Si Simulation Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design and conduct laboratory experiments for SI and PI characterization of Micron components (wafer-, package-, and board-level), providing feedback and guidance to simulation and design teams Provide EMI/EMC measurements, analysis, and mitigation guidance for Micron products and customer systems Improvement and development of internal measurement platforms and methodologies Communicate technical insights to application engineers, designers, other team members, and Micron customers Provide guidance on EMC procedures, techniques, and analysis to Micron Global Quality team members performing compliance measurements Use circuit and electromagnetic simulation tools for analysis and post processing Minimum Qualifications: · BS in EE or similar field with at least 3 years of relevant experience · Strong background in one or more areas of signal integrity, power integrity, EMI/EMC, RF engineering, antenna design, or other fields within applied electromagnetics · Experience with measurements utilizing spectrum analyzers, network analyzers, Time Domain Reflectometer (TDR), near field probes, RF wafer probes, TEM/GTEM cells, and anechoic chambers Preferred Qualifications: · Experience with programming (e.g. Python, Matlab) and scripting lan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The SSD Hardware Engineering team develops next-generation storage solutions that power data centers, AI infrastructure, client computing, and intelligent edge applications. Working across hardware, firmware, validation, manufacturing, and system engineering fields, the team delivers high-performance, reliable SSD products while using advanced design methodologies, automation, and AI-enabled engineering tools. As an SSD Hardware Engineering Intern, you will support the design, validation, characterization, and debug of next-generation SSD products. You will gain hands-on experience with high-speed hardware design, PCB development, signal integrity, power integrity, board bring-up, and hardware validation while collaborating with multi-functional engineering teams to solve complex technical challenges and deliver industry-leading storage solutions. Responsibilities Support the design, validation, characterization, and debug of SSD hardware platforms and subsystems. Assist with schematic reviews, PCB design activities, board bring-up, electrical measurements, and laboratory-based hardware testing. Perform data collection, analysis, and documentation of validation results to support product quality and performance objectives. Support signal integrity (SI), power integrity (PI), and system-level analysis through simulation, measurement, and correlation activities. Develop automation tools, scripts, dashboards, and AI-assisted workflows that improve engineering productivity, validation efficien

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE + 10 years or BSEE + 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Key Responsibilities: Lead first‑silicon bring‑up, board validation, and early silicon debug. Develop and complete detailed electrical characterization plans covering DC, AC, parametric, and functional measurements. Characterize high‑speed interfaces such as DDR/LPDDR, SerDes, MIPI, UFS, or custom Micron PHYs. Perform post‑silicon electrical characterization of ASIC/SoC/Memory products across process, voltage, and temperature (PVT) corners. Conduct lab measurements using equipment such as Oscilloscopes, BERTs, VNAs, Spectrum analyzers, Waveform generators, and support tools. Involve in Board design activities with team to gather and place custom requirements as per Chaz. Perform signal integrity (SI), power integrity (PI), Jitter, Eye‑diagram, and compliance testing. Debug silicon issues related to timing, noise, stability, margin loss, and functional failures. Analyze failures and recommend design, firmware, or test fixes. Develop Python/MATLAB-based automation for measurements, data collection, and analysis. Process large volumes of lab and silicon data to extract trends, margins, and correlations. Generate concise characterization reports with clear conclusions and recommendations. Work closely with design, pre‑silicon verification, product engineering, firmware, test, and systems teams. Correlate post‑silicon results with simulation and pre‑silicon expectations to identify root cau

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal IO/Clocking Design Engineer to be a part of our design team working on critical high-speed circuits common to all DRAM related memory products! In this position, you will be responsible for the development, design, optimization, verification, and fan out of these high-speed circuits to all DRAM related projects at Micron. You will work on equalization and bandwidth extension to push the speed limits of the circuit and process technology, analyze resulting IO impairments, clock jitter and duty error impact to DRAM system and timing budget, and develop effective engineering solutions. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor modeling teams on Micron's next groundbreaking process node. Minimum Qualifications: Minimum MSEE + 10 years or BSEE + 12 years of industry experience in analog and mixed-signal circuit design. Proficiency w

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead the design and development of cable assemblies and connectors for new products. Responsible for design concepts, 2D/3D design reviews, specifications, and DFM reviews for new cable assemblies and connectors. Define validation plans, oversee test execution, analyze results, and drive issue resolution. Perform PPAP for new cable assemblies and connectors. Analyze and troubleshoot design, manufacturing, quality, and reliability issues during development. Drive continuous improvements in performance, reliability, and scalability. Establish and maintain system workflow, documents, and processes to improve efficiency. Collaborate with global cross-functional teams, sourcing teams, and suppliers to achieve technical, quality, schedule, and cost objectives. Requirement Bachelor’s degree in Engineering is required. 5+ years of experience in cable assembly design and development, with in-depth knowledge of materials, technologies, and manufacturing processes. Hands-on experience in cable assembly architecture, material selection, mechanical design, and manufacturing processes. Proficient with 2D/3D CAD applications. (SolidWorks preferred) Strong knowledge of tolerance analysis, GD&T, and DFM. Familiarity with engineering analysis and simulation methods such as FEA, Moldflow, or SI. Experience with cable validation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry! Position Overview: We are searching for an HBM IO Design Architecture Engineer. This role will focus on HBM IO / TSV IO design and analysis including electrical modeling, Signal Integrity (SI) and Power Integrity (PI) analysis, and design optimization across the HBM development cycle. The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles. Responsibilities will include, but are not limited to: High-speed IO design architecture for HBM products Define and standardize IO design quality process from architecture to silicon Define IO architecture, TSV IO performance targets, and design quality requirements for future HBM products. Develop IO and TSV modeling methodologies to support architecture tradeoff analysis, SI/PI evaluation, and design optimization. Drive simulation-to-silicon correlation and post-silicon learning feedback to improve design quality across HBM product generations. Leverage AI Assisted analytics to accelerate root cause identification from comp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior/Staff Engineer, NAND Product Development in Non-Volatile Engineering (NVE) group at Micron Technology, Inc., you will be responsible for test flow development and testing strategies with emphasis on Test Chips for Micron’s pioneering 3D NAND memory. You will be collaborating with multiple teams like Test Solutions Engineering on test code development, Design Engineering on testmode implementation, and validating and debugging testmodes and test results via simulation and post silicon validation of the tests. Provide critical test solutions that will be used to screen the quality and reliability failures on Micron’s NAND products. Responsibilities: NAND Testchip test flow development and validation Run pre si Verilog (Digital) and Analog design simulations to verify testmodes. Define and improve post si testing methods to address new experimental designs, process or debug issues on devices manufactured at Micron’s R&D and Fab10 Manufacturing facilities Perform device characterization and electrical failure analysis (EFA) Collaborate with Test Solutions Engineering on test code development. Collaborate with Design Engineering on testmode implementation, pre si verification and post si validation of testmodes. Collaborate with Process Integration, yield engineering to improve overall die yield and meet the critical turning points planned for the Testchip. Leverage AI tools to automate the tools and workflow</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Signal Integrity (SI) Research & Development team enables the electrical performance of Micron's industry-leading memory and storage products, including DRAM, LPDRAM, NAND, HBM, SSDs, and emerging memory technologies. The team works across silicon, package, PCB, and system-level designs to develop high-speed signaling and power delivery solutions that support next-generation computing, AI, networking, automotive, mobile, and data center applications. As a Signal Integrity Engineer, you will support the design, analysis, and validation of high-speed memory interfaces and power distribution networks across Micron's product portfolio. Working alongside experienced engineers, you will use modeling, simulation, measurements, and AI-enabled workflows to evaluate signal and power integrity performance, support product development, and contribute to future technology and industry standards initiatives. Responsibilities Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities. Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across all stages of development. Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities. Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking an experience high-speed high-speed IO/Clocking Design Engineering at a Principal/Sr Member of Technical Staff (SMTS) level to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the architecture, design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop core strategy and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Define, innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation resu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor

Zoox is looking for a Senior Signal Integrity and EMC Engineer to ensure the electrical reliability, signal fidelity, and compliance of our complex autonomous vehicle systems. In this role, you will own the end-to-end strategy for vehicle-level signal integrity, RF/wireless performance, and EMC. You will work within a multi-disciplinary engineering team to set rigorous requirements and ensure best practices are implemented from concept to production. You will serve as the domain expert on a variety of high-speed digital and RF design topics that bring our hardware to life safely and reliably. In this role, you will: Lead the development, implementation, and validation of vehicle-level signal integrity, grounding, and shielding strategies. Maintain rigorous technical requirements and EMC specifications applied across all electrical and electronic systems on all vehicle platforms. Define and maintain vehicle-level RF performance requirements, establishing specifications for all transmitters, receivers, and antenna systems to mitigate the electromagnetic impacts of physical vehicle installation on wireless communication. Perform and/or oversee signal integrity and power integrity (SI/PI) simulations and analysis for critical high-speed interfaces and power distribution networks. Simulate RF performance of all antennas, transmitters, and receivers as installed in a vehicle during the vehicle design phase to drive integration alignment. Collaborate with cross-functional design teams to ensure best practices for signal integrity, RF design, and EMC are implemented. Lead design reviews to identify and remediate vulnerabilities early to meet project milestones. Develop and execute validation plans for vehicle-level signal integrity, RF/wireless performance, and EMC, including radiated and conducted emissions/immunity. Troubleshoot and resolve complex signal integrity, RF, and EMC issues discovered during design, validation, and

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Perform electrical validation for high-speed interfaces, including PCIe, Ethernet 10G/25G/100G/400G, DDR4/DDR5, SATA, and USB3. Perform signal validation for low-speed and control interfaces, such as I2C, SPI, MDIO, eMMC, GMII/RGMII, and related management buses. Execute signal quality measurements using oscilloscopes, BERT, network analyzers, and other signal analysis tools. Review and interpret electrical voltage, timing, jitter, eye diagram, and compliance requirements from IC vendors, interface standards, and internal design guidelines. Plan and execute power validation for multiphase power stages, DC/DC buck converters, PSU rails, and board-level power delivery networks. Perform power integrity validation, including ripple noise measurement, transient response, power sequencing, E-load testing, and PSU evaluation. Analyze SI/PI measurement results, identify potential root causes, and provide feedback to hardware design, layout, firmware, and vendor teams. Work with hardware and layout teams to define SI/PI validation plans, test coverage, test limits, and measurement methodologies. Generate validation reports to support project development stages, issue tracking, design reviews, and second-source verification. Develop and execute basic test scripts in Linux environments to support validation, automation, and