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About the team OpenAI’s mission is to build safe artificial general intelligence (AGI) which benefits all of humanity. This long-term undertaking brings the world’s best scientists, engineers, and business professionals into one lab together to accomplish this. In pursuit of this mission, our Go To Market (GTM) team is responsible for helping customers learn how to leverage and deploy our highly capable AI products across their business. The team is made of Sales, Solutions, Support, Marketing, and Partnership professionals that work together to create valuable solutions that will help bring AI to as many users as possible. About the role Our Sales team has a unique mission to help customers understand the deep impact that highly capable AI models can bring to their business and users. This role is a mixture of technical understanding, vision, partnership, and value-driven strategy. You’ll be a key driver of opportunities through the entire sales cycle, from pipeline generation to closure. You’ll work with researchers, engineers, and solution strategists to help customers evolve their industry with AI. This role is based in Paris. We use a hybrid work model of 3 days in the office per week. In this role, you'll: Manage ~dozen key accounts, developing and executing strategies for a comprehensive account plan Lead our enterprise prospects’ journeys from consideration to successful deployment Partner with solutions and research engineering to build and execute complex customer programs and projects Own a consumption revenue target Manage consumption revenue forecasts Analyse key account metrics to create reports and provide insights to internal and external stakeholders Closely monitor the industry landscape (people, competitors, partners, etc.) to contribute to product roadmap and other corporate strategies Collaborate with solutions, marketing, communications, business operations, people operations, finance, product management, and engineering Support the recruitment

We take play seriously. We’re looking for curious adventurers ready to find their party, fueled by imagination and drive to build what’s never been built before. At Hasbro and Wizards of the Coast, you’ll collaborate with passionate teams to reimagine our iconic brands and create experiences that spark joy, connection, and community through the magic of play. This is your chance to shape legendary play that lasts a lifetime. We have an opportunity for an Accountant to join our Controllership team where they will play an integral role in our Accounting Organization! The Accountant is responsible for managing and maintaining fixed asset and lease schedules, ensuring the accuracy and updates of long-lived tangible assets master data, performance of account reconciliations, and collaborating with internal partners. The role will also be critical to the timely and accurate execution of close cycle activities, preparing and posting journal entries, and interpreting technical accounting matters related to long-lived tangible assets. A day in the life of a Long Live Tangible Assets Accountant on the Controllership team: • Maintain and update the lease tool with accurate records of lease agreements and track lease renewals, terminations, and modifications • Handle the accounting for the acquisition, capitalization, and depreciation of fixed assets in accordance with technical accounting standards (incl. ASC 350 and ASC 985, etc.) • Update fixed asset master data within SAP • Conduct impairment analyses for fixed assets and prepare fixed assets roll forwards • Perform and review financial close activities and enable timely and accurate completion of close-related tasks • Conduct and assess account reconciliations and collect appropriate supporting documentation • Carry out and assess variance analyses to identify discrepancies and ensure financial integrity • Prepare and post manual journal entries using both Blackline and SAP processes • Enable compliance with

The Best Players Need the Best People. This position is responsible for facilitating the day-to-day operations and evolution of the PGA TOUR’s CRM & integrated technology platforms. In this role, you will collaborate with business units across the TOUR to help them achieve their strategic objectives by customizing our technology platforms to fit business needs, and training end users on best practices. QUALIFICATIONS Bachelor’s degree or equivalent experience in computer science, information systems, business analytics, or related discipline. 5+ years of experience with CRM administration for enterprise customers (applicants with Salesforce certifications are preferred). Strong understanding of CRM business processes and principles including back-end architecture, app integrations, data pipelines, and security policies. Experience with using data visualization tools (Tableau, AWS QuickSight) and SQL to analyze large datasets is a plus. Self-motivated with a high degree of initiative and attention to detail, along with strong analytical, problem-solving, and critical thinking capabilities. Strong interpersonal skills with the ability to work and communicate effectively with non-technical

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related brea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking for motivated individuals to join the NVMQRA team working as a reliability test program Engineer. In this position, you will be responsible for design, develop and maintain NAND reliability test programs. You will be working closely with NAND Product Quality Engineer, Product Engineering and Operation teams to evaluate NAND products in all reliability aspects during new product development phase. Your main responsibilities include: Develop reliability stress and testing methodology for NAND product Develop and maintain NAND product reliability and characterization test programs Working with product reliability engineers to define reliability test flows for individual product Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product Provide test program related support for failure validation and characterization. Contribute to burn-in board design and software development The ideal candidate should have a good mix of understanding Flash memory reliability testing requirements and software background in C&#43;&#43;/Python. Understand of Automate Test Equipment and specifically Ambyx is a plus. You are encouraged to apply if you could demonstrate some of the qualities listed below: <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: In this role, you will lead our Dry Etch, PCVD, Diffusion, Implant - Area Manufacturing Engineering team, responsible to mitigate capacity risks and support our operational commitments. Guiding and developing a high performing team, you will identify and handle systemic issues that support business plan tactics, promote a safety culture and implement improvements to keep development on schedule with program timelines and deliverables. Responsibilities: Lead and coach on performance and develop team members to their highest potential. Identify and address systemic issues impacting equipment manufacturing availability, tool utilization, and cycle time. Drive a culture of safety by requiring and modeling safe behaviors, completing safety training, and conducting audits. Partner with cross-functional teams to build clear and transparent metrics, establish performance targets, and communicate goals to individual contributors. Innovate by researching, crafting, and deploying new operational management techniques and tools. Coordinate Fab-wide long-term business processes and ensure alignment with tactical and strategic operational plans. Minimum Qualifications: Bachelors degree in engineering, operations management, supply chain or related fields. Minimum 3 years of front-end semiconductor manufacturing experience and demonstrated experience in people leadership

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Physical Design team is responsible for implementing advanced High Bandwidth Memory (HBM) SoC and base die designs that enable next-generation AI, high-performance computing, and data center solutions. The team collaborates across architecture, RTL, verification, DFT, and signoff engineering to deliver high-performance, power-efficient silicon while developing innovative design methodologies and automation solutions. As an SoC Physical Design Intern on the HBM team, you will work alongside experienced engineers to support the implementation of advanced HBM SoC designs. You will gain hands-on experience with physical design methodologies, timing analysis, signoff flows, and automation while contributing to the development of next-generation memory products that power AI and high-performance computing applications. Responsibilities Support the physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization activities. Analyze timing, power, area, congestion, and physical verification results to find opportunities for design improvement and optimization. Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners. Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions. Collaborate with multi-functional engineering teams to document r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology Node Development team is responsible for bringing next-generation DRAM products from concept to production by improving yield, validating new features, and driving product quality. The team collaborates across design, process integration, manufacturing, and test engineering to solve complex technical challenges and deliver innovative memory solutions that power the future of computing. As a Product Engineer Intern in the DRAM Technology Node Development group, you will work alongside experienced engineers to support the development of next-generation DRAM products. You will gain hands-on experience in product characterization, test development, yield analysis, and design validation while applying analytical and problem-solving skills to real-world engineering challenges. Responsibilities Support new DRAM product development through electrical characterization, test development, circuit analysis, and design validation activities. Analyze product, test, and yield data to identify performance issues and drive continuous improvement initiatives. Collaborate with process, design, manufacturing, and test engineering teams to investigate and resolve product and process-related issues. Develop and improve test methodologies, automation scripts, and data analysis tools to enhance product quality and testing efficiency. Apply engineering tools, statistical analysis techniques, and AI-enabled technologies to support product c