Semiconductor Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Electrical Failure Analysis Engineer is responsible for performing fault isolation and failure analysis on advanced semiconductor devices to identify root causes and support product quality, reliability, and yield improvement. This role utilizes specialized diagnostic tools, semiconductor design knowledge, and failure analysis methodologies to investigate electrical and physical failures, interpret results, generate technical reports, and collaborate with cross-functional engineering teams. Success in this role requires strong analytical and problem-solving skills, a strong understanding of semiconductor devices and fabrication processes, effective communication abilities, and the ability to thrive in a collaborative, fast-paced environment. Main Responsibilities Perform Electrical Failure Analysis (EFA) and Fault Isolation Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and other photon, thermal, or laser stimulating emission tools Characterize or model Probe test and internal qualification fail signatures Extensive understanding of physical and logical semi-conductor design Use layout/schematic to aid in fault isolation and fail signature modeling

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

*]:pointer-events-auto R6Vx5W_threadScrollVars scroll-mb-[calc(var(--scroll-root-safe-area-inset-bottom,0px)+var(--thread-response-height))] scroll-mt-[calc(var(--header-height)+min(200px,max(70px,20svh)))]" data-turn-id="request-WEB:a419a55f-0d1b-45d2-af2c-2d0a455b61d5-6" data-turn-id-container="request-WEB:a419a55f-0d1b-45d2-af2c-2d0a455b61d5-6" data-testid="conversation-turn-14" data-turn="assistant"> About the job Build the product engineering capability that protects yield, quality and cost at manufacturing scale. As Director of Product Engineering, you will lead how Graphcore products move through launch and high volume production. You will recruit and develop a team focused on semiconductor and PCBA manufacturing performance. Your work will shape yield, quality and cost across chip manufacturing, test, PCBA and system level production. You will give teams the data, standards and direction needed to solve hard production problems. You will work with OSATs, test engineering, manufacturing, quality, data engineering and analytics teams. You will define best practice for data collection, correlation, dashboards and self-service manufacturing insight. This role suits a leader who combines technical depth with team building. You will set the standard for product engineering across Graphcore’s manufacturing lifecycle. The team and culture You will join the Product Test and Diagnosis team within Manufacturing Operations. The team spans Bristol, Cambridge, India, the US and Taiwan. Work happens through clear technical ownership, fast issue resolution and strong links to manufacturing partners. You will lead by setting direction, removing ambiguity and building capability across locations. Decisions are grounded in production data, engineering judgement and accountability for outcomes. The team values leaders who think big, act fast and speak up when quality or yield needs action. What we're looking for · Extensive semiconductor product engineering, test engineering or

Job Details: Job Description: The Role and Impact As a SoC Design Verification Engineer, you will play a pivotal role in ensuring that Intel's complex System-on-Chip (SoC) designs meet functional specifications and deliver high-quality performance. You will design scalable and reusable verification plans, develop test environments, and execute tests to uncover issues and improve functionality. Your contributions will directly enhance Intel's product quality and ensure optimal performance in presilicon development. Business Group You will be joining Intel's cutting-edge product development group, a team focused on designing and verifying advanced semiconductor solutions. This group is at the forefront of innovation, delivering high-quality, scalable products that drive Intel's leadership in technology and performance. By contributing your skills here, you will help shape the future of computing and enable groundbreaking advancements in the industry. Key Responsibilities - Define and develop scalable and reusable block, subsystem, and SoC verification plans. - Create test benches and verification environments that align with microarchitecture specifications. - Execute verification plans, including emulation and system simulation models, to ensure design functionality and uncover bugs. - Debug and root cause issues in presilicon environments, implementing corrective measures to address failures. - Collaborate with architects, RTL developers, postsilicon teams, and physical design teams to improve verification of complex architectural features. - Document and maintain test plans, driving technical reviews with design and architecture teams. - Integrate security coverage activities within test plans, including regression and debug tests. - Maintain and improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: The ID1 Facilities Electrical team supports the safe, reliable, and compliant operation of electrical systems critical to high-volume semiconductor manufacturing. The team coordinates maintenance, repairs, installations, documentation, and service-provider activities that support dependable site operations. The Facilities Electrical Coordinator plans, schedules, and tracks electrical maintenance and project activities across facilities operations. This role coordinates technicians, contractors, vendors, materials, documentation, and site partners to help ensure work is prepared, communicated, and completed safely with minimal impact to operations. Responsibilities Coordinate schedules, priorities, resources, and site access for electrical maintenance, repairs, installations, and minor system modifications. Serve as a primary coordination point for technicians, contractors, vendors, operations, engineering, and other business partners. Confirm work packages, permits, materials, documentation, and required support are ready before scheduled execution. Track work status, action items, service requests, documentation, and completion requirements. Coordinate outsourced electrical services and verify vendor activities align with safety, LOTO, quality, and operational requirements. Identify scheduling conflicts, coordination gaps, and execution risks; escalate issues and support timely resolution. Support asset information, maintenance records, reporting,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Expansion Construction team is driving some of the most significant semiconductor manufacturing projects in the United States, including two high-volume manufacturing facilities in Boise, Idaho (ID1 and ID2) and a greenfield manufacturing facility in Clay, New York. Our team partners across engineering, construction, commissioning, and operations to deliver world-class facilities that support the future of technology and innovation. As the ID Quality Assurance Lead, you will be a key member of the US Expansion Strategic Programs team, reporting to the ID Sr. Commissioning Manager. In this highly visible role, you will lead quality governance across major capital projects, ensuring compliance, commissioning readiness, documentation integrity, and operational turnover excellence. You will serve as the primary owner-side quality leader, collaborating with contractors, vendors, inspection agencies, operations teams, and regulatory stakeholders to deliver successful project outcomes. Responsibilities: Lead quality governance, performance metrics, audit programs, reporting, and continuous improvement initiatives across Idaho capital projects Oversee contractor and vendor quality execution, including quality plans, inspections, testing, material verification, hold points, and compliance with project requirements Manage special inspection programs, testing agency coordination, regulatory interfaces, and turnover-ready quality documentation Align construction quality activities with co

Altana is the network for trusted trade. Our AI-powered product network empowers governments and businesses to build a more resilient and secure global economy while keeping trade flowing. The Opportunity The rules of global trade are being rewritten in real time. Supply chain transparency requirements are being rewritten; Forced labor enforcement, semiconductor export controls, tariff volatility, secure procurement for defense, allied coordination on economic security all require a new paradigm. Governments around the world are being asked to do something they've never been equipped to do: understand, monitor, and act on the full depth of global commerce, not just the edge of it. To do so they need a deep understanding of the entire production history and to collaborate with the private sector in new ways to ensure compliant trade is facilitated, while questionable activity is identified. The tools haven't kept pace with the mandate. Customs agencies still orient around transactions and rely on paper-based trusted trader audits, defense resilience was built for a different era of acquisition and slower innovation, and agencies don’t have the tooling nor data to do fact based policy research. The result is a widening gap between what governments need to know and what they can actually see — a gap that bad actors exploit, that allies can't easily close together, and that legitimate traders pay for in delays, uncertainty, and compliance overhead. Altana exists to close that gap. As Director of Product Management for Public Sector , you will lead the team defining how governments harness the power of the Altana network — not just to enforce at the border, but to understand the full complexity of global supply chains, collaborate with allies, and shape the trade policy and economic security decisions that will define the next era of globalization. You’ll oversee our three public sector product areas, and coordinate across the broader Altana organizatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Job Details: Job Description: The Role As a Cloud Application Development Engineer within Intel Manufacturing Foundry Cloud Services (imFCS) , you will design, develop, deploy, and support cloud-native applications that power semiconductor manufacturing, engineering automation, and AI-driven factory operations. You will build scalable, secure, and resilient platforms that improve engineering productivity, enable advanced analytics, and accelerate Intel Foundry's digital transformation. Key Responsibilities Develop and maintain cloud-native applications and services supporting manufacturing and engineering workflows. Support 24x7 manufacturing operations through on-call rotations, incident response, and root-cause analysis. Design and implement scalable microservices, APIs, and containerization systems utilizing Kubernetes orchestrator and cloud native applications. Architect secure cloud solutions spanning application, data, networking, identity, and observability domains. Build and maintain CI/CD pipelines, Infrastructure-as-Code, and DevOps automation. Provide technical leadership for contractor and partner development teams across multiple geographic regions, driving architecture, implementation, and operational excellence for cloud-native solutions. Collaborate with manufacturing, engineering, and software teams to deliv

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us. As an SMTS / DMTS – Wet Etch, you'll provide technical leadership for strategic process technology pathfinding initiatives that compose Micron's future NAND roadmap. Your mission: drive exciting wet process and chemistry breakthroughs, define long-range technology direction, and build positive relationships with internal and external partners to support next-generation memory solutions. This position is for a recognized technical leader who thrives on transforming emerging science, novel materials, and radical process technologies into advantages for future NAND generations. Main Responsibilities: Guide wet process and chemistry exploration for upcoming NAND technologies. Develop and evaluate advanced wet etch, clean, and surface modification solutions.</spa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and