Semiconductor Principal Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: The ID1 Facilities Electrical team supports the safe, reliable, and compliant operation of electrical systems critical to high-volume semiconductor manufacturing. The team coordinates maintenance, repairs, installations, documentation, and service-provider activities that support dependable site operations. The Facilities Electrical Coordinator plans, schedules, and tracks electrical maintenance and project activities across facilities operations. This role coordinates technicians, contractors, vendors, materials, documentation, and site partners to help ensure work is prepared, communicated, and completed safely with minimal impact to operations. Responsibilities Coordinate schedules, priorities, resources, and site access for electrical maintenance, repairs, installations, and minor system modifications. Serve as a primary coordination point for technicians, contractors, vendors, operations, engineering, and other business partners. Confirm work packages, permits, materials, documentation, and required support are ready before scheduled execution. Track work status, action items, service requests, documentation, and completion requirements. Coordinate outsourced electrical services and verify vendor activities align with safety, LOTO, quality, and operational requirements. Identify scheduling conflicts, coordination gaps, and execution risks; escalate issues and support timely resolution. Support asset information, maintenance records, reporting,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Expansion Construction team is driving some of the most significant semiconductor manufacturing projects in the United States, including two high-volume manufacturing facilities in Boise, Idaho (ID1 and ID2) and a greenfield manufacturing facility in Clay, New York. Our team partners across engineering, construction, commissioning, and operations to deliver world-class facilities that support the future of technology and innovation. As the ID Quality Assurance Lead, you will be a key member of the US Expansion Strategic Programs team, reporting to the ID Sr. Commissioning Manager. In this highly visible role, you will lead quality governance across major capital projects, ensuring compliance, commissioning readiness, documentation integrity, and operational turnover excellence. You will serve as the primary owner-side quality leader, collaborating with contractors, vendors, inspection agencies, operations teams, and regulatory stakeholders to deliver successful project outcomes. Responsibilities: Lead quality governance, performance metrics, audit programs, reporting, and continuous improvement initiatives across Idaho capital projects Oversee contractor and vendor quality execution, including quality plans, inspections, testing, material verification, hold points, and compliance with project requirements Manage special inspection programs, testing agency coordination, regulatory interfaces, and turnover-ready quality documentation Align construction quality activities with co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Job Details: Job Description: Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting-edge semiconductor technologies. Business group As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers. Key Responsibilities Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology. Perform pathfinding activities to enable emerging device architectures and support process and hardware development. Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation. Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs. Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output. Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation. Behavioral Traits Strong p

Job Details: Job Description: The Role As a Cloud Application Development Engineer within Intel Manufacturing Foundry Cloud Services (imFCS) , you will design, develop, deploy, and support cloud-native applications that power semiconductor manufacturing, engineering automation, and AI-driven factory operations. You will build scalable, secure, and resilient platforms that improve engineering productivity, enable advanced analytics, and accelerate Intel Foundry's digital transformation. Key Responsibilities Develop and maintain cloud-native applications and services supporting manufacturing and engineering workflows. Support 24x7 manufacturing operations through on-call rotations, incident response, and root-cause analysis. Design and implement scalable microservices, APIs, and containerization systems utilizing Kubernetes orchestrator and cloud native applications. Architect secure cloud solutions spanning application, data, networking, identity, and observability domains. Build and maintain CI/CD pipelines, Infrastructure-as-Code, and DevOps automation. Provide technical leadership for contractor and partner development teams across multiple geographic regions, driving architecture, implementation, and operational excellence for cloud-native solutions. Collaborate with manufacturing, engineering, and software teams to deliv

Job Details: Job Description: The Role and Impact As a SoC Design Verification Engineer, you will play a pivotal role in ensuring that Intel's complex System-on-Chip (SoC) designs meet functional specifications and deliver high-quality performance. You will design scalable and reusable verification plans, develop test environments, and execute tests to uncover issues and improve functionality. Your contributions will directly enhance Intel's product quality and ensure optimal performance in presilicon development. Business Group You will be joining Intel's cutting-edge product development group, a team focused on designing and verifying advanced semiconductor solutions. This group is at the forefront of innovation, delivering high-quality, scalable products that drive Intel's leadership in technology and performance. By contributing your skills here, you will help shape the future of computing and enable groundbreaking advancements in the industry. Key Responsibilities - Define and develop scalable and reusable block, subsystem, and SoC verification plans. - Create test benches and verification environments that align with microarchitecture specifications. - Execute verification plans, including emulation and system simulation models, to ensure design functionality and uncover bugs. - Debug and root cause issues in presilicon environments, implementing corrective measures to address failures. - Collaborate with architects, RTL developers, postsilicon teams, and physical design teams to improve verification of complex architectural features. - Document and maintain test plans, driving technical reviews with design and architecture teams. - Integrate security coverage activities within test plans, including regression and debug tests. - Maintain and improve

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As an IMO Module Development Engineer, the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop and implement process integration strategies to achieve flawlessly operational semiconductor devices. Work together with diverse groups to identify the most effective methods for incorporating new technologies into current workflows. Conduct data analysis to optimize performance and yield, ensuring world-class quality standards are met. Troubleshoot and resolve process-related issues, applying your proven expertise to maintain high efficiency and reliability. Promote continuous progress projects to compete against and outperform industry norms. Actively apply AI tools to improve work efficiency and productivity. Minimum Qualifications: Master's degree or equivalent experience in Electrical Engineering, Chemical Engineering, Materials Science, or a related field. Proven experience in semiconductor process integration and development. Strong analytical and problem-solving skills. Ability to work well with diverse functional groups. Proficiency in data analysis and statistical process control. Preferred Qualifications: Master's degree or higher in a relevant field, or equivalent experience. Experience with AI tools and their application in semiconductor processes. Familiarity with advanced semiconductor materials and device physics. Proven a