Semiconductor Principal Design Engineer Jobs

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Our Team as a STAFF ENGINEER, TDT PD CMP At Micron, we are driven by the pursuit of excellence and innovation. As a Chemical Mechanical Planarization (CMP) Process Development Engineer, you will play a key role on our Technology Development Taiwan (TDT) CMP team. You will contribute to the progress of our innovative DRAM technology. If you have a passion for semiconductor development and enjoy working in a dynamic and collaborative environment, we invite you to join us in defining the future of the semiconductor industry! Key Responsibilities Develop and refine CMP processes to support advanced DRAM technology acceleration. Collaborate with diverse teams to develop new outstanding semiconductor devices. Perform rigorous process characterization, develop new consumables, and evaluate new hardware. Conduct groundbreaking research and innovate to contribute to Micron’s extensive patent portfolio. Drive continuous process and efficiency improvements to meet yield, quality, and cycle time requirements. Direct and manage CMP consumables and equipment suppliers. Plan and complete well-designed experiments, presenting results in clear and concise reports. Minimum Qualifications Proficiency in both Chinese and English languages. Expertise in CMP process development. Hands-on experience with CMP polishing equipment, including familiarity with equipment operation, optical metrology, profilometry, common polishing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Expansion Program Integration & Readiness Engineer, you will build the future of Micron's global manufacturing by enabling the flawless delivery of strategic semiconductor expansion programs. This role uniquely positions you to bring diverse teams together, transforming ideas into operational capabilities that drive Micron's success! You will engage from early concept planning through factory startup and production ramp, influencing critical decisions to ensure that business objectives are achieved safely, efficiently, and predictably. You will collaborate with partners across Manufacturing, Facilities, Construction, Engineering, Supply Chain, Procurement, Finance, and Quality to solve complex challenges, drive continuous improvement, and build lasting business impact. This is an opportunity for a motivated leader who enjoys working across organizations, building positive relationships, and helping teams achieve ambitious goals. Responsibilities In your role as an Expansion Program Integration & Readiness Engineer, you will: Lead strategic expansion and readiness programs that enable future manufacturing growth. Partner with teams across the organization to deliver business-critical achievements and operational readiness objectives. Drive coordinated planning, risk management, issue resolution, and decision-making processes. Build alignment across multiple organizations while encouraging collaboration, tra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Expansion Program Integration & Readiness Engineer, you will build the future of Micron's global manufacturing by enabling the flawless delivery of strategic semiconductor expansion programs. This role uniquely positions you to bring diverse teams together, transforming ideas into operational capabilities that drive Micron's success! You will engage from early concept planning through factory startup and production ramp, influencing critical decisions to ensure that business objectives are achieved safely, efficiently, and predictably. You will collaborate with partners across Manufacturing, Facilities, Construction, Engineering, Supply Chain, Procurement, Finance, and Quality to solve complex challenges, drive continuous improvement, and build lasting business impact. This is an opportunity for a motivated leader who enjoys working across organizations, building positive relationships, and helping teams achieve ambitious goals. Responsibilities In your role as an Expansion Program Integration & Readiness Engineer, you will: Lead strategic expansion and readiness programs that enable future manufacturing growth. Partner with teams across the organization to deliver business-critical achievements and operational readiness objectives. Drive coordinated planning, risk management, issue resolution, and decision-making processes. Build alignment across multiple organizations while encouraging collaboration, tra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Engineer is responsible for leveraging area knowledge to optimize area performance and reduce cycle time. A Manufacturing Engineer collaborates with PD, ATE, PEE, ME and IE teams to expedite product movement and reacts to process issues that could impact quality. Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MRDA Defect Insight Engineering Scope : Data Analytics Yield correlation analysis Spatial signature analysis Defect density monitoring Process-health dashboards AI/ML model deployment with Agentic AI Predictive excursion detection Defect Management Defect inspection strategy development Inline defect monitoring Defect pareto analysis Defect source identification Yield detractor elimination Killer defect reduction Job requirements Bachelor's or Master's degree in Engineering or related discipline 0–2 years of experience in semiconductor manufacturing or engineering Basic knowledge of ASSY defect analysis for yield improvement Basic knowledge of SPC,FDC or data analysis tools, ie JMP...etc Utilizes baseline digital and AI capabilities appropriate to the role to responsibly leverage AI technologies for research, analytical insights, content generation, process improvement, problem resolution, and the achievement of business objectives. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​