Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an IT Network Engineer at Micron, you will be responsible for the operational health (Security, Availability, Performance, Interoperability and Reliability) of Micron’s data communications systems. You will support the acquisition, installation, maintenance, and administration of Micron’s data and voice communications systems. Network Engineers specialize in LAN/WAN, Wireless, and Telecommunications hardware, software and cabling. You will regularly work with Micron’s Business Units to ensure solutions meet or exceed business requirements. You will be expected to suggest, promote, and leverage published standards to minimize environment complexity and ensure regulatory as well as license compliance. Responsibility Collaborate with various teams and functional areas in developing and improving business processes with clear and agreed-upon business rules Develop process improvement strategies across the network Prioritize and manage multiple projects based on Department and corporate objectives Lead and collaborate with various engineering groups to optimize current processes and align the network to improve manufacturability, yield, quality and cost performance of products Work with process integration team to implement and integrate new/improved process workflow Maintain documentation for new and improved processes Communicate project strategy, status and actions through meetings, presentations and reports to

Job Details: Job Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. With a focus on driving results and fostering collaboration across multiple organizational boundaries, this role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap. Key Responsibilities: - Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions. - Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals. - Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes. - Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power performance and area leadership. - Build and maintain partnerships with supplier executive management to nurture unique industry ideas and research innovations. - Coach and mentor engineering teams in pathfinding and technology road mapping for advanced technology development. - Develop long-term strategies for module engineering capabilities to support emerging technological requirements. - Ensure accountability and drive team results by setting clear goals, performance benchmarks,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow , product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs . Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification . Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams . Communicate project status, risks, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a member of the HIG HBM Media Health HVM team, you will embody an outstanding approach to Next Generation HBM Product driven by important metrics: Quality, Cost, Cycle Time, and Scale. You will work closely with various teams within and outside of HBM to achieve strategic and operational goals. Key Responsibilities Optimized Test Coverage: Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing. Encouraging Innovation: Motivate innovation and inspire changes that will help Micron maintain a technical advantage over its competition, ensuring Micron’s competitive edge in the market. Product Development and Validation: Develop, validate, characterize, and qualify Micron’s next-generation HBM products, ensuring reliability and market readiness. Support for New Product Design Validation: Provide support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations. Yield Improvement and Cost Reduction: Improve manufacturing test yields, reduce test time, and resolve yield-related issues, contributing to cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues: Identify and resolve issues related to device qualification and return material authorization, ensuring product quality. Process Conversions and HVM: Recommen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High‑Volume Manufacturing (HVM) team is responsible for delivering stable, high‑yield semiconductor manufacturing to support Micron’s long‑term DRAM production strategy. The photolithography organization partners closely with operations, equipment engineering, and integration to maintain safe, efficient, and repeatable manufacturing. The Photolithography Process Engineer supports day‑to‑day health and capability of assigned, non‑critical lithography processes and tools. This role executes established control plans and standard work, monitors manufacturing signals, and supports issue resolution and continuous improvement activities with guidance from more experienced engineers. Responsibilities Execute established control plans and standard work to support stable lithography manufacturing. Monitor SPC, metrology, defect, and tool health indicators and escalate risks appropriately. Support excursion response activities, including containment, data collection, and documentation. Partner with shift operations and equipment engineering to support tool recovery and daily priorities. Complete well‑defined improvement tasks related to yield, output, cycle time, or cost with guidance. Minimum Qualifications B.S or M.S in Electrical/Electronics Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Computer Engineering, or a related technical field.. Understanding of high‑volume manufacturing execution, including SPC mon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Engineer, you will develop, optimize , and sustain the semiconductor processes that drive yield, quality, cost, and productivity by solving complex technical challenges and partnering across equipment, integration, manufacturing, and supplier teams. As part of Micron’s AI-enabled ecosystem, Fab Process Engineers leverage AI-assisted process monitoring, SPC/FDC insights, and data analytics to optimize process stability, yield, quality, cost, and productivity across wafer fabrication. RESPONSIBILITIES Develop, optimize , and sustain fabrication process steps for yield, quality, cost and productivity Drive step-level process changes, validate new technology node readiness, evaluations and lead continuous improvement initiatives Investigate yield and defectivity issues by tracking process performance with methods like FMEA, 8D, SPC, FDC, APC App

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. As part of Micron’s historic investment in Boise, Idaho, we are building the future of semiconductor manufacturing with a new leading-edge DRAM fab and expanded manufacturing capabilities. About the Role As a Process Quality Engineer, you will drive the strategic direction of front-end wafer quality across the local site and Micron's global organization. You will support the development and execution of strategies that enable future technology requirements while ensuring robust contamination control across the fab environment. You will actively monitor, assess, and reduce airborne and surface contamination risks to protect wafer quality, yield, and reliability. Working closely with process, facilities, equipment, and integration teams, you will investigate contamination-related issues, implement corrective actions, and prevent recurrence. You will also evaluate contamination risks associated with new materials, processes, and technologies, ensuring effective controls are in place to support successful technology development and manufacturing. Additional responsibilities include, but are not limited to: Responsibilities may include (but not limited to) Support the development and execution of contamination control progr

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The Staff Engineer owns and delivers wet process module execution for advanced NAND, translating device and integration requirements into robust process windows and control strategies, and driving cross ‑ functional actions to close yield, reliability, and cost gaps. Holds stron g module ownership , leading complex experiments and driving cross ‑ functional closure of process issues. Acts as a technical contributor who can lead teams/sites/suppliers on complex projects within their module scope. Main Responsibilities Process Development & Margin Improvement Own process characterization and recip

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Principal Engineer provides technical leadership for NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing. Success requires proven leadership in thin film module development, strong cross-functional influence, deep characterization and correlation capability, and strong judgment in technical tradeoffs for manufacturability, scaling, yield, and reliability. Main Responsibilities Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives . Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices. Oversee end-to-end development of process modules with

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The DMTS is a top technical authority and industry expert who defines, develops, and transfers advanced NAND dry etch processes, shapes equipment and process roadmaps, benchmarks against industry standards, and resolves the most complex yield/defectivity/integration challenges. This role carries broad technical vision, deep domain expertise , strong external engagement, and responsibility for elevating technical capability through mentorship of senior technical leaders. Main Responsibilities Act as technical expert for dry etch process, hardware, and applications in NAND technology development; provide forward-looking insight on trends, capabilities, and integration risks. Define the equipment roadmap and drive mechanism-focused hardware roadmaps with suppliers for next-generation NAND dry etch. </li

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process characterization, margin improvement, integration, and transfer readiness, while driving cross-functional alignment with global development, manufacturing, equipment, and supplier teams. The position resolves complex process, yield, defectivity, and manufacturability challenges, influences module and site-level technical direction, and advances robust CMP capability for high-volume production through disciplined experimentation, process control, and technology roadmap execution. Main Responsibilities · Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes. · Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance. · Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements. · Drive transfer of developed CMP processes to high-volume manufacturing at Fab10N and lead cross-func

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High-Volume Manufacturing (HVM) fab is at the leading edge of DRAM technology, driving sophisticated semiconductor innovation through EUV lithography. We operate in a fast-paced, data-driven manufacturing environment focused on achieving extraordinary yield, process capability, and operational excellence while maintaining strict safety and contamination-control standards. For this great opportunity as an EUV Photolithography Engineer, you will lead the development, optimization, and sustainment of EUV processes and scanner performance critical to advanced DRAM nodes. You will be responsible for ensuring process stability, improving yield and throughput, and driving continuous improvement through data analysis, multi-functional teamwork, and sophisticated process control techniques in a high-volume manufacturing environment. Responsibilities Own EUV lithography processes and scanner fleets, ensuring stable high-volume manufacturing performance through SPC monitoring, overlay/CD optimization, defectivity reduction, and tool matching. Lead rapid response to process excursions, including containment, root-cause analysis, wafer disposition, and implementation of corrective and preventive actions (CAPA). Collaborate with Operations, Equipment Engineering, Integration, and Metrology teams to align on production priorities, resolve risks, and optimize cycle time, capacity, and output. Drive continuous improvement of process capability, yield, and equipment productivity using sophist

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Staff Engineer leads module ‑ level photolithography process development for advanced NAND technology nodes. This role owns process robustness, manufacturability, and readiness for technology transfer. Success requires strong technical depth, execution leadership, and the ability to translate device requirements into reliable, scalable process solutions. Main Responsibilities Lead development, optimization, and troubleshooting of photolithography processes to meet yield, quality, and performance requirements. Translate device and integration requirements into robust process flows, specifications, and control strategies. Perform and own material evaluations, OPC/layout development, process window analysis, and overlay optimization. Design and implement advanced process control methodologies using SPC, DOE,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Track & Trim Equipment Development Engineering team, driving innovation at the heart of advanced semiconductor manufacturing. We partner across process, integration, and manufacturing teams to bring next-generation lithography capabilities—including EUV—to life. If you enjoy solving complex technical challenges and crafting the future of high-volume manufacturing, you’ll feel right at home here! In this role, you will serve as a technical leader and recognized authority on photolithography Track and Trim systems. You’ll lead critical programs, influence process strategy, and ensure equipment performance at advanced nodes. Your work will directly impact yield, cost, and scalability throughout international fabrication facilities, making this a highly visible and rewarding opportunity. Responsibilities: Serve as SME for Track & Trim systems; define process strategy and resolve complex equipment and process issues Lead equipment lifecycle programs including selection, installation, qualification, and deployment for advanced nodes including EUV Improve tool uptime, reliability, and performance to meet yield and cost targets in high-volume manufacturing Drive safety and operational perfection by embedding safe practices (PPE, LOTO, chemical safety) into equipment and processes Partner with multi-functional teams and vendors to develop, optimize, and scale solutions across global fabs Minimum Qualifications: B

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary The SMTS acts as a technical authority in 3D NAND cell film development, setting strategic direction and leading multi-functional initiatives to drive department-wide impact by architecting solutions, accelerating innovation adoption, influencing technical standards, and mentoring engineers to elevate technical excellence. Defines technical strategy and drives cross-org adoption; leads complex problem solving across process/hardware/device interactions with no yield trade-off; builds the SME pipeline through structured mentorship. Main Responsibilities Define technical strategy; architect solutions; influence technical standards and drive process improvements; lead advanced process development, fixing, and integration. Integrate unit processes into full cell packages and validate device/process linkages via wafer-level electricals. <