Process Integration And Yield Enhancement Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team committed to advancing Dry Etch processes within Micron’s R&D organization, pushing the limits of plasma etch technology to enable future memory products. We work at the intersection of physics, materials, and manufacturing to solve hard problems and move new ideas from concept to production. This is a highly collaborative environment where deep technical expertise directly shapes Micron’s technology roadmap! As an R&D Dry Etch Process Development Engineer, you will develop and optimize plasma dry etch processes for advanced memory technologies. You will take ownership from early research through pilot line execution and global process transfer. Experienced engineers in this role drive multi‑area technology roadmaps and influence Micron’s leadership in semiconductor manufacturing. Responsibilities: Develop and optimize plasma dry etch processes to meet structural and electrical requirements Drive dry etch technology roadmaps and deliver solutions for future product nodes Perform root cause defect analysis and failure mode investigations Partner with integration, yield, manufacturing, and vendors to ensure robust processes Support process transfer from R&D pilot line to global production fabs Minimum Qualifications: Bachelor’s degree in Electrical, Mechanical, Materials, Chemical Engineering, Physics, or related field with 5+ years of semiconductor experience Strong understanding of d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Responsibilities Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes. Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts. Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions<

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together with a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will work within the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s NAND Process Development (PD) Singapore group is looking for Senior Process Development Engineer to join Advanced Node team to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes. Main Responsibilities: As a CMP Process Development Engineer, you will be primarily responsible for developing and optimizing CMP processes to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts. Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications. Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions. Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes. Incorporate be

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. This role is part of Micron’s Technical Leadership Program (TLP) —a career path for individuals who advance Micron and the industry through technical excellence, innovation, influence, and mentorship . TLP members are expected to set technical direction, lead through influence, and develop the next generation of technical leaders. Key Responsibilities: Define and lead pathfinding photolithography projects for future technology nodes and novel memory architectures. Establish long‑term photolithography technology vision and roadmaps, aligned with device scaling, yield, cost, and manufacturability goals. Drive early development and de‑risking of disruptive lithography solutions, including materials, processes, equipment, and patterning schemes. Serve as a recognized technical authority, influencing technology decisions across R&D, integration, and manufacturing organizations. Lead cross‑functional and cross‑site initiatives, ensuring alignment and execution of high‑impact technology programs. Partner with suppliers to co‑innovate next‑generation tools, materials, and metrology capabilities. Oversee advanced process development including imaging, overlay, OPC, process window optimization, and advanced process con

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Boise, we are undergoing a historic $15B investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. We are looking for engineers who want to help drive innovation and operational excellence in advanced memory manufacturing. As an Implant Equipment Engineer , you will own the reliability, performance, optimization, and sustainment of ion implantation equipment supporting high-volume manufacturing. You will partner closely with process, integration, yield, manufacturing, and vendor teams to ensure robust tool performance, equipment availability, and safe execution in a fast-paced fab environment. Responsibilities Own ion implantation equipment performance and sustainment, including tool health metrics, maintenance strategies, and operational standards Drive equipment uptime, reliability, and defect reduction through data analysis, SPC, and structured root cause methodologies Lead equipment change reviews, risk assessments, qualifications, and implementations for new tools, upgrades, and hardware improvements Collaborate with process engineering, integration, manufacturing, and vendors to align equipment capability with production requirements Improve equipment productivity and operational efficiency through innovative automation, monitoring, and predictive maintenance solutions Minimum Qualifications Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Chemical, Materials, Physics, or related fiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead the architecture, design, integration, and silicon validation of complex analog and mixed-signal circuits for advanced DRAM products, including amplifiers, comparators, references, LDOs, charge pumps, oscillators, DLLs, I/O circuits, and on-chip monitors. Drive development of custom analog and digital IP from concept through tape-out, silicon bring-up, and production. Define architectures and design methodologies to optimize power, performance, area (PPA), reliability, yield, and manufacturability. Lead verification, modeling, parasitic analysis, silicon correlation, and design signoff across PVT and reliability corners. Guide physical implementation, including floorplanning, matching, placement, routing, and reliability-aware layout practices. Collaborate with Product, Process, Test, Probe, Assembly, and Manufacturing teams to ensure successful product qualification and high-volume production. Drive design quality, standardization, and continuous improvement through advanced CAD, modeling, automation, and verification methodologies. Mentor and develop engineering talent while providing technical leadership across projects and product generations. Drive innovation through reusable IP development, patents, technology roadmaps, and differentiated circuit architectures. Leverage engineering tools powered by AI and agentic AI workflows to improve build efficiency, accelerate verification, optimize PPA, and reduce p

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a Test Engineer you will be responsible for the followings: Optimizing process, tools and systems to achieve high product quality and high efficiency in Test operation. Responsible for improving quality-yield in Test process. Resolve process/product deviations. Drive continuous improvement in Test operation (through process characterization, process optimization, problem resolution and effective controls' implementation). Handle changes in test process (including new process/equipment qualification and new product integration) to support high volume production. Identify operational perfection (Quality, Efficiency, Cycle time, Delivery / Cost improvement) opportunities. Lead/participate in projects to realize the potential opportunities through innovative solutions. Additional tasks would include design and develop business intelligent reporting and dashboards for effective business data visualization enable data driven decision-making. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying wi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond. Work with process development engineers in Singapore and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes. Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability. Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable. Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts. Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions Incorporate best known manufac

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ROLE Lead first-silicon bring-up, characterization, debug, and validation of advanced 3D NAND products. Establish whether silicon meets design intent and datasheet requirements, correlate simulation with measurements, and resolve issues that could affect product qualification, reliability, yield, or SSD/system integration. This role provides a unique opportunity to develop end-to-end expertise across advanced NAND products, spanning circuit design concepts, mixed-signal simulations, first-silicon bring-up, silicon debug, product qualification, and manufacturing readiness. Engineers gain broad exposure to analog, mixed-signal, digital, firmware, memory-array, and system-level behavior while working closely with design, verification, firmware, product, and system teams. RESPONSIBILITIES • Own validation strategies, coverage, and test plans for assigned NAND circuits and functions; define expected behavior, operating corners, and pass/fail criteria from product specifications and design intent. • Lead first-silicon bring-up, characterization, debug, and simulation-to-silicon correlation across voltage, temperature, process, timing, and workload conditions. • Characterize and debug NAND subsystems including reference and bias generation circuits, bandgap references, oscillators, voltage regulators, charge pumps, sensing and page-buffer paths, high-voltage program/er

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology. The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners. Main Responsibilities Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets. Design and execute experiments, analyze data, and communicate results in appropriate technical forums. Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Install, start-up, and continually improve cutting edge semiconductor processing equipment and hardware both internally with process engineering and externally with vendors to enable leadership in next-gen memory. Apply project management skills to projects and demonstrate the ability to exchange complex information with customers Set Module Level. Identify alternate CMP/Bond hardware technologies Recognizing opportunities and provide feedback to R&D personnel for technical innovation. Mentor new engineers and other upcoming engineers. Drive module level development and lead large projects of a technical nature. Standardize methods and procedures across area, department and/or FABs. Research, gather and analyze information related to specific assignments within your technical discipline. Recommend process or equipment changes to improve FAB metrics Interpret results and conduct quantitative analyses. Interpret results of new or modified equipment or processes. Design, develop, and implement technical products, systems, or processes to improve product quality and/or Fab performance Evaluating issues and define solutions to develop and implement improvements in equipment or processes to improve scrap, cost, rework, cycle time, throughput or yield. Resolve integration issues through process development. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Employer will accept a Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering or related field and 2 years o