Process Integration Senior Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities of your team will include, but are not limited to: 1. Contributing to the development of new DRAM, emerging memory products and IP’s by enabling the overall design, layout, and optimization of Memory/Logic/Analog circuits 2. Supporting design validation & verification, reticle experiments and required tape-out revisions 3. Performing verification processes with modeling and simulation using industry standard simulators 4. Contributing to cross group communication to work towards standardization and group success 5. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of product 6. Proactively solicit inputs from Standards, CAD, modeling, Technology Development groups to ensure the design quality and reliability 7. Driving innovation into the future Memory generations within a dynamic work environ

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary As a Senior Member of Technical Staff (SMTS), you are a module‑level CMP technical authority , responsible for defining CMP technical direction, leading FOAK developments, and driving cross‑functional execution across NAND nodes. As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development CMP team driving Advanced NAND and CMP technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS CMP Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced CMP processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will work on state of the art and best in class CMP chambers & own the process roadmap to meet program and yield goals. Main Responsibilities Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, a

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Process Development & Optimization Develop, optimize, and characterize thin film processes (ALD/CVD) to meet performance, reliability, and manufacturability targets. Execute well ‑ designed experiments, analyze data, and translate results into process improvements. Support scaling of cell film processes across nodes and platforms. Module Ownership (Growing Scope) Own defined portions of a process module or sub ‑ module under guidance from senior engineers. Track process margins, key sensitivities, and integration risks. Drive issue resolution for process and tool ‑ related problems within assigned scope. Process Integration & Correlation Work closely with integration and device teams to ensure process compatibility and electrical performance. Correlate material, structural, and electrical data to guide process optimization. Support failure analysis and root ‑ cause investigations for yiel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 2 years of experience M.S.EE degree with 1+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: A senior engineering professional who independently applies advanced knowledge to complete complex assignments, who leads the design and development of complex software code, unit tests and integration tests for a subsystem. MAIN RESPONSIBILITIES • Leads, is accountable for, and serves as the technical subject matter expert for the engineering design and implementation for one or more software features, identifying process issues and recommending corrective measures. • Defines feature evolution, branching, integration and deployment strategy. • Defines structure of the source code files. • Ensures successful integration. • Implements hardware/interface simulation. • Analyzes user needs, product requirements, software requirements and provides input to stakeholders Education Level Major/Field of Study or Equivalent: Bachelors Degree (± 16 years) Experience/Background Minimum 6 years Minimum 6 - 12 Years of experience The base pay for this position is $99,300.00 – $198,700.00 In specific locations, the pay range may vary from the range posted. JOB FAMILY: Product Development DIVISION: ONCO Cancer Diagnostics LOCATION:<

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Senior Engineer supports photolithography process development for advanced memory technologies through hands‑on experimentation, data analysis, and yield improvement activities. This role focuses on execution excellence, disciplined learning, and collaboration, operating under guidance from senior technical leaders. Success in this role requires strong fundamentals in photolithography, analytical rigor, and the ability to translate experimental data into actionable insights. Main Responsibilities Execute photolithography process development, optimization, and troubleshooting tasks in support of yield, quality, and performance targets. Perform DOE, SPC, and statistical analysis to characterize process behavior and identify improvement opportunities. Support material evaluations, defect learning, overlay analysis, and process window characterization. Assist with integration learning during development and early manufacturing ramps. Collaborate with cross‑functional teams including integration, etch, metrology, and yield engineering. Other Responsibilities Document experimental procedures, results, and learnings in technical reports and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a DMTS (Distinguished Member of Technical Staff), you will participate in a groundbreaking Next Generation NAND research and development Dry Etch team moving Advanced NAND and dry etch technology forward. The position provides ample chances for innovation, cooperation, and exploring new scaling methods with Next Generation NAND. A DMTS Dry Etch Engineer is a senior individual contributor and top industry expert who defines, develops, and transfers advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other areas including Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will operate innovative dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Leading advancements in Dry Etch technology and essential module development Act as a technical expert for dry etch process, hardware and applications in NAND technology development at F10, Singapore. Your position encourages delivering broad technical vision, deep domain expertise, and perspective advised by extensive knowledge of dry etch physics/chemistry. Define the equipment roadmap. Work together with suppliers and develop a mechanism-focused logical hardware ro

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a S MTS ( Seni o r Member of Technical Staff) , you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving Advanced NAND and dry etch technology forward . The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND . A SMT S Dry Etch Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP . You will work on state of the art <

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology and amazing people. Today, we're harnessing the boundless possibilities of AI to build the next era of computing. An era in which our GPU acts as the brain of computers, robots, and self-driving cars that can understand the world. Accomplishing unprecedented goals calls for imagination, inventiveness, and exceptional talent from around the world. As a NVIDIAN, you'll be immersed in a diverse, encouraging environment where everyone is inspired to do their best work. Join our team and discover how you can build a lasting impact on the world. NVIDIA's Silicon Co-Design Group (SCG) leads the full product development lifecycle, from early architecture definition through silicon bringup to product release. The ArchDev team is the hub for silicon and system-level feature development, driving tradeoff analysis, system integration, and POR alignment across the entire organization. This is where ideas become chips, and chips become products that define the state of the art — and we're building that future with some of the most motivated engineers in the industry. We're looking for a Senior Memory Systems Engineer to own HBM and LPDDR integration in sophisticated SoCs. This role covers the full stack, including silicon, package, embedded software, testing, and product development. The engineer will resolve the toughest system-level memory challenges throughout the process, building solutions that hold up at scale. What you'll be doing: HBM & LPDDR System Integration and Bringup: Drive HBM and LPDDR system integration, bringup, characterization, and debug for next-generation SoCs — taking memory subsystems through the full arc from first silicon to production-ready at scale. Full-Stack Memory Closure: <s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Front End Central Product Integration, CPIE ( Central Product Integration Engineering) H B M (High Bandwidth Memory ) PI Principal Engineer/ Senior Manager at Micron Technology, Inc, you will be responsible for providing leadership to the global Micron network to drive leading edge HBM Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution , collaborating with Japan, Taiwan, Singapore and US team , driving product maturity within a defined schedule while maintaining the highest standards of quality. Responsibilities and Tasks STRATEGIC LEADERSHIP Work with FAB to drive for best-in

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assi

*Max notice period - 30 Days Technical Skills: Customize and extend Oracle Fusion modules. Experience on development of SaaS extensions using Oracle Visual Builder Cloud Service (VBCS) or Application Composer, Process Cloud Service (PCS) Knowledge on Oracle Financial Modules AP, GL- Familiar with tables, API's and interfaces. Should have expertise in Oracle Fusion Cloud tools such as FBDI, ADFdi, Application Security, Workflows, BPM Workflows, Page Customizations & Extensions, FSR, BI Publisher, OTBI, Alerts etc. Understanding of REST services Understanding on Oracle Cloud Infrastructure, Architecture and Network Topology Understand how to integrate multiple systems with Oracle Fusion using various integration patterns and technologies and OIC Basic skills in Shell scripting Additional knowledge on APEX. Expertise in SQL, PLSQL, Oracle Reports, WEBADI, Oracle Workflow, XML Publisher, and Oracle Application Framework. Expertise in Oracle Forms would be an added advantage Expertise in Github, CICD, Automation Testing would be an added advantage Good debugging skills using above mentioned technical tools. Should have experience in development/support/implementation of CEMLIs. Functional Skills Should have understanding of high-level functionalities of following modules General Ledger Payables Assets Expenses Procurement Soft Skills Able to influence multiple teams on technical considerations, increasing their productivity and effectiveness, by sharing deep knowledge and experience. Self-motivator and self-starter, Ability to own and drive things without supervision and works collaboratively with the teams across the organization.