Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond. Work with process development engineers in Singapore and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes. Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts. Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions Incorporate best known manufac

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ROLE Lead first-silicon bring-up, characterization, debug, and validation of advanced 3D NAND products. Establish whether silicon meets design intent and datasheet requirements, correlate simulation with measurements, and resolve issues that could affect product qualification, reliability, yield, or SSD/system integration. This role provides a unique opportunity to develop end-to-end expertise across advanced NAND products, spanning circuit design concepts, mixed-signal simulations, first-silicon bring-up, silicon debug, product qualification, and manufacturing readiness. Engineers gain broad exposure to analog, mixed-signal, digital, firmware, memory-array, and system-level behavior while working closely with design, verification, firmware, product, and system teams. RESPONSIBILITIES • Own validation strategies, coverage, and test plans for assigned NAND circuits and functions; define expected behavior, operating corners, and pass/fail criteria from product specifications and design intent. • Lead first-silicon bring-up, characterization, debug, and simulation-to-silicon correlation across voltage, temperature, process, timing, and workload conditions. • Characterize and debug NAND subsystems including reference and bias generation circuits, bandgap references, oscillators, voltage regulators, charge pumps, sensing and page-buffer paths, high-voltage program/er

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Design and execute experiments, analyze data, and communicate results in appropriate technical forums. Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Install, start-up, and continually improve cutting edge semiconductor processing equipment and hardware both internally with process engineering and externally with vendors to enable leadership in next-gen memory. Apply project management skills to projects and demonstrate the ability to exchange complex information with customers Set Module Level. Identify alternate CMP/Bond hardware technologies Recognizing opportunities and provide feedback to R&D personnel for technical innovation. Mentor new engineers and other upcoming engineers. Drive module level development and lead large projects of a technical nature. Standardize methods and procedures across area, department and/or FABs. Research, gather and analyze information related to specific assignments within your technical discipline. Recommend process or equipment changes to improve FAB metrics Interpret results and conduct quantitative analyses. Interpret results of new or modified equipment or processes. Design, develop, and implement technical products, systems, or processes to improve product quality and/or Fab performance Evaluating issues and define solutions to develop and implement improvements in equipment or processes to improve scrap, cost, rework, cycle time, throughput or yield. Resolve integration issues through process development. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Employer will accept a Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering or related field and 2 years o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. This job requisition is to seek senior technical leaders in the field of process engineering to join ID1, reporting directly to Director of DE/WP/CMP. As a member of technical staff (MTS) or Senior member of technical staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up. Your contribution will have a lasting impact on the DRAM industry! Responsibilities for Process Engineering MTS/SMTS include (but not limited to): Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures. Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability. Define and execute

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we build the memory and storage that powers everything from massive data centers to the devices people rely on every day. Our design teams carry silicon all the way to systems—developing advanced memory architectures, shaping the products around them, and validating the solutions used across the globe. We take real ownership of the technology we create, and we're always pushing what memory can do! As a Staff Analog Design Engineer, you'll design and analyze the analog and digital circuits at the core of our memory products, directly shaping their performance, cost, and reliability. You'll work alongside Micron's design and verification teams around the world and support Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to build products that optimize manufacturing and keep customers coming back. It's a role where your circuit decisions show up in silicon that ships at scale. Responsibilities: Design, optimize, and verify block-level analog and mixed-signal circuits for DRAM Evaluate new circuit topologies to improve block PPAC Expand verification coverage to strengthen robustness and mass-production yield Partner with global design groups, guide layout through post-layout simulation, and support silicon-to-simulation correlation Apply agentic AI and automation tools to improve design quality and efficiency Minimum Qualifications: Bachelor's degree in Electrical Engineering with 6+ years of semicond

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Process Development & Optimization Develop, optimize, and characterize thin film processes (ALD/CVD) to meet performance, reliability, and manufacturability targets. Execute well ‑ designed experiments, analyze data, and translate results into process improvements. Support scaling of cell film processes across nodes and platforms. Module Ownership (Growing Scope) Own defined portions of a process module or sub ‑ module under guidance from senior engineers. Track process margins, key sensitivities, and integration risks. Drive issue resolution for process and tool ‑ related problems within assigned scope. Process Integration & Correlation Work closely with integration and device teams to ensure process compatibility and electrical performance. Correlate material, structural, and electrical data to guide process optimization. Support failure analysis and root ‑ cause investigations for yiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a highly experienced Staff Engineer for Design Enablement and Layout in Advanced Packaging Technology Development. This role involves coordinating cross-functional engineering teams across geographies to develop and optimize design rules, requirements, design, and layout from early development through manufacturing! Job Description: Responsibilities will include, but are not limited to: Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging. Create layout and DBR test vehicle and product designs to support technology development. Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations. Analyze large datasets to extract meaningful insights and drive data-driven decision-making. Leverage of artificial intelligence to reduce development time. Manage structure evaluation to support development and quantify process margins. Strategically partner with teams to resolve process issues related to layout and prioritize solutions. Document and communicate complex problem resolutions and drive cross-node design rule alignment. Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams. Minimum Qualifications: BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field. 5+ years of experience in semiconductor industry in areas such as Process Integration, Yiel

What We’re Looking For: We’re looking for PIC (photonic integrated circuit) design engineers to contribute to and own aspects of the wafer-scale photonic interposer PIC. This will involve solving unique problems in creative ways, such as the tension between density and manufacturability yields, dealing with process variation on large scale wafers, etc. Ideal Candidates: Ideal candidates will have: Experience with both passive and active PIC design components An understanding of the fundamental physics at play, not just a “simulate and turn the crank” attitude Experience with large device count PIC tapeouts Deep understanding of optical coupling in and out of the PIC, especially how to achieve very low losses under realistic manufacturing conditions (alignment, etc) Understanding of the physical manufacturing process behind PICs Nice to Have: Experience with high speed optical communications PICs Experience in designing with PIC material platforms other than silicon photonics (eg InP, TFLN, SiN, polymers, glass, etc) Experience and knowledge of active gain chip integration (eg integrated lasers, SOAs, etc) Experience with large area PICs Understanding of sources of process variation, statistical process control, etc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Post-Silicon Yield & RMA Leadership Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures. Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions. Develop hypothesis-driven debug strategies and coordinate multi-functional execution. Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans. Device Technology & Process Interaction Analysis Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield. Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations. Translate silicon learning into actionable design and process improvements. Advanced ASIC Design Interaction & Silicon Debug Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems. Analyze silicon failures across transistor, circuit, block, die, package, and system levels. Drive post-silicon debug activities involving design teams, DFT, product engineering, quality,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Post-Silicon Yield & RMA Leadership Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures. Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions. Develop hypothesis-driven debug strategies and coordinate cross-functional execution. Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans. Device Technology & Process Interaction Analysis Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield. Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations. Translate silicon learning into actionable design and process improvements. Advanced ASIC Design Interaction & Silicon Debug Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems. Analyze silicon failures across transistor, circuit, block, die, package, and system levels. Drive post-silicon debug activities involving design teams, DFT, product engineering, quality,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuou