Process Integration Senior Engineer Jobs

Fab Engineer Process Integration — Hiroshima - Fab 15, Japan. Apply via Workday.

Fab Engineer Process Integration — Hiroshima - Fab 15, Japan. Apply via Workday.

New College Grad - Process Integration Engineer — Boise, ID - ID1. Apply via Workday.

Entry-Level Process Integration Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

Ocotillo Technology Fabrication Process Integration and Yield Engineer — Arizona, Phoenix. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Member of Technical Staff (MTS) – 3D NAND Process Integration Job / Role Summary The role drives advanced 3D NAND technology pathfinding and process integration within the Advanced NAND Technology team in Singapore. It leads the translation of device concepts, materials, and process architecture into validated, manufacturable technology solutions. The position coordinates end-to-end development from concept through technology validation, applies data-driven, AI-assisted, and model-based methods to resolve complex scaling challenges, and collaborates across Device, Probe, Test, Design, and Operations to improve performance, yield learning, execution, and future-node roadmap readiness. Main Responsibilities Lead 3D NAND integration, pathfinding, and advanced architecture enablement in support of the technology roadmap. Drive end-to-end technology development from concept through validation, including learning vehicles, chara

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description About the Role Join Micron’s Advanced NAND Technology (ANT) Singapore team to drive the future NAND technology roadmap through advanced pathfinding and integration. In this role, you will work in a cutting-edge R&D environment, developing next-generation memory technologies by bridging device concepts, materials, and process integration into manufacturable solutions. You will leverage AI-enabled data analytics and model-driven methodologies to analyze complex datasets, accelerate learning cycles, and solve critical scaling challenges, directly impacting future memory nodes. Key Responsibilities Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement. Lead end-to-end development (conception → technology validation) including learning vehicles, characterization, and debug. Solve complex integration challenges using data-driven, AI-assisted, and model-based approaches, identifying critical technology gaps and enabling solutions. Define and opt

ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing . Location 1 North Coast Drive, Singapore Department Product Integration Engineering (PIE), Process Integration (PI ) Project Title Advanced Memory Process Integration Improvement Exploration and Device Reliability Study (NAND / DRAM / HBM) Project Description This internship provides a structured learning opportunity within the Process Integration Engineering team, focusing on advanced semiconductor memory manufacturing technologies, including NAND, DRAM, and HBM devices. The intern will gain exposure to reliability concepts, fail

Intern- PIE PI (Product Integration Engineering, Process Integration) — Fab 10N/X, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Process Integration & Yield Technician supports the Process Integration Engineering (PIE) team by performing operational tasks that contribute to manufacturing process stability and yield improvement. The role includes data collection, basic analysis, documentation support, material disposition, product qualifications, and partnering with engineers to investigate production issues and process variability. Main Responsibilities Manufacturing Process & Yield Support Assist engineers with collecting production data to support variability reduction and manufacturing process improvement. Perform routine data checks and basic analysis using defined methods or templates provided by engineering. Support yield ramp and quality monitoring activities by preparing data sets and performing preliminary reviews for abnormalities. Issue Investigation Assistance Provide hands on support during production issue investigations by gathering information, running predefined tests, and consolidating results for engineering review. on support during production issue investigations by gathering information, running predefined tests, and consolidating results for engineering revie

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal/Staff Engineer, Process Integration, NTI NAND at Micron, you will have the outstanding opportunity to work on groundbreaking 3D NAND technology. This technology will develop the future of data storage solutions. This role suits those who are ambitious, enjoy solving complex problems, and want to lead innovative projects that push the boundaries of what is possible. Responsibilities Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits. Specification Definition: Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan. Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments. Material Innovation: Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and tran

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The PDE Process Integration (PI) Engineer is responsible for driving process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Post Wafer Finishing PWF, assembly, and test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. NPI Execution & Support Execute assigned HBM NPI PI tasks following defined procedures and phase‑gate requirements Support NPI builds through lot tracking, data collection, and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As a Process Integration Module Engineer in the Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for the NAND Flash production line. Day-to-day responsibilities include but not limit to crafting and analyzing process experiments, teaming with YE and PQA to investigate yield and quality problems, and working with production and process engineering teams to ensure the smooth operation of the fab. Main Responsibilities Collaborate with multi-functional teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. Communicate module related issues to the Fab engineering and leadership teams. Design, execute, and analyze experiments to improve fab process, yield, and quality. Collect and interpret complex data to optimize Fab processes and increase yields. Engage and/or lead cross-area engineering teams to tackle process issues. Work closely with global partners to stay ahead of on module related topics and process alignment projects. Collaborate with other PI module owners and sister fabs to drive business pr