Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer/Member of the Technical Staff in the Procurement and Operations Central Teams (PROCT) and Advanced Development Team (ADT), you will primarily focus in the early maturity phase of new products as they transition from technology development centers to our high-volume manufacturing sites. Your contributions to our team will support innovation and enable improvements in product yield, quality and cost reduction that are vital to enable our manufacturing strategy. We are looking for outstanding candidates experienced with semiconductor process development/optimization, hardware and supplier management, and an understanding of NAND & DRAM integration to contribute and grow with our organization. Good organization skills and the ability to work independently or in teams is a must and because this role is essential to the success of Micron's products it will require international travel to Micron manufacturing and technology development sites. Your responsibilities include, but are not limited to: Collaborate with Technology Development (TD) on future technology requirements and model of record requirements to ensure manufacturing roadmap is aligned with the forward technology path Partner with TD and Manufacturing on supplier engagement to ensure resources meet Micron's strategic objectives. Collaborate with Manufacturing as new products are introduced to improve performance and enable customer qualification. Connec

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer/Member of the Technical Staff in the Procurement and Operations Central Teams (PROCT) and Advanced Development Team (ADT), you will primarily focus in the early maturity phase of new products as they transition from technology development centers to our high-volume manufacturing sites. Your contributions to our team will support innovation and enable improvements in product yield, quality and cost reduction that are vital to enable our manufacturing strategy. We are looking for outstanding candidates experienced with semiconductor process development/optimization, hardware and supplier management, and an understanding of NAND & DRAM integration to contribute and grow with our organization. Good organization skills and the ability to work independently or in teams is a must and because this role is essential to the success of Micron's products it will require international travel to Micron manufacturing and technology development sites. Your responsibilities include, but are not limited to: Collaborate with Technology Development (TD) on future technology requirements and model of record requirements to ensure manufacturing roadmap is aligned with the forward technology path Partner with TD and Manufacturing on supplier engagement to ensure resources meet Micron's strategic objectives. Collaborate with Manufacturing as new products are introduced to improve performance and enable customer qualification. Connec

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever! We need someone who is passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict device performance! We are an equal opportunity company who values of People, Innovation, Customer Focus, Tenacity and Collaboration. As Yield Failure Analysis Engineer in Micron NAND Technology Integration (NTI) Singapore department, you will be responsible for providing yield analysis for next-generation Micron products. In this exciting role, you will become a domain expert on physical failure analysis methods for any given electrical failure! You will also participate in the identification and communication of yield issues, assist with the root cause analysis for process deviations, characterize, probe, parametric, and fabrication data to identify the sources of failures. Job Responsibility: Perform Failure analysis which includes conducting electrical characterization, perform electrical verification to confirm failures, and understanding PFA techniques available for de-processing failures Dr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges. Working across upstream and downstream process modules, you will lead cross-functional efforts to establish robust process windows, qualify new technologies, and enable scalable manufacturing integration. You will also collaborate with internal equipment-development teams and strategic suppliers to rapidly deploy new systems, shape equipment and process roadmaps, and drive hybrid-bondin

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Front End Central Product Integration, CPIE ( Central Product Integration Engineering) H B M (High Bandwidth Memory ) PI Principal Engineer/ Senior Manager at Micron Technology, Inc, you will be responsible for providing leadership to the global Micron network to drive leading edge HBM Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution , collaborating with Japan, Taiwan, Singapore and US team , driving product maturity within a defined schedule while maintaining the highest standards of quality. Responsibilities and Tasks STRATEGIC LEADERSHIP Work with FAB to drive for best-in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role As an AI Transformation Engineer within the Frontend Central Product Integration Engineering (CPIE) team at Micron Technology, Inc., you will drive the convergence of artificial intelligence and semiconductor manufacturing excellence. You will lead AI-powered innovation across process capability, yield optimization, and quality improvement. In this role, you will take ownership of AI agent skill development and lifecycle management — designing, building, deploying, and governing intelligent agents that automate complex engineering workflows and augment human decision-making across Micron's global manufacturing ecosystem - serving as both a technical leader and AI evangelist who inspires and influences multi-functional teams to think and work differently. Primary Responsibilities AI-Driven Process & Yield Innovation Initiate and lead new AI/data solutions to uncover process, test, and design improvement opportunities, with specialization including but not limited to: UE_ROW & all quality indices Front End-PTS integration High-value-bits (PG2+

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key responsibilities and task:- To lead and manage the NPI activities as a Product Owner, working together with cross functional teams to accomplish organizational and business objectives by: Driving New Product Introduction process through NPI Phase Gate Review. Coordinating new product start-up and to achieve first pass qualification. Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production; Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per PDT schedule. Regular monitoring the product yield trend; QDR and reliability to ensure that assembly operation is in control and initiate early attention if necessary; Owning the entire Product Life Cycle, from NPI to EOL. Understanding new product challenges and collaborate with Process / Equipment/Development owners to develop new technology capabilities ahead of market Acting as a point of contact to TPM on product related matters. Requirements: Bachelor's degree in an Engineering (Mechanical, Material, Chemical, Electrical ). Passionate in backend engineering process or package development. Eager to learn technical knowledge in com

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities Develop, optimize , and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Design and execute experiments, analyze data, and communicate results in appropriate technical forums. Perform film characterization using appropriate techni

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team committed to advancing Dry Etch processes within Micron’s R&D organization, pushing the limits of plasma etch technology to enable future memory products. We work at the intersection of physics, materials, and manufacturing to solve hard problems and move new ideas from concept to production. This is a highly collaborative environment where deep technical expertise directly shapes Micron’s technology roadmap! As an R&D Dry Etch Process Development Engineer, you will develop and optimize plasma dry etch processes for advanced memory technologies. You will take ownership from early research through pilot line execution and global process transfer. Experienced engineers in this role drive multi‑area technology roadmaps and influence Micron’s leadership in semiconductor manufacturing. Responsibilities: Develop and optimize plasma dry etch processes to meet structural and electrical requirements Drive dry etch technology roadmaps and deliver solutions for future product nodes Perform root cause defect analysis and failure mode investigations Partner with integration, yield, manufacturing, and vendors to ensure robust processes Support process transfer from R&D pilot line to global production fabs Minimum Qualifications: Bachelor’s degree in Electrical, Mechanical, Materials, Chemical Engineering, Physics, or related field with 5+ years of semiconductor experience Strong understanding of d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies. Risk Management: The

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together with a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will work within the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Responsibilities Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes. Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts. Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions<

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s NAND Process Development (PD) Singapore group is looking for Senior Process Development Engineer to join Advanced Node team to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Main Responsibilities: As a CMP Process Development Engineer, you will be primarily responsible for developing and optimizing CMP processes to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts. Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications. Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions. Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes. Incorporate be

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. This role is part of Micron’s Technical Leadership Program (TLP) —a career path for individuals who advance Micron and the industry through technical excellence, innovation, influence, and mentorship . TLP members are expected to set technical direction, lead through influence, and develop the next generation of technical leaders. Key Responsibilities: Define and lead pathfinding photolithography projects for future technology nodes and novel memory architectures. Establish long‑term photolithography technology vision and roadmaps, aligned with device scaling, yield, cost, and manufacturability goals. Drive early development and de‑risking of disruptive lithography solutions, including materials, processes, equipment, and patterning schemes. Serve as a recognized technical authority, influencing technology decisions across R&D, integration, and manufacturing organizations. Lead cross‑functional and cross‑site initiatives, ensuring alignment and execution of high‑impact technology programs. Partner with suppliers to co‑innovate next‑generation tools, materials, and metrology capabilities. Oversee advanced process development including imaging, overlay, OPC, process window optimization, and advanced process con