Process Integration Senior Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As NAND TD RDA LEADER , you will lead a team in the use of next-generation defect detection equipment and processes to identify and solve issues. The goal of this position is to accelerate cycles of learning and technology transfer in Technology Development. We need leaders who are passionate about developing their team, delivering solutions to our internal customers, and driving our supplier's road maps to meet our future inspection needs. This position will provide the opportunity for you to collaborate with process integration, process development, data science, and yield analysis within and outside Technology Development. As a Technology Development RDA Lead, your leadership and innovation will have the ability to impact the team globally. You and your team will be responsible to support experimentation, data analysis, baseline health metrics, and systematic and random defect improvement through partnering with others in Technical Development and Global Manufacturing. Responsibility includes , but not limited to: Encourage a safe work environment Mentor your team in analyzing experimental process flows looking for defect anomalies and quarantining process tools that are out of control Build an environment of continuous improvement process (CIP) demeanor, looking for ways to improve operations, and how to make a difference today Develop inspection technology roadmaps to drive our internal and external partners enabling a clear path to future

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology Node Development team is responsible for bringing next-generation DRAM products from concept to production by improving yield, validating new features, and driving product quality. The team collaborates across design, process integration, manufacturing, and test engineering to solve complex technical challenges and deliver innovative memory solutions that power the future of computing. As a Product Engineer Intern in the DRAM Technology Node Development group, you will work alongside experienced engineers to support the development of next-generation DRAM products. You will gain hands-on experience in product characterization, test development, yield analysis, and design validation while applying analytical and problem-solving skills to real-world engineering challenges. Responsibilities Support new DRAM product development through electrical characterization, test development, circuit analysis, and design validation activities. Analyze product, test, and yield data to identify performance issues and drive continuous improvement initiatives. Collaborate with process, design, manufacturing, and test engineering teams to investigate and resolve product and process-related issues. Develop and improve test methodologies, automation scripts, and data analysis tools to enhance product quality and testing efficiency. Apply engineering tools, statistical analysis techniques, and AI-enabled technologies to support product c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in DRAM Technology Node Development, the role is responsible for bringing up new technology from design start through qualification and production ramp while co-optimizing product and process. Primary Responsibilities Enable new process node startup, qualification, yield and ramp. Provide direction to development teams using process integration knowledge. Develop technology health metrics and drive learning. Work with Design, TD, DFT, Manufacturing and Quality teams. Perform electrical failure analysis and yield improvement activities. Identify design marginalities and recommend fixes. Perform deep statistical analysis to improve product yield. Process–Device Integration & Failure Mechanism Diagnosis Collaborate with Process Integration, TD, Design, Test, and Reliability teams to identify yield‑limiting mechanisms and propose corrective actions. Conduct electrical failure analysis (bench + probe) to isolate circuit, array, or process‑originated signatures. Interpret data from proprietary internal tools (e.g., FRPT/efrpt, csensei, Node Dev analysis workflows). Test Program & Probe Flow Development Guide probe program correctness by correlating design intent, simulation data, and production test behavior. Ide

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The PDE API Process Integration (PI) Engineer is responsible for driving process integration excellence for Advanced Packaging products, including High Bandwidth Memory (HBM) products across sites during New Product Introduction (NPI) . This role ensures robust process readiness, yield ramp, and cross‑module integration across Front-end to Assembly interactions , PWF, Assembly, and Test , enabling successful execution of HBM technology roadmaps. The PI Engineer works cross‑functionally with different cross-functional teams including Fab, Assembly, Test, Yield, Quality, and central engineering teams to identify risks early, resolve complex integration issues, and deliver NPI milestones on time. Job Responsibilities Technical Leadership Serve as the Process Integration Subject Matter Expert, owning end‑to‑end integration across PWF, assembly, and test from NPI through sustained HVM Define PI technical direction, integration frameworks, and success criteria for HBM programs Lead process characterization strategy, window definition, and systemic yield improvement Resolve complex yield, reliability, and performance issues through deep technical analysis and integration expertise Drive resolution of high‑impact, ambiguous, cross‑site integration challenges affecting ramp, quality, or business commitments Anticipate risks early and define mitigation strategies across programs and sites

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Working place : Hiroshima Manufacturing site (Fab15) 勤務地：広島製造拠点(Fab15) As a Process Integration Engineer at Micron Fab15, you will help ensure process stability and drive yield/quality improvements by leveraging standard procedures, data analysis, and cross-functional collaboration. You will support early detection, root-cause isolation, and corrective/preventive actions for process deviations in a high-volume manufacturing environment. 職務概要 Micron Fab15 プロセスインテグレーションエンジニアとして、標準手順データ分析、ならびに部門横断的な協業を活用し、プロセス安定性を確保するとともに、歩留まりおよび品質改善を推進します。 Job role more in detail, Optimizing Device performance to improve not only yield but also repair density consumption. Need to think about appropriately HVM DRAM process condition especially focusing on Device process condition. Need to collaborate with other PI module teams and Each Area teams and also discuss with PE/GQ/ Design and TD device teams to take balance for deciding HVM device process condition Need to collaborate with other site OMT, ID1 and TD. 職務内容詳細 歩留まり改善を行うだけでなく、Repair Density消費の最適化を含めたデバイス性能の最適化を行う。 特にデバイスプロセス条件に注目し、HVM DRAM プロセス条件を適切に検討する。 他のPI moduleチームおよび、各エリアチームと連携し、さらにPE/GQ/Design /TDデバイスチームと議論しながら、HVMデバイスプロセス条件のバランスを取った意思決定を行う。 他サイトのOMT,ID1,TDチームとも連携する。 Job responsibilities Take responsibility for creating SWR for device performance improvement proactively. Take responsib

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron’s core memory technology serving AI-enabled customers. The R&D development takes place in an industry leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on the development and integration of critical technology which enables future DRAM memory scaling for Micron. You will develop the structural and electrical requirements for one or more modules and work in conjunction with Process Development and supporting teams to seamlessly integrate new module solutions into the entire process flow. Responsibilities include, but not limited to: Engineer and develop novel process flows for critical modules. This includes creating structural and electrical specifications as well as design rules for new process flows. Utilization of creative problem-solving skills to develop and optimize new process flows which improve performance and reduce the cost of future memory chips. Design experiments and analyze results using statistical analysis software. Results are applied to directly enhance yield. (DOE) Work cross-functionally with multiple groups including Design, Product Engineering, Process Development, Modeling, Yield Enhancement, Electrical and Physical Failure Analysis, Parametric, and Quality te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in the TDT (TD Taiwan) Device Team, you will drive DRAM device development projects supporting technology roadmap enablement, model delivery, performance optimization, reliability improvement, and technology transfer. You will collaborate closely with Technology Development organizations worldwide to advance next-generation CELL technologies from concept development through high-volume manufacturing. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. Key Responsibilities Drive DRAM CELL device development projects supporting future technology roadmap requirements. Lead electrical characterization, margin assessment, performance optimization, and reliability improvement activities.</p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for designing and analyzing digital and analog circuits used in the development of memory products. Engage in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. Collaborate with various internal design and verification teams all over the world and support the efforts of groups, including Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsible for power delivery network evaluation and optimization of DRAM designs, as well as design and optimization block level power generators. Utilize both analog and digital CMOS design skills to work on the analog circuits. Responsible for working with Product Engineering to verify silicon performance vs simulation performance of circuits you design. Work with Process integration and transistor modeling personnel in designing the circuits to be used on Micron's next groundbreaking process node. Review product requirements and logic diagrams for device definition. Responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor devices and components. Employer will accept a Bachelor's degree in Computer Engineering, Electrical Engineering, Electronics Engineering, or related field, followed by fi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HVM WET/CMP Sr. Manager in Micron, you are accountable to continuously improve the defense lines in all aspects to enable and assure wafer quality surpass critical metrics and achieve Best-In-Class performance. This scope of HVM WET/CMP Sr. Manager run across Yield enhancement from new technology start-up, Quality improved by wafer performance matching, process capability control SPC/FDC and advanced detective solutions, Output increased through activities which collaborated w/ ME, Manufacture, Cost saving by exciting team member to find out opportunity and Talent Development. Besides this, All activities need to collaborate with OMT/ Micron Networks to achieve KPIs and win customer total satisfaction. In Fab, this position requires collaborating with Fab Manufacturing, Equipment, Facility groups and Process Integration, Yield, Defect and Quality group to perform the Best Quality / Mature Yield / Maximum Output / Low Cost. In Micron network requires collaborating with Global functions as well as interaction with procurement and materials suppliers to drive the roadmap to support Fab KPI with excellence. objectives. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Design Rules team develops and maintains design rules, methodologies, and automation solutions that enable the successful design and manufacturing of advanced memory technologies. The team partners closely with Design, CAD, Process Integration, Verification, and Product Engineering organizations to ensure technology scalability, design quality, and manufacturing robustness. As a DRAM Design Rules Intern, you will contribute to design rule development, validation, automation, and design enablement activities for next-generation memory products. This role provides hands-on experience with semiconductor build methodologies, industry-standard EDA tools, AI Supported analytics, and multi-functional engineering collaboration while helping drive future memory technology innovation. Responsibilities Assist in the development, documentation, validation, and optimization of semiconductor design rules for advanced memory technologies. Support design enablement activities by developing methodologies, automation solutions, scripts, and workflows that improve design productivity, verification quality, and engineering efficiency. Perform design rule validation, verification, and analysis using industry-standard EDA tools, simulation environments, and AI Supported analytics frameworks. Collaborate with Design, CAD, Process Integration, Verification, and Product Engineering teams to evaluate technology features, process

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we are advancing the memory technologies that power the AI era. As a NAND Cell Device Engineer , you will work at the forefront of advanced 3D NAND development , driving the characterization, understanding, and optimization of next-generation memory cells. You will collaborate with world-class experts across device, process integration, design, product, and reliability teams to solve complex technical challenges and enable future technology nodes. This role offers the opportunity to influence the direction of future NAND technologies through deep device physics expertise, data-driven insights, and cross-functional collaboration . Scope and level of responsibility will be aligned with your experience . We welcome both high-potential engineers looking to grow into technical leadership roles and established experts seeking to make a significant impact on cutting-edge memory technology. Key Responsibilities Characterize advanced NAND memory cells and arrays to identify opportunities for performance, reliability, and scaling improvements. Develop deep expertise in NAND device physics, array operation, and failure mechanisms to guide future technology development. Analyze large-scale electrical test data to u

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability. The successful candidate will collaborate with multi-functional teams to evaluate novel materials, device architectures, and integration schemes supporting future memory technology development. Responsibilities Support the evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes. Design and implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in innovative memory and storage solutions that transform information into intelligence. The EUV Lithography team develops and advances groundbreaking photolithography technologies that enable next-generation semiconductor products. Working at the forefront of semiconductor innovation, the team collaborates across process integration, metrology, etch, wet process, and manufacturing fields to solve complex technical challenges and drive technology scaling. Micron internships provide hands-on experience in semiconductor research and development through meaningful technical projects, mentorship from experienced engineers, and exposure to advanced manufacturing technologies. Interns contribute directly to initiatives that support both current and future product development. As an EUV Lithography Intern, you will work on projects that support the advancement of semiconductor manufacturing technologies and next-generation memory products. You will collaborate with multi-functional engineering teams to design experiments, analyze process data, evaluate lithography performance, and develop innovative solutions related to EUV lithography, photoresist materials, process optimization, and line width roughness improvements. Responsibilities Design and execute experiments (DOE) to optimize photolithography processes, including EUV lithography, photoresist performance, and patterning improvements. Plan, coordinate, and support semiconductor process experiments in cleanroom environmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of a pathfinding organization focused on developing the technologies that will enable the next generation of memory solutions. Our team brings together engineers, scientists, and innovators working at the forefront of semiconductor research and development to solve sophisticated scaling, performance, and power challenges for future memory products. In this role, you will help develop the future of advanced memory technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization, and reliability teams to transform innovative concepts into silicon and deliver breakthrough memory architectures. Responsibilities: Lead process integration efforts for Advanced DRAM technologies, including charge storage devices, thin-film transistors (TFTs), and related device components Develop and integrate new memory device architectures from concept through silicon implementation and productization Design and implement experiments to evaluate device performance, variability, reliability, and failure mechanisms Partner with cross-f