Probe Equipment Shift Engineer Jobs

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Engineer for a senior individual-contributor role leading printed circuit board assembly (PCBA) test fixtures and infrastructure for advanced robotic systems. You will independently turn evolving requirements into working fixtures, make technical tradeoffs, and own delivery from concept and detailed design through fabrication, validation, deployment, and reliable operation. This role combines development-lab work with deployment at contract manufacturers. You will build precision mechanical systems for board programming, functional test, and characterization, including board nests, probe plates, connector interfaces, alignment features, clamps, enclosures, and thermal interfaces. You will partner with electrical, firmware, software, manufacturing, and reliability teams to make fixtures repeatable, protective of delicate assemblies, and maintainable as board designs evolve. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. Travel to contract-manufacturer sites is part of the role, with timing based on build and deployment needs. In this role, you will: Own the mechanical architecture of PCBA test stations, including frames, board nests, datum schemes, access, guarding, ergonomics, and serviceability. Design probe and bed-of-nails fixtures, connector-mating mechanisms, board supports, clamps, and interchangeable tooling for programming, functional test, and characterization. Use first-principles analysis and simulation to assess stiffness, probe and insertion forces, board def

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Boise Expansion Team is helping build the future of semiconductor manufacturing as Micron expands its leading-edge memory production in Boise, Idaho. We are a collaborative organization focused on innovation, operational excellence, and continuous improvement. Join a team where your work will directly influence product quality, manufacturing performance, and the next generation of technology. As a Yield Analysis Engineer, you will play a key role in improving fab yield through advanced data analysis, defect characterization, and root cause investigation. You will work closely with Process Integration, Process Engineering, and Failure Analysis teams to identify yield limiters, drive corrective actions, and deliver sustainable yield improvements. This role offers the opportunity to combine semiconductor expertise, analytics, and AI-enabled tools to solve complex manufacturing challenges. Responsibilities: Monitor probe yields and trends to identify yield excursions, characterize yield loss, and explain gaps between target and actual performance Perform advanced data analysis and develop yield paretos to prioritize issues and guide factory yield-improvement efforts Apply statistical methods and data-mining techniques to identify root causes and uncover opportunities for process improvement Partner with Failure Analysis, Process Integration, and Process Engineering teams to correlate electrical, physical, and manufacturing data and drive issue resolution Develo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the groundbreaking of memory innovation, partnering across design, integration, modeling, and characterization to define the next generation of memory solutions. We thrive on solving sophisticated technical challenges and turning breakthrough concepts into scalable technologies that shape Micron’s future. As a Pathfinding Device Integration Engineer, you will help drive early-stage technology development by connecting device physics, materials science, and process integration. In this role, you will evaluate emerging device concepts, develop experimental strategies, and generate data-driven insights that influence future technology decisions. Your work will play a key role in advancing device scaling, performance, and manufacturability across Micron’s long-term roadmap. Responsibilities: Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements Lead process integration efforts by aligning materials and process flows into actionable technology solutions Design and implement experiments in the R&D fab to optimize device performance and manufacturability Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities Collaborate with modeling, characterization, reliability, and device teams to as

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities of your team will include, but are not limited to: 1. Contributing to the development of new DRAM, emerging memory products and IP’s by enabling the overall design, layout, and optimization of Memory/Logic/Analog circuits 2. Supporting design validation & verification, reticle experiments and required tape-out revisions 3. Performing verification processes with modeling and simulation using industry standard simulators 4. Contributing to cross group communication to work towards standardization and group success 5. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of product 6. Proactively solicit inputs from Standards, CAD, modeling, Technology Development groups to ensure the design quality and reliability 7. Driving innovation into the future Memory generations within a dynamic work environ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Design Engineer in the NVE Design Engineering Core group at Micron Technology, Inc., you will contribute to the development of memory products that are best-in-class, using your specialized knowledge and Micron proprietary methods of designing and analyzing core and mixed circuits used in the development of memory products! What’s Encouraged Daily: Design, simulate, optimize, and floor‑plan NAND circuit blocks. Evaluate design feasibility and analyze circuit functionality across use cases. Implement analog and mixed‑signal circuit designs that meet performance and reliability specifications. Validate design performance at block‑ and chip‑level using industry‑standard simulation tools. Collaborate with multi-functional teams to analyze and reduce NAND power consumption. Build and maintain Python‑based AI utilities that collaborate with EDA tools to accelerate development workflows (e.g., environment setup, corner execution, regressions, automated documentation, predictive build/layout). Review existing user documentation and generate new build collateral. Collaborate with groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure optimized manufacturability, cost, reliability, and time‑to‑market. Minimum Qualifications: MS/PhD or equivalent experience preferred, BS in electrical engineering required. 2&#43; years of NAND design relevant proven experience required.<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the groundbreaking of memory innovation, partnering across design, integration, modeling, and characterization to define the next generation of memory solutions. We thrive on solving complex technical challenges and turning breakthrough concepts into scalable technologies that shape Micron’s future. As a Pathfinding Device Integration Engineer, you will help drive early-stage technology development by connecting device physics, materials science, and process integration. In this role, you will evaluate emerging device concepts, develop experimental strategies, and generate data-driven insights that influence future technology decisions. Your work will play a key role in advancing device scaling, performance, and manufacturability across Micron’s long-term roadmap. Responsibilities: Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements Lead process integration efforts by aligning materials and process flows into actionable technology solutions Design and implement experiments in the R&D fab to optimize device performance and manufacturability Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities Collaborate with modeling, characterization, reliability, and device teams to assess t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead the architecture, design, integration, and silicon validation of complex analog and mixed-signal circuits for advanced DRAM products, including amplifiers, comparators, references, LDOs, charge pumps, oscillators, DLLs, I/O circuits, and on-chip monitors. Drive development of custom analog and digital IP from concept through tape-out, silicon bring-up, and production. Define architectures and design methodologies to optimize power, performance, area (PPA), reliability, yield, and manufacturability. Lead verification, modeling, parasitic analysis, silicon correlation, and design signoff across PVT and reliability corners. Guide physical implementation, including floorplanning, matching, placement, routing, and reliability-aware layout practices. Collaborate with Product, Process, Test, Probe, Assembly, and Manufacturing teams to ensure successful product qualification and high-volume production. Drive design quality, standardization, and continuous improvement through advanced CAD, modeling, automation, and verification methodologies. Mentor and develop engineering talent while providing technical leadership across projects and product generations. Drive innovation through reusable IP development, patents, technology roadmaps, and differentiated circuit architectures. Leverage engineering tools powered by AI and agentic AI workflows to improve build efficiency, accelerate verification, optimize PPA, and reduce p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Join an inclusive team passionate about one thing: using their expertise in the continuous pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while contributing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing! Responsibilities Operate and support the full robotics and automation fleet – autonomous mobile robots, CoBOTs and associated automation platforms – delivering material handling, picking and loading operations across Probe, Fab, Smart Warehouse, bridges and supporting facilities. Serve as the robotics point-of-contact for your assigned shift – monitor operations, publish shift announcements, handle critical issues, and deliver clear passdowns to the next shift. Monitor jobs and missions end to end (start, ETA, completion,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Yield Analysis Module Lead, you will leverage advanced data analytics and deep process knowledge to identify, characterize, and quantify key yield limiters within assigned fab modules. You will lead rigorous investigative efforts to determine root causes of yield excursions, develop and publish actionable yield paretos, and translate complex data into clear technical direction for improvement. Working closely with the YA PTO team, Process Integration, and Process Engineering, you will provide accurate, data-driven guidance to the fab, influence corrective action strategies, and drive sustainable yield improvements. This role offers direct ownership of yield performance and a critical opportunity to impact continuous improvement across the manufacturing line. Lead and maintain an effective training and development program, providing coaching and mentorship to elevate team proficiency and support growth of direct reports. Proficient in Module based Data Analysis, Part Type Ownership Analysis and new part setup activities Track probe yield performance and trends to identify, characterize, and explain gaps between target and actual yields. Perform advanced data analysis to quantify yield issues and generate accurate yield paretos that guide fab priorities and improvement efforts. Apply statistical and data‑mining techniques to identify root causes and uncover opportunities for sustainable yield improvement. Collaborate closely with PI, Probe, PE, EFA, and PFA tea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We develop advanced memory technologies that transform how the world uses information to enrich life for all. As a Design Engineer, you will craft and optimize digital, analog, and memory circuits while collaborating with global design and verification teams. You will build solutions that improve quality, reliability, manufacturability, and product performance while continuing to learn and innovate in a global engineering environment! Responsibilities Design, develop, and optimize memory, logic, and analog circuits for new memory products. Perform circuit validation, parasitic modeling, reticle experiments, and tape-out revisions to drive performance and manufacturing efficiency . Lead layout activities including floorplanning, placement, routing, verification, modeling, and simulation using industry-standard tools. Collaborate across Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to solve technical challenges and support successful product execution. Drive innovation in future memory technologies while building design quality and standardization across global engineering teams. Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Electronic Engineering, or a related field, with 10&#43; years of relevant industry experience; or a master’s degree with 7&#43; years; or a Ph.D. with 5&#43; years of relevant industry experienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but are not limited to · Responsible for the architecture, design, implementation, and validation of analog and mixed-signal circuits used in NAND Flash across the complete design lifecycle. · Design and develop circuits such as charge pumps, amplifiers, voltage regulators, data converters (ADC/DAC), bandgap references, sensor interfaces, and power-management blocks. · Translate system-level requirements into detailed circuit specifications, architectures, schematics, verification plans, and clear design documentation. · Perform transistor-level design and optimization to meet performance, power, area, noise, and reliability targets. · Conduct DC, AC, transient, noise, Monte Carlo, and corner simulations to verify functionality and robustness across process, voltage, and temperature variations. · Validate block- and chip-level design performance using standard industry simulators, including evaluation of parasitic effects and integration quality. · Participate in cross-functional evaluation of key NAND features and collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and other partner teams. · Analyze design and silicon issues, drive root-cause analysis, and implement robust corrective actions. · Coordinate technical activities for a small team when required, including design reviews, execution tracking, and knowledge sharing. · Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and implement physical layouts for advanced digital, analog, and mixed-signal circuits used in the development of memory products. Responsible for translating schematics into high quality, manufacturable layouts that meet process rules, performance targets, and schedule commitments, while collaborating closely with cross functional engineering teams. Create physical layouts of transistors, resistors, capacitors, and interconnect structures for digital, analog, and mixed-signal circuits. Perform block-level floor planning, including layout area estimation and optimization. Develop IC top-level floorplans and provide accurate total die area estimates. Execute routing, power bus design, and creation of robust PDN (Power Domain Network) solutions to ensure optimal electrical performance, reliability, and scalability. Ensure layouts comply with foundry process design rules and verify layout-versus-schematic (LVS) and design rule checks (DRC). Apply recommended layout, verification techniques, tools, and design flows to deliver high-quality designs on schedule. Work closely with analog/mixed-signal and digital design engineers to ensure proper layout implementation, including critical matching and symmetry requirements. Collaborate with Design Engineering, Product Engineering, Process Integration, Probe, and Assembly teams to proactively optimize designs for manufacturability, cost, quality, reliability, and time-to-market. Create and maintain layout-related documentation and actively participate in layout and design reviews. Support continuous improvement of

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Electrical Failure Analysis Engineer is responsible for performing fault isolation and failure analysis on advanced semiconductor devices to identify root causes and support product quality, reliability, and yield improvement. This role utilizes specialized diagnostic tools, semiconductor design knowledge, and failure analysis methodologies to investigate electrical and physical failures, interpret results, generate technical reports, and collaborate with cross-functional engineering teams. Success in this role requires strong analytical and problem-solving skills, a strong understanding of semiconductor devices and fabrication processes, effective communication abilities, and the ability to thrive in a collaborative, fast-paced environment. Main Responsibilities Perform Electrical Failure Analysis (EFA) and Fault Isolation Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and other photon, thermal, or laser stimulating emission tools Characterize or model Probe test and internal qualification fail signatures Extensive understanding of physical and logical semi-conductor design Use layout/schematic to aid in fault isolation and fail signature modeling

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Understand NAND device operation, reliability tests, product qualification, and performance/reliability requirements. Drive process and device technology development to meet performance and reliability specs within project timelines. Design process experiments, segment problems clearly, and analyze data using device physics understanding. Develop and utilize artificial intelligence (AI) tools to enable faster cycles of learning to advance NAND device capability and drive new solution. Extract and analyze inline, probe, parametric, and reliability data. Lead cross-functional teams to address device/array deficiencies across design, process, and device teams. Apply project management skills to small projects or parts of larger projects. Collaborate with product engineering, TCAD, and process integration teams to improve characterization and define structural specs. Provide regular project status, outlook, problem summaries, actions, and deliverable timelines to global cell and management teams. Required Knowledge and Skills Strong understanding of semiconductor device physics, CMOS fundamentals, and memory device operation. Knowledge of semiconductor process