Semiconductor Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Expansion Program Integration & Readiness Engineer, you will build the future of Micron's global manufacturing by enabling the flawless delivery of strategic semiconductor expansion programs. This role uniquely positions you to bring diverse teams together, transforming ideas into operational capabilities that drive Micron's success! You will engage from early concept planning through factory startup and production ramp, influencing critical decisions to ensure that business objectives are achieved safely, efficiently, and predictably. You will collaborate with partners across Manufacturing, Facilities, Construction, Engineering, Supply Chain, Procurement, Finance, and Quality to solve complex challenges, drive continuous improvement, and build lasting business impact. This is an opportunity for a motivated leader who enjoys working across organizations, building positive relationships, and helping teams achieve ambitious goals. Responsibilities In your role as an Expansion Program Integration & Readiness Engineer, you will: Lead strategic expansion and readiness programs that enable future manufacturing growth. Partner with teams across the organization to deliver business-critical achievements and operational readiness objectives. Drive coordinated planning, risk management, issue resolution, and decision-making processes. Build alignment across multiple organizations while encouraging collaboration, tra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Expansion Program Integration & Readiness Engineer, you will build the future of Micron's global manufacturing by enabling the flawless delivery of strategic semiconductor expansion programs. This role uniquely positions you to bring diverse teams together, transforming ideas into operational capabilities that drive Micron's success! You will engage from early concept planning through factory startup and production ramp, influencing critical decisions to ensure that business objectives are achieved safely, efficiently, and predictably. You will collaborate with partners across Manufacturing, Facilities, Construction, Engineering, Supply Chain, Procurement, Finance, and Quality to solve complex challenges, drive continuous improvement, and build lasting business impact. This is an opportunity for a motivated leader who enjoys working across organizations, building positive relationships, and helping teams achieve ambitious goals. Responsibilities In your role as an Expansion Program Integration & Readiness Engineer, you will: Lead strategic expansion and readiness programs that enable future manufacturing growth. Partner with teams across the organization to deliver business-critical achievements and operational readiness objectives. Drive coordinated planning, risk management, issue resolution, and decision-making processes. Build alignment across multiple organizations while encouraging collaboration, tra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Engineer is responsible for leveraging area knowledge to optimize area performance and reduce cycle time. A Manufacturing Engineer collaborates with PD, ATE, PEE, ME and IE teams to expedite product movement and reacts to process issues that could impact quality. Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Job Details: Job Description: The Role As a Cloud Application Development Engineer within Intel Manufacturing Foundry Cloud Services (imFCS) , you will design, develop, deploy, and support cloud-native applications that power semiconductor manufacturing, engineering automation, and AI-driven factory operations. You will build scalable, secure, and resilient platforms that improve engineering productivity, enable advanced analytics, and accelerate Intel Foundry's digital transformation. Key Responsibilities Develop and maintain cloud-native applications and services supporting manufacturing and engineering workflows. Support 24x7 manufacturing operations through on-call rotations, incident response, and root-cause analysis. Design and implement scalable microservices, APIs, and containerization systems utilizing Kubernetes orchestrator and cloud native applications. Architect secure cloud solutions spanning application, data, networking, identity, and observability domains. Build and maintain CI/CD pipelines, Infrastructure-as-Code, and DevOps automation. Provide technical leadership for contractor and partner development teams across multiple geographic regions, driving architecture, implementation, and operational excellence for cloud-native solutions. Collaborate with manufacturing, engineering, and software teams to deliv

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us. As an SMTS / DMTS – Wet Etch, you'll provide technical leadership for strategic process technology pathfinding initiatives that compose Micron's future NAND roadmap. Your mission: drive exciting wet process and chemistry breakthroughs, define long-range technology direction, and build positive relationships with internal and external partners to support next-generation memory solutions. This position is for a recognized technical leader who thrives on transforming emerging science, novel materials, and radical process technologies into advantages for future NAND generations. Main Responsibilities: Guide wet process and chemistry exploration for upcoming NAND technologies. Develop and evaluate advanced wet etch, clean, and surface modification solutions.</spa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MRDA Defect Insight Engineering Scope : Data Analytics Yield correlation analysis Spatial signature analysis Defect density monitoring Process-health dashboards AI/ML model deployment with Agentic AI Predictive excursion detection Defect Management Defect inspection strategy development Inline defect monitoring Defect pareto analysis Defect source identification Yield detractor elimination Killer defect reduction Job requirements Bachelor's or Master's degree in Engineering or related discipline 0–2 years of experience in semiconductor manufacturing or engineering Basic knowledge of ASSY defect analysis for yield improvement Basic knowledge of SPC,FDC or data analysis tools, ie JMP...etc Utilizes baseline digital and AI capabilities appropriate to the role to responsibly leverage AI technologies for research, analytical insights, content generation, process improvement, problem resolution, and the achievement of business objectives. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering organization is dedicated to creating world‑class memory and storage solutions through sophisticated digital and analog circuit innovation. Our teams span the globe and collaborate across technology development, product design, systems architecture, and validation to deliver industry‑leading semiconductor products. The Principal Design Engineer plays a key role in developing, analyzing, and optimizing circuit designs that power Micron’s next‑generation memory technologies. This role partners closely with diverse teams—including Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing—to ensure best‑in‑class performance, quality, cost efficiency, and time‑to‑market. Responsibilities: Design and optimize memory circuits from gate‑level to full chip implementations. Lead development of schematic blocks such as memory arrays, control logic, address decode, datapath, and internal test logic. Perform advanced circuit simulations using industry tools (e.g., SPICE, VERILOG) to validate performance. Drive architectural decisions related to power, speed, die area, and overall circuit performance. Collaborate with technology development and business units to define design rules, device requirements, and validation strategies. Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related technical field (or equivalent practical experience). Experience in se

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our dynamic and innovative Team at Micron site in Vimercate, Italy! Department intro: Process and Device Technology Development (PDTD) is a core R&D organization within Micron’s Technology Development group responsible for developing the next generation of semiconductor memory technologies. The team drives innovation in process integration, device architecture, materials, characterization, modeling, and reliability for NAND products. Working closely with design, manufacturing, product engineering, and research partners, PDTD enables the technologies that become Micron’s future memory products. Position overview The mission of a device engineer working in Process and Device Technology Development team at Micron Technology Inc. is analyzing, modeling and improving the device electrical characteristics for the next generation NAND technologies in order to meet the performance and reliability specs required for NAND products within project timelines. Responsibilities: Contribute to device characterization and modeling for next generation NAND technologies. Define and execute new test flows to measure critical array electrical characteristics and define automatic electrical monitors for volume production. Understand NAND ce