Semiconductor Equipment Applications Eng Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global Defense Line (DL) matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment for DL signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modelling. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary The TD Electrical Device Characterization team at Micron is where deep device physics meets real product impact. We work at the groundbreaking edge of DRAM and emerging memory technologies, partnering closely across build, process, and systems teams to develop what ships next. If you enjoy turning complex measurements into insight and influence, this is a place to do your best work. In this role, you will lead electrical characterization for advanced memory devices, driving new methods from early development through production. You will combine hands-on experimentation, data-driven analysis, and technical leadership to connect device behavior to reliability, performance, and product outcomes. This position offers strong ownership, visibility, and the opportunity to mentor others while pushing technology forward. Responsibilities: Lead electrical characterization of advanced DRAM and emerging memory devices Develop and scale characterization methodologies, models, and standards Design and automate test flows, data pipelines, and analysis tools Investigate device behavior, reliability mechanisms, and root causes Collaborate across functions and present technical findings with clarity Minimum Qualifications: MS or PhD or equivalent experience in Electrical Engineering or related field Strong foundation in semiconductor device phys

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience or know-how in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modellin

Join NVIDIA's outstanding team and contribute to our legacy of innovation in the Senior Product Quality role! At NVIDIA, we are dedicated to pushing the boundaries of pioneering technology. The Senior Product Quality Engineer will provide leadership and management for the Networking system product quality within the organization. Establish, maintain, and optimize an effective quality management methods and target to achieve high quality performance. As part of our team, you will work on networking IC products and ensure their readiness for production stage. Leading and mentoring root cause analysis for issues related to design, manufacturing or customers. Enhance and improve products performance by proactive risk assessment and other prevention methods. This is an outstanding opportunity to be part of a company that is crafting the future of AI and computing. What You'll Be Doing Integrated Circuits (IC) quality manager will coordinate and lead the quality function and sustain the quality philosophy for the organization. Establish, maintain and optimize an effective quality management system. Build and implement a quality plan to achieve the levels of quality established through organizational goals, customer expectations, and related partners. Improve products by working towards problem-solving tools, prevention methods, quality-at-the-source and continual improvement techniques. Maintain and improve product build development, verification and validation processes, to allow high quality of interconnects and systems products throughout the entire product life cycle. What We Need to See Bachelor’s degree or master’s degree or equivalent experience in electrical engineering or material science. Other technical degrees will be considered Experience: 5&#43; years preferred in leadership and manufacturing Knowledge in semiconductor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 擔任 Hook-up 專案技術領導者&#xff0c;整合設計、施工、品質與營運需求&#xff0c;確保機台導入及量產所需公用系統按時交付 主要職責 負責半導體廠房機台 Hook-up&#xff08;二次配&#xff09;工程規劃、執行與進度管理。 統籌機台 Move-in、Pre Hook-up、Hook-up、Turn-on 等各階段工作。 協調廠務&#xff08;FAC&#xff09;、設備&#xff08;ME&#xff09;、工務&#xff08;Construction&#xff09;、IE、EHS 及承攬商等跨部門作業。 審查 Hook-up 設計圖面、BIM 模型及施工方案&#xff0c;確保符合安全、品質及產能需求。 管理施工進度、施工品質、成本及風險議題&#xff0c;確保關鍵里程碑達成。 主導現場施工問題排除、介面整合及資源協調。 推動 QA/QC 驗證、測試驗收及系統交付作業。 建立並持續優化 Hook-up 標準流程、施工規範及教育訓練制度。 人工智慧與數位化能力 - 具備運用人工智慧工具、數據分析和數位技術提升專案規劃、工程執行、風險管理和營運效率的能力。 - 具備應用人工智慧輔助解決方案進行設計審查、專案控制、工作流程自動化、知識管理和持續改進的經驗。 - 致力於推動數位轉型&#xff0c;並促進工程和施工團隊採用創新技術。 Hook-up Senior Engineer / Technical Lead Position Summary Serve as the technical lead for Hook-up projects, integrating design, construction, quality, and operational requirements to ensure the timely delivery of utility systems required for tool installation and volume manufacturing. Key Responsibilities Lead the planning, execution, and schedule management of semiconductor fab Hook-up (secondary distribution) projects. Coordinate all phases of tool installation, including Move-in, Pre-Hook-up, Hook-up, and Turn-on activities. Collaborate closely with Facilities (FAC), Manufacturing Engineering (ME), Construction, Industrial Engineering (IE), Environmental Health & Safety (EHS), and contractors to ensure seamless project execution. Rev

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Yield Enhancement Engineer of Micron, you will be responsible to define and communicate the issues in processing and designing which should be completed under the situation of limited wafer yield with a fast turnaround and accurate way. Through daily analysis of inline/param/probe/experiments data, achieve the best in class yield ramp as well as quality improvement. Main Responsibilities: Demonstrates thorough understanding of yield data analysis, Wafer Fabrication (Fab) processes and their common effects/signatures on yield/device. Use knowledge of semiconductor device physics, electronics and semiconductor manufacturing process to explain and resolve yield issues using various statistical/data analysis tools. Communicates the process/tool related yield toggles to the Fab process areas and support them in fixing the process/tool. Should have excellent interaction with other internal Yield Enhancement (YE) groups and work to understand their constraints. Create/participate in multi-area focus teams to solve sophisticated yield problems. Publishes a clear Pareto of yield limiters on their specific part type. Excellent verbal and written communi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is building the next generation of AI and RISC-V compute. As a Sr. Staff NPI Global Supply Planner, you will own end-to-end demand, materials, and production planning across our AI hardware product lines, including Blackhole, Galaxy, and future platforms. You will translate engineering release schedules, BOM structures, and production forecasts into executable supply and capacity plans with our contract manufacturers, while keeping planning data accurate and reliable across ERP and PLM systems. This role is hybrid, based out of Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A strategic, detail-oriented supply chain planner who can turn engineering and program ambiguity into clear, executable plans. Experienced in NPI planning within semiconductor, AI hardware, or high-tech manufacturing environments. Comfortable working across BOM structures, engineering change processes, ERP and PLM systems, and system-of-record data. A clear, collaborative communicator who can align engineering, operations, planning teams, and contract manufacturers. What We Need Lead end-to-end materials and production planning across NPI r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Full Stack Software Development Engineer at Micron, you will be part of the AI Platform Solutions Group (AIPS) within TPG, where you will design and deliver next-generation, AI-native applications that accelerates the capability for engineering teams we support to innovate. In this role, you will focus on building intelligent, scalable systems that integrate advanced AI capabilities—including large language models, retrieval-augmented systems, and agentic workflow orchestration—directly into engineering-critical applications and workflows. You will partner with multi-functional team members to translate complex business challenges into adaptive, high-performance solutions that employ autonomous agents, contextual reasoning, and workflow automation to drive decision-making and productivity. While your primary focus will be within AI Platform Solutions and TPG, the platforms and solutions you build will be architected for reuse and scale, enabling enterprise-wide impact across Micron’s global operations. We require a minimum of seven years of software engineering experience involving medium- to high-complexity design and implementation. Having experience in the semiconductor industry is advantageous. Responsibilities Design, develop, and maintain full-stack applications across front-end, API, and backend layers. Translate business and functional requirements into scalable, secure, and maintainable technical solutions. Own the end-to-end software development lifecycle, including design, dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Full Stack Software Development Engineer at Micron, you will be part of the AI Platform Solutions Group (AIPS) within TPG, where you will design and deliver next-generation, AI-native applications that accelerates the capability for engineering teams we support to innovate. In this role, you will focus on building intelligent, scalable systems that integrate advanced AI capabilities—including large language models, retrieval-augmented systems, and agentic workflow orchestration—directly into engineering-critical applications and workflows. You will partner with multi-functional team members to translate complex business challenges into adaptive, high-performance solutions that employ autonomous agents, contextual reasoning, and workflow automation to drive decision-making and productivity. While your primary focus will be within AI Platform Solutions and TPG, the platforms and solutions you build will be architected for reuse and scale, enabling enterprise-wide impact across Micron’s global operations. We require a minimum of seven years of software engineering experience involving medium- to high-complexity design and implementation. Having experience in the semiconductor industry is advantageous. Responsibilities Design, develop, and maintain full-stack applications across front-end, API, and backend layers. Translate business and functional requirements into scalable, secure, and maintainable technical solutions. Own the end-to-end software development lifecycle, including design, dev

About the Team OpenAI's Industrial Compute organization is building the world's most advanced AI infrastructure ecosystem. In partnership with leading cloud providers, hardware manufacturers, utilities, construction partners, and internal engineering organizations, we are delivering hyperscale AI campuses that power the next generation of frontier AI models. Infrastructure Delivery Operations sits at the center of this effort. The team ensures that large, highly complex infrastructure programs execute predictably across planning, design, construction, hardware deployment, commissioning, and operational handoff. We partner across Hardware Engineering, Network Engineering, Capacity Delivery, Hardware Operations, Security, Finance, Supply Chain, and our external infrastructure partners to keep programs aligned, risks visible, and execution moving at Industrial Compute speed. About the Role We are seeking a Technical Program Manager, Infrastructure Delivery Operations to drive execution across large-scale AI infrastructure deployments. This role is responsible for orchestrating cross-functional delivery programs spanning multiple organizations, ensuring dependencies remain synchronized from early planning through production readiness. You will develop operational mechanisms that allow Industrial Compute to scale infrastructure delivery across multiple campuses simultaneously. Rather than owning any individual engineering discipline, you will own program health—bringing together engineering, construction, operations, supply chain, and partner organizations into a single coordinated execution model. Success in this role requires exceptional program management, executive communication, systems thinking, and operational rigor. You should be comfortable operating amid ambiguity while bringing structure to highly technical, multi-year infrastructure programs. Candidates should have experience leading complex infrastructure, cloud, data center, semiconductor, networking, manuf

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: We are looking for a skilled and detail-oriented Quality Engineer – MEP to ensure the highest standards of quality and compliance in mechanical, electrical, and plumbing systems across industrial and cleanroom construction projects. The ideal candidate will have extensive hands-on experience in CS/MS/SS piping works, clean process gas and ultra-pure water piping, ducting, firefighting, and underground utility systems, along with a deep understanding of QA/QC procedures, welding standards, and international codes (ASME, IS, ASTM). This role demands a strong foundation in P&ID and PFD interpretation, cleanroom construction quality checks, and MEP systems validation, particularly within Semiconductor, Pharmaceutical, or High-Tech Manufacturing environments. Key Responsibilities: • Implement and monitor Quality Assurance and Quality Control (QA/QC) systems for all Mechanical, Electrical, and Plumbing (MEP) works. • Conduct inspection and quality verification for carbon steel (CS), mild steel (MS), and stainless steel (SS) piping systems including welding, fit-up, and joint integrity. • Supervise and validate quality of clean process gas and ultra-pure water (UPW) piping systems, ensuring compliance with cleanliness and fabrication standards. • Perform orbital welding quality checks, review weld logs, and ensure compliance with approved WPS, PQR, and WPQ documentation. • Review and monitor installation of ducting, firefighting networks, DICL underground pipi

About Anthropic Anthropic’s mission is to create reliable, interpretable, and steerable AI systems. We want AI to be safe and beneficial for our users and for society as a whole. Our team is a quickly growing group of committed researchers, engineers, policy experts, and business leaders working together to build beneficial AI systems. About the role We are seeking a Machines FP&A lead to own financial planning for the chips and accelerators that run our models. You will own the hardware forecast and budget, keep leadership's view of machine spend current, and be the single finance point of contact for machines into Accounting and consolidated FP&A. In this role, you will be a key partner to our capacity planning and hardware teams, and work day to day with the Compute deal team, Accounting, and the consolidated FP&A team. Key responsibilities Own the hardware forecast: delivery volumes, lease and financing expense, and cash flows Run budget vs. actuals for machine spend: one view of what the fleet costs and why it moved Serve as the single point of contact for machines in forecast and close cycles with Accounting and consolidated FP&A Coordinate forecast inputs with Capacity Planning and the Compute deal team Track spend and cash-flow phasing against multi-year hardware commitments Partner with Accounting on the treatment of leases and related agreements Support chip and accelerator economics analyses led by the Machines finance team Build the reporting that keeps leadership's machine spend picture current Minimum qualifications Owned a forecast or budget end to end at a hardware, semiconductor, hyperscaler, or infrastructure-heavy business Strong driver-based modeling skills and budget-vs-actual / variance discipline Comfort partnering closely with engineering and commercial teams under deal-timeline pressure Passion for Anthropic's mission to build safe, transformative AI systems Preferred qualifications 7+ years in FP&A, strategic finance, or

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Lead and develop teams responsible for customer integration, technical engagement, and system engineering. Drive customer technical interlocks, design reviews, escalations, and integration activities. Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions. Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement. Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification. Drive resolution of complex technical issues while influencing future product and technology roadmaps. Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges. Qualifications BS/MS in Electrical Engineering, Computer Engineering, or related field. 10&#43; years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification. <l