Secure Every Identity, from AI to Human Identity is the key to unlocking the potential of AI. Okta secures AI by building the trusted, neutral infrastructure that enables organizations to safely embrace this new era. This work requires a relentless drive to solve complex challenges with real-world stakes. We are looking for builders and owners who operate with speed and urgency and execute with excellence. This is an opportunity to do career-defining work. We're all in on this mission. If you are too, let's talk. The Global Pricing Operations Team The Pricing Operations team works in a cross-functional, fast-paced, and dynamic environment with many moving pieces and evolving business needs. The team partners with Pricing Strategy Managers, Product Managers, Technology, Data & Intelligence, and various GTM teams to ensure Okta is operationally ready to bring new product pricing, buying programs, and strategic monetization initiatives to market. The Pricing Operations Principal Opportunity Okta is seeking a Pricing Operations Principal to lead initiatives that transform Okta's pricing strategy into successful go-to-market execution. A successful person in this role will be a strong collaborator, intensely curious, and supremely organized. They are known for connecting the dots, simplifying complexities, communicating clearly and proactively, and driving highly collaborative efforts to completion, even when the path forward isn't perfectly defined. In this role, you will serve as an operational leader for new pricing launches and a strategic buying-program implementation, establishing the integrated roadmap, operating cadence, decision-making framework, readiness criteria, and stakeholder communications required to bring these initiatives from concept through launch and sustained adoption. You will partner closely with senior cross-functional leaders to make complex tradeoffs, resolve dependencies, and ensure the business is ready to sell, quote,
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ROLE Lead first-silicon bring-up, characterization, debug, and validation of advanced 3D NAND products. Establish whether silicon meets design intent and datasheet requirements, correlate simulation with measurements, and resolve issues that could affect product qualification, reliability, yield, or SSD/system integration. This role provides a unique opportunity to develop end-to-end expertise across advanced NAND products, spanning circuit design concepts, mixed-signal simulations, first-silicon bring-up, silicon debug, product qualification, and manufacturing readiness. Engineers gain broad exposure to analog, mixed-signal, digital, firmware, memory-array, and system-level behavior while working closely with design, verification, firmware, product, and system teams. RESPONSIBILITIES • Own validation strategies, coverage, and test plans for assigned NAND circuits and functions; define expected behavior, operating corners, and pass/fail criteria from product specifications and design intent. • Lead first-silicon bring-up, characterization, debug, and simulation-to-silicon correlation across voltage, temperature, process, timing, and workload conditions. • Characterize and debug NAND subsystems including reference and bias generation circuits, bandgap references, oscillators, voltage regulators, charge pumps, sensing and page-buffer paths, high-voltage program/er
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. Join a dynamic team today! This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Pr
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. Having understanding of Frontend Process is a plus, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, Si characterization, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC t
Bridge strategy and execution in Wealth—deliver platforms that advisors, investors, and operations can trust. We’re seeking a Technical Delivery Lead with Wealth domain expertise—spanning product manufacturing, investment operations/back office, distribution, and front-office/advisor platforms. You will partner closely with CIOs, CTOs, and senior business leaders, acting as a trusted advisor to shape technology strategy, architecture decisions, and transformation roadmaps. You’ll connect business strategy to complex technology landscapes, applying leading practices to deliver scalable, future-ready solutions that drive cost efficiency, performance, and growth across the end-to-end Wealth Management value chain—including Product Manufacturing, Investment Operations, Distribution & Client Management, and Front Office/Advisor Experience. What You'll Do! Lead end-to-end technology delivery across the Wealth value chain, aligning execution with enterprise strategy and executive priorities Advise CIO/CTO stakeholders on leading practices, including platform modernization, operating model design, and build vs. buy decisions Provide technology leadership across Manufacturing, Back Office, Distribution, and Front Office domains Shape target-state architecture using domain-driven design, microservices, event-driven architecture, and API-led ecosystems Translate executive strategy into delivery plans including roadmaps, OKRs, budgets, and vendor governance Drive measurable outcomes such as improved STP, reduced latency, optimized cost-to-serve, and enhanced client/advisor experience Elevate engineering maturity by establishing best practices, standards, and delivery playbooks What We're Looking For At least 15 years of proven consulting and delivery leadership in Wealth and Asset Management across multiple domains Experience engaging CIO/CTO/COO stakeholders and influencing strategic decision-making Strong technical fluency across Digital Engineering, Cloud (AWS/Azure), AP
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is the fastest growing semiconductor company in India offering a wide & attractive range of career opportunities. One of the rapidly growing functions within Micron India is the Micron SDV (Silicon Design Validation) team in Hyderabad and the team is looking to hire for the position of NAND Silicon Design Validation Product where you will be responsible in the development, validation, characterization, and qualification of new state-of-the-art NAND Flash memory products. There is a tremendous scope for individual learning and career growth in this role. In addition to the SDV responsibilities, you will also work multi-functionally with NAND R&D, Design, and other various engineering teams towards new product startup , define, validate & deliver product specifications and requirements. Also, Product Engineers are the key product-specific point of contact with high visibility for critical issues and act as the main interface between Research and Development, Manufacturing, Business Units, and Quality Assurance departments. Responsibilities include, but not limited to: Leading validation projects from start to finish - bringing up overall coverage plan during post-silicon phase, planning development timeline, planning and implementing test development before silicon availability, taking
HR Manager / Principal HR Business Partner, Hiroshima — Hiroshima - Fab 15, Japan. Apply via Workday.
Dry Etch MDE Principal Lead Engineer — Boise, ID - Main Site. Apply via Workday.
DMTS/ Sr.Principal Product Manager, HBM — 3 Locations. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Develop and standardize EMIR methodology that applies consistently across all DRAM products, ensuring alignment, repeatability, and high-quality analysis outcomes Perform static and dynamic EM/IR and PDN analysis using RedHawk or Totem or other industry‑standard tools; identify root‑cause issues such as high‑resistance segments, insufficient via density, and decap deficiencies, and provide clear, actionable recommendations to design and layout teams. Actively leverage AI‑based tools, agentic workflows, and automation frameworks for effective Power-delivery-network (PDN) analysis. Maintain a strong understanding of the full EMIR flow—from netlist preparation, extraction, simulation, and debug to reporting and silicon correlation—and ensure accurate evaluation across operating modes and temperatures. Partner across design, timing, physical implementation, architecture, modeling, and verification teams to understand real switching behavior, develop worst‑case vectors, and standardize analysis expectations across global teams. Collaborate with cross-geographical teams and also EDA tool vendors to evaluate and improve EMIR methodologies, and document Best Known Methods (BKMs) to enhance consistency and correlation across DRAM teams. Develop and maintain dashboards to track EMIR results, monitor trends, and support signoff progression for multiple designs. Qualifications: Master’s degree i
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop system-level solutions, tools, and methodologies to optimize DRAM performance, power efficiency, and cost. Collaborate with multi-functional teams to ideate, evaluate, and implement innovative DRAM and memory system solutions. Analyze system behavior and assess solution effectiveness, making data-driven optimizations and trade-offs. Drive architectural innovation for current and future generations of DRAM technologies. Communicate complex technical concepts clearly and mentor team members through training and technical guidance. Using AI in applicable job functions Minimum Qualifications: Proven experience in memory design and product engineering, memory specifications and operations, or memory system architecture and usage. Minimum of 7 years of experience in the memory or semiconductor industry. Strong understanding of DRAM architectures and system-level interactions. Ability to analyze complex technical problems and drive solutions. Bachelor’s degree in Electrical Engineering, Physics, Computer Engineering, or a related field, or equivalent experience. Preferred Qualifications: Experience with advanced memory technologies such as LPDDR5/6, DDR5/6, GDDR6/7, or HBM3E/4. Strong analytical and problem-solving skills with a passion for innovation. Ability to identify complex technical challenges and develop creative, scalable solutions. Deep under
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne
The Role We are seeking a highly skilled and hands-on SoC Floorplan Lead to own the physical foundation of our next-generation AI and Data Center SoCs. In this critical role, you will be the bridge between architecture, logic design, and physical design. You will work hand-in-hand with Chip Architects and RTL Leads to influence micro-architecture and ensure the physical implementation achieves best-in-class Power, Performance, and Area (PPA). If you love solving complex spatial puzzles on advanced technology nodes, integrating sensitive analog components, and driving execution in a high-energy start-up environment, this is the role for you. Key Responsibilities Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below). Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA. Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery. Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions. Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop. Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion. Methodology Development: Build and maintain scalable Floorplanning workflows and
AI Strategy & Transformation – Managing Principal Location: London (Hybrid) | Practice Area: Data & Analytics | Type: Permanent Shape the Future of AI Strategy for the World's Leading Financial Institutions The Role We're looking for an experienced Managing Principal to join Capco's AI Strategy & Transformation practice. In this senior leadership role, you'll partner with C-suite executives across leading financial institutions to define AI strategies, shape enterprise transformation agendas and deliver measurable business value through responsible AI adoption. You'll combine strategic advisory expertise, commercial leadership and transformation delivery to help clients scale AI capabilities, establish effective operating models and realize long-term value from AI investments. Alongside leading major client engagements, you'll play a key role in growing Capco's AI Strategy & Advisory capability, developing our people and expanding our market presence. What You'll Do Lead enterprise AI strategy engagements, defining transformation roadmaps, operating models, governance frameworks and investment priorities. Advise senior executives on AI adoption, business transformation, Responsible AI and value realization across complex Financial Services organizations. Lead large-scale AI transformation programmes while building trusted client relationships and delivering measurable commercial outcomes. Drive business growth by shaping new client opportunities, developing propositions and contributing to AI thought leadership. Coach and develop consulting teams while strengthening Capco's AI Strategy & Advisory capability across the business. What We're Looking For Extensive consulting or advisory experience delivering AI, digital or enterprise transformation within Financial Services. Proven experience advising C-suite stakeholders and leading complex strategic transformation programmes from strategy through implementation. Strong expertise in AI strategy, gov
Scale AI's Advisory practice is the most forward-leaning bet in our go-to-market motion. We're not waiting for clients to hand us a scope — we get in front of the decision, shape the right AI problems before a build begins, and make Scale the obvious partner for what comes next. Advisory is the structured answer to the question enterprises are already asking us: "What should we build, and where do we start?" It's a discovery and scoping phase that runs before delivery — designed to land bigger contracts, drive more predictable execution, and accelerate expansion. By 2027, it will be Scale's default first engagement with new enterprise clients. As an AI Advisory Principal, you lead Scale's Advisory work in your vertical, end-to-end. In pre-sales, you shape and qualify opportunities alongside Account Executives and sell the Advisory phase to clients. In delivery, you're the Directly Responsible Individual on engagements — owning the client relationship, running the discovery and scoping work, and accountable for the outcome. Underpinning both, you build out the vertical point of view — the industry and AI expertise that makes Advisory credible — and, as one of the function's first hires, help build the Advisory motion itself. This is a hands-on role: you do the advisory work, not just manage it. What You'll Own You own the engagement and the vertical — from the first pre-sales conversation through the final readout. Lead engagements end-to-end. You're the Directly Responsible Individual on engagements — owning the client relationship, running workshops, leading the final readout, driving the direction, and accountable for the outcome (use-case selection, SOW quality, delivery). You coordinate and direct the Solutions Engineers, Designers, Tech Leads, and DSGs on the engagement without managing them directly. Sell Advisory in your vertical. You build the approach, lead the Advisory portion of key pre-sales meetings, bring industry roadmap examples from buyer peers, and
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