Semiconductor Principal Design Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

Job Details: Job Description: The Role and Impact As a Development Tools Software Engineer, you will play a vital role in creating and optimizing cutting-edge software tools that support diverse engineering domains such as design, manufacturing, validation, silicon production, systems integration, and ecosystem enabling. On a day-to-day basis, you'll design, develop, debug, and validate algorithms, tools, and systems that empower internal and external engineering teams to deliver impactful products. Your contributions will directly enable the seamless integration of Intel silicon and software into innovative solutions, driving progress across industries. Business group You will join Intel Corporation, a leading global technology company dedicated to advancing semiconductor innovation and creating solutions that enrich the lives of people worldwide. The team focuses on developing robust software tools and methodologies that support Intel's engineering ecosystem, fostering excellence and driving high-quality results. This group plays a critical role in enabling Intel's broader mission of building world-class technologies and products that power the future of the digital world. Key Responsibilities - Design and implement software tools using modern software development methodologies and programming languages. - Debug, validate, and optimize algorithms and software systems for engineering applications, ensuring high performance and reliability. - Collaborate with cross-functional teams to create solutions that enable seamless integration of Intel silicon and software into impactful products. - Utilize secure coding practices to ensure the robustness and security of software tools across various engineering domains. - Continuously explore innovative solutions to enhance design, manufacturing, validation, and testing processes. <p st

Job Details: Job Description: The Role and Impact We are seeking a Module Engineer to play a pivotal role in advancing Intel's high-volume manufacturing capabilities. In this position, you will oversee critical equipment and processes that enable the production of cutting-edge integrated circuits, driving innovation in device miniaturization and semiconductor excellence. Your expertise will directly impact production efficiency, quality, and yield, ensuring Intel maintains its leadership in the semiconductor industry. Business Group Join Intel Corporation's Engineering team, which is dedicated to enabling the rapid advancements of semiconductor manufacturing technologies. This group supports Intel's broader mission of delivering world-class technology solutions by optimizing manufacturing processes, ensuring high-quality outputs, and transferring technology globally. As part of this team, you will collaborate across regions to shape the future of semiconductor innovation. Key Responsibilities - Operate and optimize high-volume manufacturing equipment and processes to maintain control over critical dimensions and defectivity. - Conduct tests and measurements to evaluate equipment and process performance, recommending and implementing modifications to improve productivity and quality. - Execute maintenance, repair, and upgrades for assigned equipment and modules to ensure consistent operational excellence. - Lead continuous improvement initiatives focused on enhancing safety, productivity, cost efficiency, and yield. - Develop and implement excursion prevention systems to detect and address discrepant materials or activities in equipment and processes. - Facilitate technology transfer to global manufacturing sites through training, audits, and documentation to ensure consistent processing across locations. - Oversee installation, conversion, and qualification of

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Safely identify, handle, and work with chemicals and associated hazards in the work area. Recognize and respond appropriately to safety alarms and events, including EES, fire alarms, MDA, and ERT notifications. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Department Introduction The Probe Area Manufacturing Engineering (AME) team supports semiconductor manufacturing through data-driven decision making, capacity planning, and continuous improvement initiatives. We collaborate closely with Operations, Industrial Engineering, Process Engineering, and Equipment Engineering to improve factory performance and operational excellence. Our team develops scalable systems, analytics, and business processes that enable manufacturing success. Position Overview The Manufacturing Engineering Intern will support projects focused on manufacturing analytics, process optimization, and operational improvement. This role provides hands-on experience applying Industrial Engineering principles within a fast-paced semiconductor manufacturing environment. The successful candidate will partner with engineers to develop insights, improve reporting solutions, and support data-driven decision making. Responsibilities Analyze manufacturing data and develop insights to improve factory performance. Develop dashboards and reporting solutions that support engineering and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview The Probe Equipment Engineering team is responsible for ensuring the performance, reliability, and continuous improvement of probe manufacturing equipment within Micron's semiconductor operations. The team partners closely with Manufacturing, Process Integration, Facilities, Quality, and Supplier Engineering organizations to support world-class operational excellence, equipment availability, and product quality while enabling advanced technology node development. Position Overview As a Probe Equipment Engineer at Micron Technology in Boise, Idaho, you will coordinate the installation, modification, upgrade, qualification, and advanced maintenance of manufacturing equipment. You will collaborate with cross-functional teams to increase tool availability, optimize equipment performance, and ensure manufacturing outputs meet or exceed quality standards. In this role, you will leverage data analytics, automation, AI, and machine learning technologies to improve equipment reliability, accelerate problem-solving, and drive manufacturing efficiency. Your work will help enable smarter factory operations and support Micron's continued advancement of AI-driven semiconductor manufacturing capabilities. Responsibilities Drive improvements in equipment availability, relia

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. As part of Micron’s historic investment in Boise, Idaho, we are building the future of semiconductor manufacturing with a new leading-edge DRAM fab and expanded manufacturing capabilities. About the Role As a Process Quality Engineer, you will drive the strategic direction of front-end wafer quality across the local site and Micron's global organization. You will support the development and execution of strategies that enable future technology requirements while ensuring robust contamination control across the fab environment. You will actively monitor, assess, and reduce airborne and surface contamination risks to protect wafer quality, yield, and reliability. Working closely with process, facilities, equipment, and integration teams, you will investigate contamination-related issues, implement corrective actions, and prevent recurrence. You will also evaluate contamination risks associated with new materials, processes, and technologies, ensuring effective controls are in place to support successful technology development and manufacturing. Additional responsibilities include, but are not limited to: Responsibilities may include (but not limited to) Support the development and execution of contamination control progr

Advanced Facilities operations Maintenance and Repair Process Technician Description - At HP, we exist to amaze. Through the people we hire, the experiences we enable, the way we treat our customers and each other—and ultimately through the technology we create. HP’s Corvallis site is a hybrid development and manufacturing factory, supporting advanced R&D, prototype manufacturing, and low‑volume production in a semiconductor cleanroom environment. Our technicians work on cutting‑edge equipment and processes that directly enable next‑generation printing and manufacturing technologies. Responsibilities The primary function of this role is the day-to-day operations and maintenance of the facilities equipment that supports business needs. Knowledge of RODI/IWW systems, chemical handling and delivery systems, troubleshooting and repair and maintenance of systems. Knowledge of operations and repair for chemical dispense systems that support fab wafer manufacturing. Willingness to be on call and wear full face respirators while performing chemical duties. Streamlines activities under common initiatives, managing achievements and touchpoints to ensure alignment and unity. Executes design work that consistently meets defined quality standards within specified timelines. Identifies team needs regarding processes, tools, documentation, and asset management, and drives necessary changes to enhance efficiency. Conducts design reviews of blocks with peers and management to demonstrate that designs meet specification targets and requirements. Develops design systems and standards that can scale across organizations and can be deployed across various global businesses. Collaborates with platform architects and systems groups to define overall specifications based on system requirements. Acts as the

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are seeking an experienced and motivated System IP RTL Design Lead to drive the definition and implementation of complex datacenter class IP for our next-generation semiconductor products. The ideal candidate possesses a deep understanding of System IP and SoC architecture, IP integration challenges, and is adept at leading a design team to deliver high-quality, scalable IP solutions. This role requires strong hands-on technical leadership, excellent communication skills, and a proven track record in the successful delivery of silicon IP. This role is hybrid, based out of Bangalore, India. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned IP / SoC design leader with 20+ yrs of strong expertise in complex SoC architectures, high-speed protocols, and large-scale IP integration. Skilled in RTL design and debug (Verilog/SystemVerilog) with hands-on experience using industry-standard tools for simulation, synthesis, lint, CDC, and power analysis on high-frequency designs. Experienced in driving microarchitecture decisions, authoring design specifications, and performing complex PPA trade-off optimizations. A proactive problem so

Overview: The Insights product is an offering for Guidepoint's institutional investment and corporate clients, now in its 9 th year, that offers teleconferences, surveys, in-person events, and AI-facilitated data and content. The teleconferences live in an online library portal, which covers a wide of industries/topics that enables our clients to make informed decisions. All content features experts from Guidepoint’s proprietary global network and is conceptualized and hosted by former investment professionals (i.e. hedge fund analysts), sell-side equity research analysts, and industry professionals. This is a hybrid position based in our New York City office. What you'll do: Monitor a coverage universe of public companies within the global hardware and semiconductor sector by tracking earnings releases, investor presentations, SEC filings, sell-side research and industry news. Create and moderate teleconferences on timely topics featuring an expert from Guidepoint’s network with the goal of producing actionable insights for clients. Attend industry conferences to host client panels What you have: Bachelor’s degree or Master’s degree Minimum 10 years of sell-side or buy-side analyst experience Must follow bottoms-up, fundamental approach to investment research focusing on individual companies Has covered the Hardware and Semiconductor sector; candidates must be current on company/industry knowledge Ability to work in a fast-paced entrepreneurial environment Outgoing personality with the ability to speak with people at all professional levels Intellectual curiosity and desire to learn Effective time management and organizational skills Demonstrated ability to work both individually and as part of a team What We Offer: The annual salary range for this position is $210,000-$230,000. Additionally, this position is eligible for an annual discretionary bonus based on performance. You will also be eligible for the following benefits: 15

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. Senior Emulation Engineer Location: India - Remote Job Description: At EnCharge AI, we are building the next generation of AI compute silicon — purpose-built for high-performance, low-power, and scalable AI inference. As an Emulation Engineer, you will play a critical role in validating complex AI accelerator architectures on emulation platforms before tape-out. This position is ideal for someone passionate about bridging the gap between hardware and software in fast-paced, deep tech environments. Responsibilities: • Set up and maintain Siemens Veloce emulation and prototyping platforms • Adapt SoC designs for Emulation and Prototyping • Develop and debug emulation testbenches and system-level environments • Support pre-silicon validation, power/performance analysis, and early software bring-up. Participate in silicon bring-up and validation. • Collaborate with design and verification teams to isolate design issues and accelerate debug. • Optimize performance of the emulation workloads and reduce turnaround time. • Work with firmware/software teams to enable use of emulators for OS and driver testing. Required Background: • BS/MS/Ph.D. in EE, CS, or related field with 7+ years of SoC design experience. • Experience with emulation platforms (Veloce, Palladium, or ZeBu) and FPGA-based prototyping systems (proFPGA, HAPS, or Protium) • Experience with emula