Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Post-Silicon Yield & RMA Leadership Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures. Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions. Develop hypothesis-driven debug strategies and coordinate cross-functional execution. Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans. Device Technology & Process Interaction Analysis Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield. Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations. Translate silicon learning into actionable design and process improvements. Advanced ASIC Design Interaction & Silicon Debug Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems. Analyze silicon failures across transistor, circuit, block, die, package, and system levels. Drive post-silicon debug activities involving design teams, DFT, product engineering, quality,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuou

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. Having understanding of Frontend Process is a plus, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, Si characterization, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Operation Central Team (OCT) team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with High Volume Manufacturing (HVM) sites, Technology Development (TD), Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to me

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. Join a dynamic team today! This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in PHOTO process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. 3-7 years PHOTO experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Solid understanding of photolithography fundamentals - PR coati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in DRY ETCH process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. Qualifications: 1. Must be at least 4 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Mu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Project Title F10N/W CMOS Matching and RegE Wafer Edge Exclusion (WEE) Program Role Overview The intern will be responsible for driving yield improvement initiatives through CMOS matching analysis and RegE Wafer Edge Exclusion (WEE) program. The role focuses on identifying inline mismatches, reducing wafer edge-related yield loss, and developing robust analytical solutions to enable sustainable manufacturing performance. Key Responsibilities F10 N/W CMOS Matching Conduct fab to fab offload interaction studies to identify and diagnose inline mismatches between N and W processes that contribute to yield differences. Perform detailed bevel characterization to assess defectivity performance differences and quantify their impact on inline die loss. Analyze cross-module data to establish root cause relationships between process variation and yield performance. RegE Wafer Edge Exclusion (WEE) Program Drive key WEE performance metrics, including 22UE capability and 1H edge coat performance, to maximize overall yield. Identify, troubleshoot, and mitigate

About Atomic Atomic Industries is reinventing how the world makes things. From cars and aerospace systems to medical devices and packaging, most physical goods begin life in a mold or are shaped by a manufacturing tool. Producing these tools has always been slow, manual, and dependent on scarce expertise, taking weeks or months. We’re changing that. At our Detroit headquarters, we combine the industrial DNA of America’s manufacturing heartland with the speed, intelligence, and precision of Silicon Valley. Our AI-driven platform tackles the hardest problems in geometry, process planning, and fabrication, collapsing production timelines from months to days and soon, minutes. We don’t just build software; we run a fully operational factory where our technology produces production-grade tooling every week, enabling tight feedback loops and rapid iteration. Backed by top-tier investors, we’re restoring speed, flexibility, and capability to the American industrial base. Our mission is to make manufacturing as agile and scalable as the digital world, and in doing so, rebuild the infrastructure of the physical economy. About the Role We are seeking a manufacturing engineer to help build and launch a high-volume, highly automated injection molding plant. You will work closely with the Plant Manager to design and bring up molding cells, specify and commission equipment, and engineer production lines to run at high yield and uptime from day one. This is a hands-on, execution-focused role. You will be responsible for engineering the full molding cell—from material handling to press automation to part packaging—not just optimizing isolated processes. The ideal candidate has launched automated molding lines in fast-moving, high-mix environments and is comfortable taking ownership of throughput, quality, and cycle time from end to end. Responsibilities Engineer, design, and commission complete injection molding cells, including presses, EOAT, robotics, dryers, vision

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description & Requirements Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. Responsibilities Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. Integrate and solve processes as part of multi-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for th

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufac

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturabil

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Distinguish Member of Technical Staff in NAND Module Process Integration Team the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Module Ownership : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. Specification definition : Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan. Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and m