work on the intersection of AI agents and advanced OPC / RET techniques to help automate part of the RET development flow. Responsibilities: Study and comprehend photolithography modeling theory and simulation methodology. Build AI work flow and programs for RET/OPC tasks. Improve beyond the existing metrics achieved by the Process-Of-Record. Build a document of Best Known Method based from your learning, and to detail the thought process and the supporting data. Work on a hands-on and collaborative project with the Photolithography group in Technology Development. Build automated scripts and/or program to improve the efficiency of the current methodology. Identify potential opportunities of improvement, including areas which can be challenging to achieve during the internship period. </l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Albany Photo Lithography Director — Albany, NY. Apply via Workday.