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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and AI-enabled technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology! Position Overview: As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Equipment Engineering Manager in the Process and Equipment Engineering team at Micron Technology, Inc., you will build a best-in-class team to drive manufacturing capability in a TD &#43; HVM environment and to scale in the newest Memory Fab in the United States! You will implement this by focusing on manufacturing performance optimization, ensuring priorities are aligned to Micron business plan and/or Strategic Objective requirements across manufacturing sites. Your objective is to use global internal and external resources to define and enable equipment, yield, and output performance to achieve world-class manufacturing results. This role involves establishing a proficient team of equipment engineers, recruiting and training shift technicians and engineers alongside the Manufacturing Engineering team, and jointly setting performance targets. This position requires collaborating with Technology Development, Process & Equipment Engineering, Manufacturing Engineering, Facilities as well as our global network of manufacturing sites. You must support effective collaboration across all geographies and departments, and external suppliers as well as international travel, as required. Responsibilities: Lead an engineering team to achieve area goals, including improving equipment performance and installing new tools for a new fab Develop the team’s strategic direction, allocate resources effectively, and maintain succession plans for key positions Drive fab optimization to maximize output an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products. Position Overview: As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making. Responsibilities: Lead technical integration projects for new memory and advanced packaging technologies Design and complete experiments to assess process performance, variability, reliability, and yield Solve complex integration issues using data from

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Signal Integrity (SI) Research & Development team enables the electrical performance of Micron's industry-leading memory and storage products, including DRAM, LPDRAM, NAND, HBM, SSDs, and emerging memory technologies. The team works across silicon, package, PCB, and system-level designs to develop high-speed signaling and power delivery solutions that support next-generation computing, AI, networking, automotive, mobile, and data center applications. As a Signal Integrity Engineer, you will support the design, analysis, and validation of high-speed memory interfaces and power distribution networks across Micron's product portfolio. Working alongside experienced engineers, you will use modeling, simulation, measurements, and AI-enabled workflows to evaluate signal and power integrity performance, support product development, and contribute to future technology and industry standards initiatives. Responsibilities Support signal integrity and power integrity analysis for high-speed memory interfaces and power distribution networks through modeling, simulation, measurement, and correlation activities. Collaborate with silicon, package, product, validation, and system engineering teams to ensure product electrical performance across all stages of development. Develop and evaluate die, package, PCB, and system-level models to identify performance risks and optimization opportunities. Apply AI-enabled tools and agentic workflows to improve engineering efficiency, automate analysis, improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Our Team Our team builds and enables scalable, cloud-native software platforms that power critical manufacturing and business operations. We use modern full stack engineering practices and AI-driven technologies to create innovative solutions that improve automation, decision making, and operational efficiency. Position Overview We are seeking an AI-Centric Full Stack Software Engineer to design, build, and support modern software solutions with a strong focus on AI-enabled applications and intelligent automation. This role goes beyond simply using AI coding assistants. You will have strong understanding of Prompt Engineering, Vibe Coding, Rework Rate Reduction and leverage Custom Agents, and integrations built around the Model Context Protocol (MCP). You will apply strong software engineering fundamentals to assemble, integrate, and operationalize AI capabilities into real production systems being accountable for Full-Stack solutions. The goal of this role is to significantly shorten development and feedback cycles by automating routine engineering work, augmenting human decision-making, and embedding intelligence directly into our development workflows and the applications we deliver! Responsibilities Design, develop, test, deploy, and maintain scalable full stack applications and platform services. Own software solutions end-to-end, including system design, architecture, implementation, testing, observability, deployment, and lifecycle support. Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Our Team Our team builds and enables scalable, cloud-native software platforms that power critical manufacturing and business operations. We use modern full stack engineering practices and AI-driven technologies to create innovative solutions that improve automation, decision making, and operational efficiency. Position Overview We are seeking an AI-Centric Full Stack Software Engineer to design, build, and support modern software solutions with a strong focus on AI-enabled applications and intelligent automation. This role goes beyond simply using AI coding assistants. You will have strong understanding of Prompt Engineering, Vibe Coding, Rework Rate Reduction and leverage Custom Agents, and integrations built around the Model Context Protocol (MCP). You will apply strong software engineering fundamentals to assemble, integrate, and operationalize AI capabilities into real production systems being accountable for Full-Stack solutions. The goal of this role is to significantly shorten development and feedback cycles by automating routine engineering work, augmenting human decision-making, and embedding intelligence directly into our development workflows and the applications we deliver! Responsibilities Design, develop, test, deploy, and maintain scalable full stack applications and platform services. Own software solutions end-to-end, including system design, architecture, implementation, testing, observability, deployment, and lifecycle support. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Platform Engineer An individual contributor who will serve as a hands-on technical member of the SMAI Platform Engineering team. In this role, you will help build, operate, and maintain the platforms that power Micron's analytics and AI workloads. You will contribute to platform reliability and scalability through day-to-day engineering, collaborative problem solving, and close partnership with solution architects, project teams, and multi-functional partners. Responsibilities: Collaborate with global platform teams, customers, partners, and vendors to deliver effective technical solutions. Know the latest platform roadmaps, emerging technologies, and new service offerings; evaluate and recommend adoption opportunities. Partner with solution architects to design, implement, and optimize solutions across IaaS, PaaS, SaaS, and Infrastructure as Code (Terraform). Document findings, operational procedures, guidelines, and reusable patterns while providing feedback to vendors and internal teams. Deliver high-quality platform support by managing customer requests, maintaining service standards, and implementing controlled platform adjustments. Monitor platform performance, observability, costs, and resource utilization to identify optimization opportunities and improve reliability. Collaborate with multi-functional teams to ensure seamless operations, scalable architectures, and automation, including AI-driven business solutions. Implement and m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Customer Engineering organization serves as the primary technical interface for our global customers and helps ensure that Micron solutions are seamlessly integrated into next-generation technology platforms. Our team coordinates deep engineering engagements, technical product qualifications, and architecture reviews to secure design wins and grow market share. We are dedicated to providing world-class technical support that accelerates revenue and builds long-term strategic partnerships with our customers. Role Description: The Field Applications Engineer - Associate plays a vital role in achieving the technical achievements needed to launch products. You will be an important member of our field engineering team. In this position, you will oversee many end-to-end technical tasks, including sophisticated product sample deployments, lifecycle management, addressing technical questions, and other customer interactions. You should adopt an &#34;automation-first&#34; approach to actively find ways to improve processes and apply AI-based workflows in daily operations when possible. This role can lead to a full-time FAE career for individuals who achieve the right results. It also requires demonstrating the right skills and behaviors. Example Responsibilities: Coordinate the entire process of tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Global Facilities Tool Installation team leads the planning, development, construction, and operation of Micron’s worldwide manufacturing network. This team drives major global programs that integrate engineering innovation, sustainability, and operational excellence to enable advanced semiconductor manufacturing. As a Principal Program Manager, you will play a critical role in guiding global Facilities Tool Installation (TI) programs, partnering with multi-functional and international teams, and ensuring execution aligns with best-known methods and strategic objectives. This position is ideal for a highly experienced professional with a strong facilities and greenfield construction background who thrives in complex, fast-paced environments and excels at collaboration, data-driven decision-making, and continuous improvement. Responsibilities Lead U.S. Facilities Tool Installation efforts for new fab startups and greenfield expansions, including planning and development of Tool Install User Requirement Specifications (TI-URS). Partner with Global Procurement and site teams on TI RFPs, supporting contracting strategies, bid evaluations, cost modeling, and execution timelines. Ensure global project readiness by coordinating material planning, labor strategies, construction interfaces, and risk identification/issues. Develop and maintain installation benchmarks to find opportunities for cycle-time reduction and critical path optimization. Define and implement global TI stra

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron's DRAM organization focuses on designing and developing industry leading dynamic random access memory products. These teams drive R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. Our Process Integration team is at the center of advancing next‑generation memory technology. We work closely across engineering, manufacturing, and change management to turn data into action and keep programs moving forward. If you enjoy solving complex problems and seeing your impact on real products, you’ll find a home here! We’re hiring a Senior Process Integration Technician to partner with Module Engineers and help drive day-to-day execution. This role is essential to keeping experiments, conversions, and production priorities on track through strong coordination and clear communication. You’ll play a hands‑on role in data analysis, issue resolutions, and cross‑functional alignment to support key technology milestones. Responsibilities Collaborate with cross-functional teams to interpret and complete conversions for assigned PI Engineering Module. Serve as the primary point of contact for experiment coordination, conversion activities, and lot movement logistics. Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a Design Engineer, you will contribute to the design and analysis of digital and analog circuits used in memory technologies. You will collaborate with global, multi-functional engineering teams to optimize product performance, manufacturability, cost, and time-to-market while supporting end-to-end product development and validation. Responsibilities Design, simulate, and optimize memory circuits, including layout development and verification using industry-standard tools (e.g., SPICE, Verilog) Develop schematic blocks such as memory arrays, control logic, datapaths, address decoders, and internal test logic Analyze design trade-offs across power, speed, die size, and manufacturability to improve overall product performance Collaborate with Product Engineering, Test, Process Integration, Assembly, and Marketing teams to ensure robust and scalable designs Apply AI-enabled tools and methodologies to improve circuit design efficiency, simulation accuracy, and overall design flow optimization Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher Foundational understanding of memory architectures, circuit design, and semiconductor device behavior Experienc